What are the DDR5 design challenges?
Changes in DDR5 have introduced a number of design considerations dealing with higher speeds and lower voltages – raising a new round of signal integrity challenges. Designers will need to ensure that motherboards and DIMMs can handle the higher signal speeds. When performing system-level simulations, signal integrity at all DRAM locations need to be checked.
Miniaturised PCIe M.2 BGA SSD for ultra-small application
Swissbit has launched EN-20, a new single chip solution which offers high speed PCIe SSD performance in a 3.2cm² BGA SDD package. The device acts as a true industrial grade SSD with up to 480GB capacity and 4 lane PCIe 3.1 / NVMe 1.3 specification.
Persistent memory provides DRAM alternative
Mouser Electronics is now stocking Intel Optane persistent memory, which offers an Intel affordable alternative to DRAM with significantly increased capacity of up to 512 GBytes.
Apacer announces tiny industrial-grade PCIe BGA SSD
Apacer has announced a tiny industrial-grade PCIe BGA SSD, adding another strong series to its high-speed PCIe SSD product line.
Advantech SQ Manager for memory remote monitoring
Advantech has announced the release of a comprehensive new software solution package: ‘SQ Manager’ for SQFlash SSD and SQRAM memory products. This package includes utilities to monitor the real-time status of SQFlash and SQRAM products both locally and remotely and to manage security features of SQFlash products.
SSD benefits from Microsoft Azure sphere
Featuring end-to-end security from edge to the cloud, the Innodisk InnoAGE SSD comes with a Microsoft Azure Sphere inside and is integrated with Innodisk’s customised firmware, software, and hardware technology.
Mentor and Samsung streamline in-fab memory testing
Mentor, a Siemens business, has announced it has collaborated with Samsung Foundry to develop a new reference kit designed to help mutual customers substantially simplify and streamline the testing, diagnosis and repair of in-fab memory in advanced systems-on-chip (SoCs) during fabrication.
Next-gen NVMeTM SSD form factor for cloud data centres
KIOXIA Europe has developed and started shipment of engineering samples of next-generation Enterprise & Datacentre SSD Form Factor (EDSFF) E3.S, and which is being standardised by the SNIA SFF TA Technical Work Group. E3.S is a new form factor standard for NVMe SSDs in cloud and enterprise data centres, especially targeting PCIe 5.0 and beyond.
Power efficiency added to low power embedded controller
Renesas has expanded its RE Family lineup of embedded controllers with a new ultra-low power consumption member based on Renesas’ Silicon-On-Thin-Buried-Oxide (SOTB) process technology and built around the Arm Cortex-M0+ core. The newest member of the RE01 Group lineup is a 256KB flash memory variant in addition to the 1.5MB flash memory embedded controller, already in mass production.
Imec overcomes fundamental operation challenge for MRAMs
At the 2020 Symposia on VLSI Technology and Circuits, imec presented a deterministic write scheme for voltage-controlled magnetic anisotropy (VCMA) magnetic random access memories (MRAMs), obviating the need for pre-reading the device before writing.