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Rambus Articles

Displaying 1 - 20 of 34
Cyber Security
15th January 2024
ETAS and Rambus: automotive cyber security collaboration

As the automotive industry leans towards software-enabled autonomous, connected, and electric vehicles, cyber security is emerging as a new benchmark of quality.

28th December 2023
Rambus announces DDR5 RCD availability

Available now from Rambus is its Gen4 DDR5 Registering Clock Driver (RCD) that began sampling to the major DDR5 memory module (RDIMM) manufacturers in the fourth quarter of 2023.

Cyber Security
23rd August 2023
Rambus safeguards accelerated computing

Rambus, a premier chip and silicon IP provider making data faster and safer, has announced a full suite of Security IP solutions for the FPGA market with state-of-the-art cryptographic, side-channel, and Quantum Safe protections.

30th September 2022
Series 9 – Episode 6 – The security challenges of autonomous vehicles

Paige West talks with Neeraj Paliwal, GM of Security IP at Rambus about autonomous vehicles and security.

1st February 2021
Can chiplets maintain the momentum of IC design?

When Rambus was founded 30 years ago, RAM cost $98 per megabyte, and the latest Intel processor, the 80486, had 1.2 million transistors and was fabricated on a 1µm process. In comparison, in September 2020, RAM cost $0.0028 per megabyte, and the latest Nvidia A100 AI processor has 54 billion transistors and is fabricated on a 7nm process. Gary Bronner, Senior Vice President of Rambus Labs, explains more.

1st December 2020
IPsec Packet Engine secures 5G networking at 10Gbps

Rambus has announced the availability of a high-performance IPsec Packet Engine with integrated DPDK and companion key negotiation toolkit capable of securing 5G network traffic at data rates from one to 10Gbps. A complete IPsec solution, the packet engine can be easily integrated into SoCs for a broad range of 5G devices from base stations and cloud, to gateways and end devices.

15th September 2020
Rambus advances HBM2E performance to 4.0 Gbps

Rambus has announced it has achieved a 4Gbps performance with the Rambus HBM2E memory interface solution consisting of a fully-integrated PHY and controller. Paired with the industry’s fastest HBM2E DRAM from SK hynix operating at 3.6 Gbps, the solution can deliver 460 GB/s of bandwidth from a single HBM2E device.

11th August 2020
What changes in DDR4 vs DDR5 DIMMs?

The top six most significant specification advances made in the transition from DDR4 to DDR5 DIMMs are shown in Table 1 below.

11th August 2020
What are the DDR5 design challenges?

Changes in DDR5 have introduced a number of design considerations dealing with higher speeds and lower voltages – raising a new round of signal integrity challenges. Designers will need to ensure that motherboards and DIMMs can handle the higher signal speeds. When performing system-level simulations, signal integrity at all DRAM locations need to be checked.

18th June 2020
Rambus Delivers 112G XSR/USR PHY for chiplets

Rambus has expanded its portfolio of high-speed interface IP on TSMC’s 7nm process with the addition of its silicon-demonstrated 112G XSR/USR PHY. Offering unmatched power and area efficiency for next-generation applications, the 112G XSR/USR PHY is a critical enabler of chiplet and CPO architectures for data centre, networking, 5G, HPC and AI/ML applications.

Cyber Security
12th June 2020
Rambus CryptoManager for enhanced security

Rambus has announced the CryptoManager Root of Trust RT-640 and RT-645 cores have been certified ASIL-B and ASIL-D ready, respectively. These automotive-grade secure co-processor IP safeguards SoCs in V2X communications, ADAS, ECU platform management, infotainment and other critical vehicle systems.

18th May 2020
Pushing the envelope for ADAS with advanced memory technologies

Driver assistance systems such as cruise control are now part of the standard specification in a modern vehicle. ADAS Level-2 (L2), partial automation, and the first Level-3 (L3) conditional automation systems are in the market, but the journey to full automation still has some years to go. Here, Frank Ferro, Senior Director of Product Marketing for IP cores at Rambus explains.

Cyber Security
1st May 2020
800G MACsec solution for 5G infrastructure security

Rambus has announced its 800G MACsec (Media Access Control security) solution for next-generation networking infrastructure. The 800G MACsec solution delivers hardware-based, point-to-point security for 800 Gigabit Ethernet links and is a critical element of end-to-end network security.

2nd April 2020
Complete interface solution for HBM2E memory launched

Rambus has announced a comprehensive interface solution for HBM2E memory consisting of co-verified PHY and memory controller. Operating at a top speed of 3.2 Gbps over a 1024-bit wide interface, the interface can deliver 410 GB/s of bandwidth with a single HBM2E DRAM stack.

13th January 2020
Memory subsystem solution for next-generation AI training chip

Rambus has announced that Enflame (Suiyuan) Technology has selected Rambus HBM2 PHY and Memory Controller IP for its next-generation AI training chip. Rambus memory interface IP enables the development of high-performance, next-generation hardware for leading-edge AI applications.

18th November 2019
Portfolio of advanced memory and SerDes PHYs on TSMC N7 process

Rambus has announced a broad portfolio of high-speed memory and SerDes PHYs for next-generation applications on TSMC’s industry-leading N7 process technology. Rambus offers GDDR6, HBM2 and 112G LR PHY IP available for licensing, these solutions enable demanding applications for data centre, networking, wireless 5G, HPC, ADAS, AI and ML.

15th October 2019
Advancing AI with faster memory systems

Steven Woo of Rambus explains some of the challenges to closing the AI memory gap. Over the last 15 years the use of artificial intelligence (AI) techniques has boomed. We now carry AI assistants in our pockets, trust algorithms to provide image recognition in autonomous vehicles and use machine learning to predict the spread of disease. The development of these modern AI applications has only come about because of advances in AI algorithms,...

30th September 2019
Leading-edge 7nm process node for PPA

Rambus has announced the tapeout of its 112G XSR SerDes PHY on a 7nm process node optimised for PPA. As the industry continues to adopt chiplet architectures for networking and compute applications, the Rambus 112G XSR SerDes PHY represents the latest advancement in high-speed signalling technology for die-to-die (D2D) and die-to-optical engine (D2OE) connections.

15th May 2019
Securing systems: Four top tips for design engineers

Scott Best, Technical Director of Anti-Counterfeiting Products, Rambus, explains the role of cryptographic ICs. As system counterfeiting attacks continue to send shockwaves across industries, design engineers are evaluating how best to deploy cryptographic authentication integrated circuits (ICs) to secure systems. While there is no shortage of options available, in reality many of these solutions provide very poor levels of additional secur...

17th April 2019
Power efficiency for SoCs in data-intensive applications

The newest portfolio solution of 112G Long Reach (LR) SerDes PHY on a leading-edge 7nm process node for next-generation terabit switches, routers, optical transport networks (OTNs), and high-performance networking equipment, has been announced by Rambus.

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