Tensilica Articles

Displaying 21 - 40 of 139
30th July 2012
Tensilica Joins Wi-Fi Alliance offering Wide DSP Family to Bolster Wireless Multi-Standard Modem Solutions

Tensilica has revealed that it has joined the Wi-Fi Alliance. Tensilica also has leading customers using the Tensilica dataplane processors for some of the older Wi-Fi standards. Now Tensilica plans to integrate Wi-Fi with its multi-standard radio capabilities. Several of Tensilica's DPUs are ideal for Wi-Fi, including the popular ConnX D2 and the BBE DSP product family.

22nd June 2012
Tensilica Doubles DSP Shipments, Ranks Second in DSP IP Market According to The Linley Group

Tensilica, Inc. today announced that it is now ranked second in shipments of chips containing DSP IP cores for 2011 by The Linley Group. Tensilica attributes this growth to its focus on dataplane signal processing and strong unit volumes in smart phones, home entertainment, and communications LTE infrastructure. Shipments of devices with Tensilica DSP cores roughly doubled from 2010 to 2011.

8th May 2012
Tensilica and VWorks Partner to Provide Virtual Prototyping Platforms

Tensilica and VWorks today announced a partnership to provide virtual platforms based on Tensilica’s Xtensa dataplane processors (DPUs), dramatically reducing customers' embedded software development time.

24th April 2012
Tensilica Adds Support for Dynamic Resolution Adaptation Audio Standard to HiFi Audio DSP Library

Tensilica Inc. today announced that it has added support for the Dynamic Resolution Adaptation (DRA) standard to its library of over 100 audio encoders, decoders and sound enhancement packages for its popular HiFi Audio DSP (digital signal processor) family.

17th April 2012
Tensilica’s ConnX BBE16 DSP IP Core for Digital Baseband Signal Processing Licensed to Renesas Electronics

Tensilica, Inc. today announced that the ConnX BBE16 DSP (digital signal processing) IP (intellectual property) core has been licensed to Renesas Electronics Corporation for upcoming products for digital TVs.

27th February 2012
Arkamys Audio Enhancement Software and Services Being Ported To Tensilica's HiFi Audio DSPs

Tensilica Inc. and Arkamys today announced that Arkamys digital audio software currently is being ported on Tensilica's HiFi Audio DSPs. This set of software is complemented with the availability of audio design and tuning services. Now designers of products for professional entertainment, digital content companies, and the consumer electronics industry - including mobile phones, tablets, MP3 players, car audio and home theaters - can use Arkamys...

21st February 2012
Tensilica Lays the Foundation for Software Programmable LTE-Advanced User Equipment PHY (Layer 1) in Less than 200mW

After great success in the LTE (Long-Term Evolution) handset baseband market, Tensilica, Inc. today announced that it is driving the transition to LTE-Advanced and has already secured lead customers for its new product – the ConnX BBE32UE DSP (digital signal processor) IP core for baseband SOC (system-on-chip) designs.

11th January 2012
Tensilica’s HiFi 3 DSP IP Core Provides Over 1.5x Better Performance for Audio Post Processing and Voice in Smartphones and Home Entertainment

Tensilica,Inc. today announced the HiFi 3 audio/voice DSP (digital signal processor) IP (intellectual property) core for SOC (system-on-chip) design. This fourth-generation audio DSP offers higher performance with lower power for high-performance audio post-processing and voice processing algorithms used in smartphone and home entertainment systems and expands Tensilica’s market-leading HiFi architecture to quad 24/32-bits. Tensilica has alre...

4th January 2012
Tensilica Showcases Latest Customer Innovations in Smartphones, DTV, and Other Consumer Electronics Equipment at CES 2012

Tensilica, Inc. today announced that it will showcase innovations from customers that use the company’s dataplane processors (DPUs) in digital televisions (DTVs), Blu-ray Disc players, 4G handsets and data cards, and more at the 2012 Consumer Electronics Show (CES). For this show, Tensilica has doubled its space in the meeting room area of the South Hall of the Las Vegas Convention Center and will be located at meeting room MP25166.

15th November 2011
Skyviia Chooses Tensilica's HiFi Audio DS

Tensilica has announced that Skyviia Corporation has selected the HiFi Audio DSP core for its next-generation multimedia SOC (system-on-chip) designs. Tensilica's HiFi Audio DSP is the most popular audio DSP core on the market and is licensed by five of the top 10 semiconductor companies and many leading system OEMs.

