Report discusses commercial avenues for IoT

Emerging from several different markets, the IoT industry is worth many billions of dollars. The array of relevant technologies available in the present or near future is immense, bringing potential for significant business opportunities.

Yole will be part of the 3D Architectures for Semiconductor Integration and Packing (3D ASIP) conference taking place from 10^th to 12^th December in Burlingame, California. During the conference, Rozalia Beica, CTO & Business Director, Advanced Packaging & Semiconductor Manufacturing, Yole, will present her company's vision of the ‘IoT bubble’ with a presentation entitled ‘The Internet of Things, from hardware to cloud and data processing though heterogeneous integration’ on 11^th December at 10:15am.

Beica will detail the market drivers, IoT applications and technologies involved, as well as the market structure, giving key figures and main players. Yole’s CTO will also highlight sensor adoption and integrated sensor developments.

3D ASIP is firmly established as the leading industry event in 3D integration and packaging. This conference presents a broad, yet thorough perspective on the technology & market opportunities and challenges offered by building devices and systems in the vertical dimension. 3D ASIP conference provides participants the unique opportunity to gain the latest technology and market insights on 3D integration and packaging efforts, and technology and industry trends impacting this dynamic arena. 3D ASIP targets senior-level technologists, managers and executives as speakers and attendees from leading companies and organisations from around the world, and strives to serve the needs of the entire 3D supply chain, from technology developers to equipment and materials suppliers to designers, manufacturers and end users.

“IoT promises to transform our environment and render it smart,” commented Beica. “Several sensing solutions are already available in different fields, however, strong challenges are still ahead of us, such as development of sensing, low cost and highly integrated solutions, protocols and standards as well as addressing privacy and security concerns.”