Memory chips offer end-to-end security for IoT devices
The family of certified TrustME Secure Flash memory chips from Winbond Electronics has been extended with the W77Q series which targets IoT and smart connected consumer and industrial devices.
Low profile 32GB industrial Mini-DIMMs launched
SMART Modular Technologies has announced its lineup of DDR4-3200 32GB Low Profile industrial Mini-DIMMs. SMART has several new 32GB Mini-DIMMs which include ULP (Ultra Low Profile) and VLP (Very Low Profile) with registered and unbuffered ECC options to meet a wide range of use cases.
Embedded flash memory devices boost 5G applications
KIOXIA Europe (formerly Toshiba Memory Europe) has announced that it has started sampling Universal Flash Storage (UFS) Ver. 3.1 embedded flash memory devices.
SRAM, DRAM firm pledges embedded world attendance
Alliance Memory has confirmed it will be attending embedded world 2020 in Nuremberg (February 25-27) to exhibit its SRAMs, DRAMs and flash memory ICs for legacy and new designs.
Duo collaborate to deliver Flash-to-Cloud security
NanoLock Security has announced it is joining with Adesto Technologies to collaborate on flash-based embedded security and management solutions for low density flash memory devices used in products such as smart meters, sensors and controllers in smart energy, water utilities, industrial facilities and more.
HyperRAM 2.0 memory solutions for automotive applications
Cypress’ HypeRAM 2.0 memory is designed for automotive, industrial, and IoT applications.
Non-volatile memory for growing demand
The demand for non-volatile memory is largely due to the continuous development of mobile devices, which require more and more memory capacity. This particularly applies to cameras, smartphones, tablets or cameras. Growing market expectations propel the ongoing improvement of non-volatile memory manufacturing technologies.
Rugged blade processor brings increased memory
VadaTech has announced the ATC128, a high performance ATCA blade processor featuring dual 24 core Intel Xeon processors, each with six banks of memory providing up to a total of 384 GB DDR4 memory with ECC.
3D flash memory provides new design flexibility
A fifth-generation BiCS FLASH three-dimensional (3D) flash memory featuring a 112-layer vertically stacked structure has been successfully developed by KIOXIA Europe. The company has plans to start shipping samples of the new device, which has a 512 gigabit (64 gigabytes) capacity with 3-bit-per-cell (triple-level cell, TLC) technology, for specific applications in the first quarter of the calendar year 2020.
F-RAMs range boast no-delay data write
The Excelon range of advanced ferroelectric RAM (F-RAM) devices from Cypress Semiconductor is now in stock at distributor RS Components. An energy efficient non-volatile memory, Excelon offers fast write speeds with no delay, and an effectively unlimited lifespan.