Memory

With the introduction of the PV140-25, Apacer offer a fast U.2 form factor solid-state drive (SSD), which is fully compatible with both PCIe GEn3x4 interface and NVMe 1.3 requirements. Thanks to a powerful PCIe controller, the PV140-25 achieves up to 574,000/266,000 and 3,340/1,175 MB/s in IOPS and sequential read/write.

SMART Modular Technologies has expanded its support for data centre networking applications with the introduction of DuraMemory high-density, very low profile DIMMs and Mini-DIMMs for hyperscale network switching. These products are suited for maximising network bandwidth and reliability, which is critical to data centre networking requirements.

Innodisk’s new-patented blockchain technology brings to its latest SSD solution ‘InnoBTSTM SSD’ and alleviates these concerns through sophisticated use of digital signature and blockchain that is fully software independent.

SMART Modular Technologies has expanded its DuraFlash ME2 SATA SSD product family with the addition of M.2 2242 SATA, mSATA (MO-300A) and Slim SATA (MO-297A) that complement the current M.2 2280 and 2.5” SSD form factors in SMART’s DuraFlash portfolio.

Micron Technology has announced updates to the company’s portfolio strategy to further strengthen its focus on memory and storage innovations for the data centre. Micron will increase investment in new memory products that leverage the Compute Express Link (CXL), the recently introduced industry standard interface that enables flexible connection between compute, memory and storage.

Infineon Technologies has announced the availability of its second-generation non-volatile SRAMs (nvSRAM). The new generation of devices are qualified for QML-Q and high-reliability industrial specifications to support demanding non-volatile code storage and data-logging applications in harsh environments, including aerospace and industrial applications.

Magnachip Semiconductor has announced that it has released a new low-dropout (LDO) linear regulator featuring an ultra-fast transient response for a Universal Flash Storage (UFS)-based Multi-Chip Package (MCP).

Mouser Electronics, and Avalanche Technology, a developer of next-generation magneto-resistive random-access memory (MRAM) technology have signed a global distribution agreement.

Farnell has strengthened its memory and storage solutions portfolio by signing an international distribution agreement with Micron Technology.

Apacer has announced that it is promoting the DDR5 eco-chain alliance and outlining the development blueprint for a full DDR5 memory module product line, covering four major categories: server, industrial, consumer and gaming.