Memory

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SATA SSD Products incorporating NVMSentry firmware

SATA SSD Products incorporating NVMSentry firmware
SMART Modular Technologies has announced the introduction of the ME1 and ME2 Series SATA Solid State Drive (SSD) products. The new ME1 and ME2 Series are the first SATA SSD products incorporating SMART Modular's proprietary NVMSentry firmware.
15th January 2020

Mouser inks pact with non-volatile memory supplier

Mouser inks pact with non-volatile memory supplier
Mouser Electronics has agreed a distribution deal and partnership with GigaDevice, a provider of non-volatile memory solutions. As part of the agreement, Mouser Electronics is now an authorised distributor of GigaDevice SPI NOR, SPI NAND, and parallel NAND flash memory devices that are ideal for embedded applications such as automotive, consumer electronics, Internet of Things (IoT), industrial and mobile devices.
14th January 2020

Memory subsystem solution for next-generation AI training chip

Memory subsystem solution for next-generation AI training chip
Rambus has announced that Enflame (Suiyuan) Technology has selected Rambus HBM2 PHY and Memory Controller IP for its next-generation AI training chip. Rambus memory interface IP enables the development of high-performance, next-generation hardware for leading-edge AI applications.
13th January 2020


NAND Flash to lead all others as IC market growth returns in 2020

NAND Flash to lead all others as IC market growth returns in 2020
IC Insights is in the process of revising its forecast and analysis of the IC industry and will present its new findings in The McClean Report 2020, which will be released in January 2020. Among the revisions is a complete update of forecast growth rates of the 33 main product categories classified by the World Semiconductor Trade Statistics organisation (WSTS) through the year 2024. The top five categories for IC product growth are covered in this bulletin.
17th December 2019

Paving the way to extreme scaling for logic and memory transistors

Paving the way to extreme scaling for logic and memory transistors
At this year’s IEEE International Electron Devices Meeting, imec, reported an in-depth study of scaled transistors with MoS2 and demonstrated best device performance to date for such materials. MoS2 is a 2D material, meaning that it can be grown in stable form with nearly atomic thickness and atomic precision. Imec synthesised the material down to monolayer (0.6nm thickness) and fabricated devices with scaled contact and channel length, as small as 13nm and 30nm respectively.
16th December 2019

Utilising novel split-gate technology to boost bit density

Utilising novel split-gate technology to boost bit density
KIOXIA Europe has announced the development of the first three-dimensional (3D) semicircular split-gate flash memory cell structure 'Twin BiCS FLASH' using specially designed semicircular Floating Gate (FG) cells. Twin BiCS FLASH achieves programme slope and a larger programme/erase window at a much smaller cell size compared to conventional circular Charge Trap (CT) cells.
16th December 2019

NVMe data storage solution targets high performance computing

NVMe data storage solution targets high performance computing
Aldec has launched a powerful, versatile and time-saving FPGA-based NVMe Data Storage solution to aid in the development of High Performance Computing (HPC) applications such as High Frequency Trading and Machine Learning.
16th December 2019

Samples released for ECC DRAM product line

Samples released for ECC DRAM product line
Four years after bringing the first DRAM with on-chip ECC in DDR1, DDR2 and DDR3 technologies to the market, Intelligent Memory is expanding the product line again adding a new series of LPDDR4(X) memory components with integrated ECC error-correction capability.
13th December 2019

SO-DIMM modules with or without ECC in range of temperatures

SO-DIMM modules with or without ECC in range of temperatures
Memphis Electronic has announced that it is now sampling 32GB DDR4 modules for industrial applications. Many of today’s CPUs are designed to support up to 32GB of unbuffered DDR4 per available UDIMM or SO-DIMM slot, until now, such high density modules have been rarely available on the market. 
12th December 2019

Enabling MCUs to explore e-AI solutions

Enabling MCUs to explore e-AI solutions
Renesas Electronics has implemented Macronix’s dedicated OctaBus to support Macronix 8 I/O octaflash Memory MX25UW51245G, octaram and octamcp products on the Renesas RZ/A2M group of high-end Arm-based microprocessors (MPUs) and its evaluation boards for high-speed processing of e-AI imaging in smart appliances, service robots, and industrial machinery.
10th December 2019


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