28th October 2011
enVerv Selects Tensilica for Power Line Communications for Smart Grid

Tensilica has announced that EnVerv has licensed cores from the ConnX DSP (digital signal processors) family for use in a power line communications system-on-chip chip design for smart grid applications. Tensilica’s ConnX DSPs are low-power, customizable dataplane processors (DPUs) that deliver outstanding performance on compiled C code, without the need for assembly code optimization.

12th October 2011
IntegrIT’s DSP Math Library Now Available for Tensilica’s Baseband DSPs

Tensilica, Inc. today announced that the NatureDSP Math Library from IntegrIT DSP Design House, a leading supplier of DSP (digital signal processing) software solutions, is now available for Tensilica’s ConnX BBE16 baseband DSP for system-on-chip (SOC) design.

27th September 2011
Fraunhofer IIS Becomes Tensilica Authorised Design Centre Partner

Tensilica, Inc. announced that Fraunhofer IIS, has joined Tensilica's Xtensions partner network and become an authorised design centre. Fraunhofer IIS will support mutual customers with their audio-related SOC (system-on-chip) designs.

8th June 2011
Tensilica Licensees Ship One Billionth IP Core, Projected to Reach Two Billion Cores in 2012

Tensilica announced that it reached a milestone in May 2011 with the production of over one billion Tensilica DPUs (dataplane processor units). Tensilica's licensees are currently shipping at a run rate exceeding 500 million Tensilica DPUs per year, and Tensilica projects its customers will hit the two billion cumulative shipment mark by the end of 2012 - a doubling in volume in just 18 months.

23rd May 2011
New Tensilica IP Core Targeted to Dataplane and Signal Processing Functions Such as Imaging, Communications and Networking, Boost Data Bandwidth 4X

Tensilica, Inc. has announced that it is extending its leadership in IP cores for compute-intensive dataplane and DSP functions such as imaging, video, networking and baseband wired/wireless communications. Any application that requires extensive data processing will significantly benefit from the breakthrough features - particularly those that quadruple data bandwidth - built into Tensilica's new Xtensa LX4 dataplane processor (DPU) for SOCs (s...

27th April 2011
Tensilica - First IP DSP Core Supplier to Offer DTS Broadcast and DTS DMP Support

Tensilica announced that it is the first audio IP core supplier to be awarded DTS Broadcast and DTS DMP (Digital Media Player) certification. The certification, achieved using fully optimized software implementation on Tensilica's HiFi 2 and HiFi EP Audio DSP (digital signal processor) IP cores, provides developers of SOCs (system on chips) with a proven solution that reduces the time to market for new, fully compliant designs. Tensilica was als...

29th March 2011
Tensilica IP Cores Targeted to Dataplane and Signal Processing Functions Such as Imaging, Communications and Networking, Boost Data Bandwidth 4X

Tensilica announced that it is extending its leadership in IP (intellectual property) cores for compute-intensive dataplane and DSP (digital signal processor) functions such as imaging, video, networking and baseband wired/wireless communications.

7th February 2011
Tensilica Showcases 4G LTE Baseband DSP IP Cores at MWC 2011

Tensilica should stand out at this year's Mobile World Congress (MWC) in Barcelona, February 14-18, 2011, as it has moved into the number one position as the supplier of baseband DSP (digital signal processors) IP (intellectual property) cores for the new generation of 4G LTE (Long Term Evolution) equipment. Eight of the top 15 LTE chipset manufacturers are working with Tensilica's cores for their designs.

7th February 2011
Tensilica Announces ConnX BBE64-128 - the World's Highest Performance DSP IP Core for LTE Advanced

Tensilica extended its BaseBand Engine (BBE) family with the ConnX BBE64-128 - the next-generation architecture for DSP (digital signal processor) IP (intellectual property) cores for SOC (system-on-chip) design. The ConnX BBE64-128 provides over 100 GigaMACs performance in 28nm high-performance process technology, easily outperforming all other DSP IP cores on the market. The ConnX BBE64-128 was designed to meet the performance requirements for ...

7th February 2011
Tensilica Announces Availability of Atlas Reference Architecture Dataplane Processors for a Complete Baseband PHY for LTE, HSPA+ and WiMAX

Tensilica announced that all the optimized programmable DPUs (dataplane processing units) of its Atlas Reference Architecture are now available for customer evaluation. The Atlas Reference Architecture uses the Tensilica ConnX BBE16 baseband DSP (digital signal processor) core coupled with three function-specific dataplane processor cores (DPUs) to allow the baseband PHY (physical layer) SOC (system-on-chip) developer to create a very low power a...

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