Memory

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Is any memory card suitable for industrial applications?

Is any memory card suitable for industrial applications?
Since their introduction in the 1990s, memory cards have remained among the most successful, trusted and low-cost storage solutions available. Consumer memory cards are cheap and commonly used to store images, videos, audio and text in portable devices such as cameras and smartphones.
15th August 2019

Flash management software supports non-volatile memories

Flash management software supports non-volatile memories
HCC Embedded (HCC) has announced its collaboration with Adesto Technologies to support the new Adesto FusionHD serial flash technology. HCC’s field-proven file system products use the features of FusionHD devices to significantly improve performance and data retention, reliability, and battery life of smart IoT devices.
15th August 2019

Secure data storage for NVIDIA’s autonomous driving platforms

Secure data storage for NVIDIA’s autonomous driving platforms
Macronix International has announced that Macronix’s ArmorFlash memory is being utilised on the NVIDIA DRIVE AGX Xavier and DRIVE AGX Pegasus autonomous vehicle computing platforms. ArmorFlash brings secure, quality, and longevity of supply data storage to the demanding, competitive market for artificial intelligence (AI)-based Level 2+ advanced driver assistance systems (ADAS) through Level 5 autonomous driving (AD) solutions.
8th August 2019


New RM5 series of value SAS SSDs approved for vSAN 6.7 customers

New RM5 series of value SAS SSDs approved for vSAN 6.7 customers
Toshiba Memory Europe has announced that a VMware vSAN 6.7 certification has been earned for its RM5 Series of value SAS SSDs running on HPE ProLiant Gen10 servers. The 12 gigabits per second (Gb/s) RM5 Series with VMware vSAN 6.7 and VMware ESXi 6.7 certification is now listed in the VMware Compatibility Guide and available through the same channels in which HPE ProLiant servers are sold.
8th August 2019

FPGA-based NVMe accelerators to include EDSFF

FPGA-based NVMe accelerators to include EDSFF
BittWare, a Molex Company, has announced a strategic investment and collaboration with Eideticom. The BittWare Computational Storage portfolio adheres to industry standard PCIe, U.2 and EDSFF form factors.
8th August 2019

Compact dual-die memory chip supports NXP

Compact dual-die memory chip supports NXP
Winbond Electronics has announced that its SpiStack dual-die NOR+NAND code storage product has been included on NXP Semiconductors FRWY-LS1012A board for use with its Layerscape LS1012A communications processor.
7th August 2019

Serial memory controller for data centre computing

Serial memory controller for data centre computing
As the computational demands of artificial intelligence (AI) and machine learning workloads accelerate, traditional parallel attached DRAM memory has presented a major roadblock for next-generation CPUs, which require an increased number of memory channels to deliver more memory bandwidth.
7th August 2019

Enhancing system architecture implementation for AI applications

Enhancing system architecture implementation for AI applications
As artificial intelligence (AI) processing moves from the cloud to the edge of the network, battery powered and deeply embedded devices are challenged to perform AI functions, like computer vision and voice recognition. Microchip Technology, via its Silicon Storage Technology (SST) subsidiary, is addressing this challenge.
7th August 2019

Differential DIMM at Flash Memory Summit

Differential DIMM at Flash Memory Summit
SMART Modular Technologies has announced that it is showcasing its Open Memory Interface (OMI) DDR4 Differential DIMM (DDIMM) at this week’s 2019 Flash Memory Summit in Santa Clara, California. SMART Modular joined a growing roster of technology organisations (in August) contributing to the OpenCAPI Consortium, working collaboratively to drive data centre server innovation.
7th August 2019

High capacity NVMe Solid State Drives available in 2280 form factor

High capacity NVMe Solid State Drives available in 2280 form factor
Greenliant has started sampling its NVMe M.2 ArmourDrive Solid State Drive (SSD) modules to customers requiring high performance, high capacity removable data storage that can withstand extreme environments. The new industrial temperature (-40°C to +85°C) 88 PX Series NVMe M.2 ArmourDrive SSDs use 3-bits-per-cell (TLC) 3D NAND flash memory and are built in the widely used 2242 and 2280 form factors.
6th August 2019


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