Analysis
Tensilica Showcases 4G LTE Baseband DSP IP Cores at MWC 2011
Tensilica should stand out at this year's Mobile World Congress (MWC) in Barcelona, February 14-18, 2011, as it has moved into the number one position as the supplier of baseband DSP (digital signal processors) IP (intellectual property) cores for the new generation of 4G LTE (Long Term Evolution) equipment. Eight of the top 15 LTE chipset manufacturers are working with Tensilica's cores for their designs.
TensTensilica has jumped to the number one position in baseband DSP IP cores for LTE because they provide the widest range of solutions for mobile handsets and wireless basestations. They've been able to get these products to market quickly by utilizing their customizable DPU technology, stated Will Strauss, president of Forward Concepts and leading DSP analyst. And the new BBE64 DSP family they're introducing today will be a major step forward to meet the even greater needs of LTE Advanced.
Impressive Demos at Tensilica's Booth
Tensilica will be showing the following products at their booth, number 1F39 in Hall 1:
- The laptop LTE data card designed for NTT DOCOMO's rollout of LTE in Japan.
- The base station on-a-chip designed by DesignArt Networks for LTE.
- A comprehensive demonstration of an LTE link showing H.264 video transmit/receive running on Tensilica cores and the mimoOn LTE software.
- Multiple systems using Tensilica HiFi Audio IP cores. Tensilica audio is designed into a large number of Tier 1 smartphones.
Product Spotlight
APV1111GVY
Panasonic
Panasonic PhotoMOS® Photovoltaic MOSFET High-Power Drivers
| SKU: | |
|---|---|
| Stock: | 3490 |
| Cost: | $3.95 |
Upcoming Events
8th August 2024
China 1st and 2nd Floor, Area A, China Import and Export Fair Complex
