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Indium highlights Au die-attach preforms at SPIE Photonics

22nd January 2025
Sheryl Miles
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Indium Corporation will feature its high-reliability, Au-based precision die-attach preforms for critical laser and RF applications at SPIE Photonics West, 28–30 January 2025, in San Francisco, California. SPIE West is one of the world’s premier events for lasers, biomedical optics, biophotonic technologies, quantum, and optoelectronics.

Indium will showcase the following products:

AuLTRA Precision Die-Attach Preforms offer the company’s new Gold Standard – the highest level of quality available to deliver the best performance possible in critical, high-reliability die-attach applications.

Features include:

  • Highly accurate thickness control
  • Precise edge quality
  • Optimised cleanliness
  • Default waffle pack method
  • Available for gold-based alloys

AuLTRA 75 is an off-eutectic AuSn preform solution (75Au/25Sn) designed to improve intermetallic reliability in applications using a die with a thicker gold plating, such as a GaN die used for high-frequency, high-power RF power amplifier devices for 5G and other critical military and aerospace wireless communications. AuLTRA 75 helps improve the operation of these critical technologies by adjusting the final solder joint composition and improving wetting and voiding. The AuLTRA 75 product line also comes in 78Au/22Sn and 79Au/21Sn compositions.

AuLTRA ThInFORMS are 0.00035"-thick (0.00889mm or 8.89μm) 80Au/20Sn preforms that improve the overall operational efficiency of high-output lasers. AuLTRA ThInFORMS help combat common issues such as shorting and poor thermal transfer.

AuLTRA Fine Ribbon is the company’s Indalloy182 fine-grade precision ribbon for high-volume, fully automated laser diode assembly processes. For these auto-feed systems, the precision and high quality of the ribbon and spooling are of the utmost importance along with long, continuous lengths. These features help minimise production downtime and facilitate an efficient, high-throughput process resulting in a high-quality end product and low cost of ownership.

AuLTRA 3.2 is an air or nitrogen reflow, water-soluble AuSn solder paste, optimised to handle the elevated processing temperatures of gold-based alloys. Perfect for high-power LED module array assemblies, it ensures consistent and repeatable printing performance, featuring a long stencil life and excellent tack. Along with consistently meeting printing and reflow demands, AuLTRA 3.2 delivers superb wetting and low voiding.

Heat-Spring is a compressible, non-reflow metal TIM ideal for TIM2 applications. These indium-containing TIMs offer superior thermal conductivity over non-metals, with pure indium metal delivering 86W/mK in all planes. Because of its sold metal state, Heat-Spring avoids pump-out and bake-out problems. It also offers a sustainable solution due to the company’s indium reclaim and recycle programme.

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