NCAP China & Yole collaborative event is a success

The growth of the packaging industry, the challenges it is facing and ways in which these challenges are being addressed were discussed at the event. 48 organisations participated in the event, 52% of which were executives and 70% Chinese. The symposium's programme featured 12 industrial presentations and a panel session covering the advanced packaging industry, its main technologies and the manufacturing readiness of future platforms and trends.

Through the symposium, NCAP China and Yole aimed to present the status of the advanced packaging industry and it's developments. Such developments included interposers, 3D integration technologies, sensors, related MEMS packages and manufacturing processes. Experts from the industry discussed these topics. Due to the symposium's success, NCAP and Yole will be holding the event annually.

Dongkai Shangguan, CEO, NCAP, said: “Collaborative innovation across the supply chain is necessary for the development and commercialisation of advanced packaging technologies in the industry. NCAP will continue to partner with OEM’s and IC design houses, as well as foundries, OSATs, and equipment and materials suppliers, to develop total solutions in order to address the future technological needs of the packaging industry. We are forming several industry consortia around certain critical technical areas, and we welcome the active participation of our partners from the industry.”