Indium will showcase the following selections from its array of high-performance metal TIM solutions:
Heat-Spring HSx
- Newest pattern designed for large area dies with warpage >200 microns
- Effective thermal conductivity of 16W/m-K at only 20psi with pure indium
- Designed for test heads where clamping forces are limited to <30psi
- Thickness ranging from 300 micron up to 1mm
- Available with or without a diffusion barrier to prevent staining of the die
Heat-Spring HSD
- The original and best standard option for interfaces with flat, smooth, and parallel surfaces
- Designed for interfaces with tight surface control >30psi
Heat-Spring High Profile Preforms
- Patterned to optimise contact with non-planar surfaces delivering 86W/mK
- Ideal for assemblies with an extruded, unfinished heat-sink
- Recommended for immersion cooling and burn-in applications
- Provides uniform contact between the burn-in head and the DUT
- Provides more uniform thermal conductivity
Heat-Spring HSK
- Recommended specifically for burn-in applications where multiple insertions are required
- Provides uniform contact with low resistance for high-density heat loads
- Typically clad with a thin diffusion barrier, which serves as the contact surface for burn-in and test applications
- No staining or cracking
