Ultra-high performance OctaBus flash memory for MCU
Macronix has announced that STMicroelectronics (ST) is using Macronix OctaBus flash memory for several STM32 microcontroller (MCU) platforms, including the STM32H72x/73x, STM32L5 and the recently announced STM32U5. Macronix’s MX25 OctaBus family is providing the high-performance memory on select STM32 Discovery Kits and Evaluation Boards.
Thin 1TB Ver 3.1 UFS embedded flash memory device
KIOXIA Europe has announced sampling of its 1 terabyte (TB) Universal Flash Storage (UFS) Ver. 3.1 embedded flash memory devices. Housed in a 1.1mm-high package, the new product utilises KIOXIA’s BiCS FLASH 3D flash memory and achieves sequential read speed of up to 2,050MB/sec and sequential write speed of up to 1,200MB/sec.
Choosing Flash storage for harsh environments
Flash memory has become the favoured non-volatile bulk storage medium for embedded applications for good reasons. Flash memory is compact, provides long-term reliable data storage that, if the right form is chosen, is able to operate over a wide temperature range and handle conditions such as shock and vibration more readily than rotating disk media. By Victor Tsai, Director of Flash Products, SMART Modular Technologies
External SSDs deliver performance and portability
Crucial, Micron’s global consumer brand of memory and storage, has launched an expansion of its portable solid-state drive (SSD) portfolio to offer consumers more options for external storage performance, capacity and value at any price point. The new products include the high-capacity 4TB portable SSDat an SRP of $489.95, and a new 500GB portable SSD for an SRP of $69.95.
SMART Modular launches DDR5 module family
SMART Modular Technologies has announced the launch of its DDR5 module family of products, supporting the industry’s transition to the new higher-performing, more efficient memory technology. With the meteoric growth in data creation, DDR5 is designed to provide increased memory bandwidth and performance to help process data across various application segments including HPC, AI, and edge computing.
New fabrication facility to support 3D flash memory production
KIOXIA Corporation held a ceremony for its semiconductor fabrication facility (Fab7) at Yokkaichi Plant in Mie Prefecture, Japan. According to the company, the facility will be one of the most advanced manufacturing operations in the world, dedicated to the production of its proprietary 3D flash memory BiCS FLASH. The first phase of construction is scheduled to be completed by the spring of 2022.
Ultra-large capacity, DDR5 and PCIe at embedded world
Apacer has announced that it will once again participate in embedded world 2021 from March 1st to 5th. Due to the COVID-19 pandemic, this year's conference only a digital exhibition will be presented. Apacer will display a variety of products for defense applications, rugged applications, cloud applications, information security protection and so on.
Partnership announces 6th-generation 3D flash memory
KIOXIA and Western Digital have announced that the companies have developed their sixth-generation, 162-layer 3D flash memory technology. Marking the next milestone in the companies’ 20-year joint-venture partnership, this is the companies’ highest density and most advanced 3D flash memory technology to date, utilising a wide range of technology and manufacturing innovations.
AI driving the need for all-flash object storage
Digital business initiatives like automation and artificial intelligence demand high-performance and massive capacity storage. In turn, this is driving adoption of on-premises all-flash object storage to provide customers’ top need —comprehensive data protection at scale. That’s according to a new research paper released today from Enterprise Strategy Group and Scality, the object storage pioneer. The full report, The Digital Er...
Alliance Memory adds legacy Micron NOR flash
Alliance Memory says it is now an authorised reseller for additional legacy NOR Flash devices from Micron Technology.