Memory

KIOXIA Europe has announced it will be expanding its Kitakami Plant site in Iwate Prefecture, Japan to further increase production capacity of its proprietary 3D Flash memory BiCS FLASH. The 136,000 square metre area adjacent to the current site will create room for the future construction of the company's 'K2' manufacturing facility, with site preparation work to commence in spring of 2021 and be completed by spring of 2022.

TYAN introduced its latest cloud and storage server platforms powered by 2nd Gen AMD EPYC processors, which target modern data centres and enterprise markets, at SC20 virtual event in November.

In response to the rising demand for robust boot drives and removable data storage in the proven CFast form factor, Swissbit has launched its latest memory card F-800 product series. Featuring high-quality SLC-NAND flash memory chips and the very latest controller firmware, F-800 offers maximum performance, durability, and reliability as memory for embedded systems and industrial applications.

Swissbit has announced that it has extended the availability of its SLC-based SD memory cards, microSD memory cards and CompactFlash cards. The new product series S-250(u) and C-350 deploy the same product architecture as the previous S-200(u) and C-300 products.

Xilinx and Samsung Electronics have  announced the availability of the Samsung SmartSSD Computational Storage Drive (CSD). Powered by Xilinx FPGAs, the SmartSSD CSD is an adaptable computational storage platform providing the performance, customisation, and scalability required by data-intensive applications.

Micron Technology has begun volume shipments of its 176-layer 3D NAND flash memory, achieving density and performance. Together, Micron’s new 176-layer technology and advanced architecture enables gains in application performance across a range of storage use cases spanning data centre, intelligent edge and mobile devices.

The fourth industrial revolution is being fueled by data and machine learning, and is defined by the digital transformation of factories through the convergence of Information Technology (IT) and Operational Technology (OT) at scale. Dubbed ‘Industry 4.0’, it has already empowered many factories to become 'smarter' through real time monitoring, AI-driven decision making, autonomous manufacturing, and even predicting market demand.

Winbond Electronics has announced that its W75F, a Secure Flash memory device with Common Criteria EAL5+ certificate, has now achieved the ISO26262 ASIL Grade D safety certification. For automotive market, the W75F Secure Memory is compliant with the AEC-Q100 and is now officially certified ASIL-D.

KIOXIA Europe, the European-based subsidiary of KIOXIA Corporation, has announced the construction of a fabrication facility (Fab7) at Yokkaichi Plant in Mie Prefecture, Japan to expand production of its proprietary 3D flash memory BiCS FLASHTM. The construction of KIOXIA Corporation’s Fab7 facility is expected to commence in the spring of 2021.

Swissbit has announced that it will showcase robust and durable flash memory solutions for industrial applications at electronica virtual 2020, from November 9th to 12th, 2020 under the headline ‘Endurance with 3D-NAND’ with its Embedded IoT Solutions division exhibiting hardware-based security solutions designed to protect data and devices in Internet of Things applications.