Now established in UV curing, UV LED technology will find growth opportunities in disinfection and purification by 2017/2018, says Yole Développement in its market analysis entitled UV LED - Technology, Manufacturing and Application Trends. Yole reviews the UV lamp business and its current transition to UV LED, with industry players confirming interest in cheaper, more compact technology.

The market for performance gyroscopes and Inertial Measurement Units (IMUs) has changed in recent years, says Yole Développement. In its latest MEMS & sensors analysis, titled High-End Gyroscopes, Accelerometers and IMUs for Defense, Aerospace & Industrial, Yole asserts that defense & aerospace applications drive the market but MEMS innovations are bringing momentum to the commercial aerospace and industrial sect...

The first International Forum on Sapphire Market & Technologies has been announced. Organised by Yole and CIOE, the one-day event is scheduled to take place on 3rd September 2015, in Shenzhen, alongside the 17th China International Optoelectronic Expo 2015.

According to a report published by Yole Développement (Yole), the CMOS Image Sensor (CIS) market is expected to grow at a CAGR of 10.6%, reaching $16.2bn by 2020. In the report, titled ‘Status of the CMOS Image Sensor Industry, 2015 Edition’, the company discuss the way in which the automotive, medical and surveillance sectors are driving the market and technology efforts of existing and new players.

According to Yole Développement, Wide Band Gap (WBG) technologies are almost ready to be used by power electronics integrators. The question is how? Industry players have identified many module packaging challenges. Yole has analysed their insights, and is now presenting an overview of the issues.

According to Yole Développement, the technological choice between STTMRAM/MRAM and RRAM will be made in the next two years. In its report, titled 'Emerging Non Volatile Memory (NVM) Technology & Market Trends', the company describes why and how emerging NVM technologies will be increasingly used in industrial and transportation, enterprise storage, wearables, mobiles devices, mass storage and MCU smart cards. 

Initially focused on the military market, uncooled thermal camera sales have grown significantly due to cost reduction of micro bolometers and growing adoption in commercial markets. The market research and strategy consulting company, Yole Développement confirmed this growth last July, announcing +25% CAGR between 2014 and 2019 in its infrared imaging report, ‘Uncooled Infrared Imaging Technology & Market’.

According to Yole Développement, 3D TSV integration has already been adopted in MEMS and CMOS Image Sensors for consumer applications. Device makers such as Sony, Toshiba, Omnivision, Samsung, Bosch Sensortec, STMicroelectronics and mCube have all brought devices to the market that integrate 3D TSV technology.

According to Yole Développement, both the compute (DDR3/DDR4) and mobile varieties (LPDDR3/LPDDR4) of DDR memory will reach the end of their respective journeys soon, as the DDR interface reportedly cannot run at data rates higher than 3.2Gb/s in a traditional computer main memory environment. Several DRAM memory architectures based on 3D layer stacking and Through-Silicon-Via (TSV) have evolved to carry memory technology forward...

In its latest report, ‘Technologies & Sensors for the Internet of Things’, Yole Développement states that “The most important added value IoT solutions will come from the process of generating data”. IoT, according to Yole’s analysts, comprises hardware, cloud and data processing, gathering multiple applications from sectors including industrial sensors, wearable electronics and home automation.

Combo sensors continue their growth in a market expected to reach $1.4bn in 2019, overcoming discrete sensors. Yole Développement proposes a deep analysis of the inertial combos for consumer application, with its report, '6&9 Axis Sensors Consumer Inertial Combos'. According to Yole’s analysis, cellphones and tablets still drive the market but wearables will soon take their place in the landscape.

Yole Développement has identified a growing interest for thin film PZT in the semiconductor industry, due to its very promising piezoelectric properties. For example, Epson has released its second generation inkjet head based on thin film PZT for small office applications, proving the maturity of the technology.

The EV/HEV supply chain is evolving and power electronic module manufacturing attracts more and more companies, car makers, modules suppliers, chip makers... to develop their own expertise, announces Yole Développement, in its latest report 'Power Electronics in Electric and Hybrid Vehicles'. Industrials develop innovative technologies at the substrate, integration and packaging levels, to enhance power module performance and push the EV/H...

A report has been released by Yole Développement which discusses the direct impact of investments, mergers and acquisitions on the solid-state medical image sensor market. The report, titled 'Solid State Medical Imaging: X-ray and Endoscopy', revealed that the medical imaging market is evolving slowly, with 2.1 million units in 2013.

The combination of cost reduction and advanced packaging technologies such as Flip Chip and Chip Scale Package, is changing the LED industry landscape, especially its supply chain, says Yole Developpement in an update to its technology and market analysis, LED Packaging Technology & Market Trends.

The 2014 Advanced Packaging & Integration Technology Symposium, organised by NCAP China (National Center for Advanced Packaging) and Yole Développement, was successfully held. Yole is particularly interested in the advanced packaging industry in Greater China and would like to ensure business positioning and increase it's existing network in this geographic area.

Silicon Carbide (SiC) propagates over all industrial segments, announces Yole Développement. Power factor corrector (PFC), photovoltaic inverter, motor control … and more represented a $100 million business in 2013.

“The last months have been very active in term of mergers and acquisitions in the CMOS image sensor (CIS) business”, comments Yole Développement (Yole)...

The LED packaging industry is moving toward further cost reduction and new technologies including Flip Chip and Chip Scale Package (CSP), says Yole Développement in its latest report on packaging for LED: LED Packaging Technology and Market Trends 2014. These market and technology trends directly impact the LED & advanced packaging industry and its supply chain, especially at the material and equipment levels: whereas the equipment mar...

Apple has announced that its 4.7 and 5.5” iPhone 6 and iPhone 6 plus will both feature a traditional ion-exchange strengthened glass display cover. Sapphire remains in the camera lens cover and the touch ID sensor, features that were already present on the iPhone5s. Yole Développement believes that technical and manufacturing issues in the supply chain have prevented Apple from using sapphire as the display cover in this year's iPhon...