Tensilica’s primary focus at CES is on its HiFi Audio DSP, the clear market leader among licensable audio DSP IP cores. Among Tensilica’s demonstrations will be:
– Fujitsu’s F-12C Smartphone with integrated HiFi Audio, including “SuperHAKKIRI VOICE (extra-clear voice) 3,” which enhances the clarity of the caller’s voice in noisy or crowded places, and “PITTARI VOICE (exact voice),” which adjusts the phone’s audio to the proper volume based on the user’s body movements when walking or running.
– Samsung’s BD-C6900 3D Blu-ray Disc™ player with HiFi Audio.
– Several HD radios with Tensilica’s HiFi Audio.
– Samsung’s UN55D700 55” LCD TV with Tensilica’s HiFi Audio.
– An FPGA-based demonstration of Tensilica’s soon-to-be-announced next generation audio technology.
Tensilica will also showcase the NTT DOCOMO’s 4G LTE silicon, based on Tensilica’s DPUs. Fujitsu’s LTE datacards, the F-05D ArrowsX smartphone, and Arrows Tablet LTE F-01D have already hit the market and more new products are expected at the show.
“Tensilica, with over 1.5 billion cores shipped to date, is becoming the dominant player providing efficient programmability for dataplane signal processing with a wide range of DPUs ranging from micro control/signal processing to the highest performance merchant DSP core,” stated Jack Guedj, Tensilica’s president and CEO. “We want to encourage anyone interested in getting the maximum ‘Wow’ in their products, with the best features, performance and power/area efficiency, to come see us at CES.”