Memory

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Toshiba Memory to rebrand as 'Kioxia' in October 2019

Toshiba Memory to rebrand as 'Kioxia' in October 2019
Toshiba Memory Europe has announced that it will officially change its name to Kioxia Europe on 1st October, 2019. The name Kioxia (kee-ox-ee-uh) will be adopted for the names of all Toshiba Memory companies, largely effective on the same date. Kioxia is a combination of the Japanese word 'kioku' meaning 'memory' and the Greek word 'axia' meaning 'value'. Merging 'memory' with 'value', Kioxia represents the company’s mission to uplift the world with 'memory', which forms the foundation of the company’s vision.
18th July 2019

Flash memory devices to reduce production costs and time to market

Flash memory devices to reduce production costs and time to market
Microchip has announced the introduction of the SST26VF Serial Quad I/O (SQI) 3V Flash family, according to the company, it is the industry’s first NOR Flash devices tooffer integrated MAC address options. Pre-programmed with EUI-48 and EUI-64 addresses, the devices do not have a minimum order requirement, providing cost effective, plug-and-play storage solutions for connected applications that use Ethernet, Bluetooth, WiFi, IEEE 802.15.4 and FireWire.
15th July 2019

The importance of storage in the factory of the future

The importance of storage in the factory of the future
‘Factories of the future’ (FoF) is the European Union’s €1.15bn public private partnership for advanced manufacturing and production. It is the collaborative integration of Information Communicational Technology (ICT) and Automation Technology (AT) that has shifted the diverse manufacturing landscape. 
11th July 2019


Highly scalable module based on the latest embedded processors

Highly scalable module based on the latest embedded processors
Kontron has introduced the new SMARC-sXAL4 module. The module is available with either Intel Atom, Intel Pentium or Intel Celeron processors of the latest generation. With dimensions of only 82x50mm, it can be used flexibly, and the E2 version is designed for use in an extended temperature range from -40 to +85°C.
9th July 2019

New processing-in-memory technology for next-gen AI chips

New processing-in-memory technology for next-gen AI chips
Renesas has announced it has developed an AI accelerator that performs CNN (Convolutional Neural Network) processing at high speeds and low power to move towards the next generation of Renesas embedded AI (e-AI), which will accelerate increased intelligence of endpoint devices. A Renesas test chip featuring this accelerator has achieved the power efficiency of 8.8 TOPS/W (Note 1), which according to the company, is the industry's highest class of power efficiency.
4th July 2019

Applications are driving the long-term growth of memory

Applications are driving the long-term growth of memory
Despite some cyclicality and seasonality, the stand-alone memory market has experienced extraordinary growth over the past decade. This has been driven by important megatrends, such as mobility, cloud computing, AI, and IoT.
3rd July 2019

Accelerated roll-out of 5G CPE modems with multi-chip package

Accelerated roll-out of 5G CPE modems with multi-chip package
Winbond Electronics has announced the launch of a new 1.8V 2Gb+2Gb NAND Flash and LPDDR4x memory product in a compact 8.0x9.5x0.8mm multi-chip package (MCP). The new W71NW20KK1KW product, combines robust Single Level Cell (SLC) NAND Flash and high-speed, low-power LPDDR4x memory.
1st July 2019

How to use serial EEPROM memory for storing data

Using the Arduino Platform and basic coding, in this video from Digi-Key, Robin shows how it possible to store data on a serial EEPROM memory chip with the I2C serial bus. 
25th June 2019

Ceramic hermetic DDR2 memory available for space

Ceramic hermetic DDR2 memory available for space
Data Device Corporation (DDC) has introduced what is believed to be the first CCGA Rad-Hard DDR2 SDRAM for space applications, the latest addition to DDC's wide range of high density space grade ceramic hermetic memories, spanning Flash (NAND/NOR), SDRAM, SRAM and EEPROM solutions.
25th June 2019

Driving up NAND flash capacities to support the data-driven future

Driving up NAND flash capacities to support the data-driven future
Data is interwoven into the fabric of our lives, regardless of how much or little we personally interact with the digital world. Successful, reliable and long-term data storage ensures that everything, from massive data centres and AI platforms down to menial wireless sensors and even our kitchen appliances, continue to function around us. And it is flash silicon-based memory technology that is increasingly being chosen to make this possible.
20th June 2019


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Girls in Tech | Catalyst | 2019
4th September 2019
United Kingdom The Brewery, London
DSEI 2019
10th September 2019
United Kingdom EXCEL, London
EMO Hannover 2019
16th September 2019
Germany Hannover
Women in Tech Festival 2019
17th September 2019
United Kingdom The Brewery, London
European Microwave Week 2019
29th September 2019
France Porte De Versailles Paris