Master Bond announced the release of EP42HT-2FG, a new food grade epoxy system. EP42HT-2FG has been independently tested and certified by a leading national laboratory to meet the stringent requirements of FDA CFR 175.300. It also was toxicologically evaluated to meet the NSF/ANSI 51.4.1 (2009) standard for food equipment materials.

Formulated with a special blend of polymeric and inorganic materials, Master Bond EP30LTE-LO features unparalleled dimensional stability and sets new standards of performance for bonding, sealing, casting and coating applications in the aerospace, electrical, electronic, chemical, optical, and computer industries. This two component epoxy combines outstanding performance with a very low thermal expansion coefficient, a significant breakthrough fr...

For demanding applications where highly flexible, impact resistant bonds are required, Master Bond developed Polymer System EP37-3FLF.

For applications demanding exceptional chemical resistance, especially to acids, fuels, and oils, Master Bond has developed EP21AR. Whether coating, lining, bonding or sealing, this two-component epoxy can withstand harsh, acidic environments, including prolonged immersion in 96-98% sulfuric acid and 36% hydrochloric acid for over a year.

Master Bond EP21TDCS-LO is an electrically conductive silver-filled epoxy that passes ASTM 595 for NASA low outgassing specifications. It is widely used for demanding applications in the electronic, electrical, computer, semiconductor, aerospace and optical industries.

Formulated for structural applications in extreme environments with temperatures from -80°F to +425°F, Master Bond Supreme 33 has superior resistance to thermal cycling, thermal shock and impact. This toughened, two-component epoxy offers high structural bond strength to a wide variety of substrates including metals, glass, ceramics, wood, vulcanized rubbers and many plastics. Supreme 33 also resists chemicals including water, oil and many orga...

Through heat dissipation, thermally conductive adhesives and potting compounds play a pivotal role in the protection of today's electronic circuitry.

Master Bond has developed a highly thermally conductive epoxy system that is specially designed to help mitigate the issues associated with tightly packed components and miniaturized electronic circuits. With a thermal conductivity over 22 BTU/in/ft²/hr/ºF and serviceability from -60 to 400°F, Master Bond EP21ANHT delivers outstanding performance in the most demanding microelectronic applications. The cured adhesive is also a superior electric...

Through heat dissipation, thermally conductive adhesives and potting compounds play a pivotal role in the protection of today's electronic circuitry. In tandem with the great growth of the technological sector comes the need for a new generation of innovative, highly advanced solutions capable of reliable performance in the ever increasing temperatures of electronic devices. Master Bond's white paper examines the challenges design engineers face...

Master Bond's EP21TDCHT-LO two part epoxy adhesive/sealant is specially formulated for demanding applications where factors like temperature cycling, high vibration, and mechanical shock are an issue.

Developed for coating and lining storage tanks, piping, scrubbers, and processing equipment in the chemical industry, Master Bond EP21ARHT features outstanding chemical, fuel, and acid resistance. Also widely used in electronic, electrical, and metalworking industries, it can even successfully withstand immersion to 96-98% sulfuric acid and 20% hydrochloric acid for more than a year.

Master Bond EP65HT-1 combines high temperature resistance and fast room temperature curing in a NASA low outgassing approved epoxy. It also offers superior electrical insulation capabilities and strong chemical resistance.

Master Bond EP30M3LV is a specially engineered, low exothermic epoxy system formulated to help avoid excess heat buildup and damage to thermally sensitive components during potting operations. It also contains a special additive to remove air bubbles. This compound cures at room temperatures or more rapidly at elevated temperatures. It can be cured in various cross section thicknesses.

Combining the benefits of epoxy resins and polyurethanes, Master Bond Polymer System EP30D-7 offers superior strength, flexibility, abrasion resistance and toughness. This two component epoxy is ideal for high performance bonding, sealing, coating, and encapsulating applications in the electronic, electrical, computer, metalworking, optical, electro-optical and oil/chemical processing industries. Its lower exotherm also makes it ideal for castin...

Master Bond EP30FLAO is a two component epoxy resin system for high performance potting, bonding, sealing and coating. It is extremely versatile and can be used in a wide variety of cryogenic applications. This low viscosity epoxy with excellent flow characteristics makes it ideal as a thermally conductive potting compound. It is widely used in the electronic, electrical, computer, metalworking, appliance and chemical industries where electrical ...

Resistance to impact, thermal shock, vibration and stress fatigue cracking is of vital importance in the aerospace, optical, medical and oil/chemical processing industries. Master Bond Polymer Adhesive Supreme 10AOHT-LO is a single component, no mix, thermally conductive compound featuring superior electrical insulation and toughness.

Master Bond EP17HT-3 is a one part epoxy that sets up in 20 to 30 seconds and snap cures in only 2 to 3 minutes at 250°F-300ºF. As a one part system, no mixing is required and the epoxy can be cured in sections up to 1/4 thick. Moreover, its working life is indefinite as it will not gel until heated above 200ºF.

As conformal coatings are becoming more essential to electronic assemblies, Master Bond broadens their protective conformal coatings line with the addition of UV10LV. A clear, highly non-conductive, UV curing conformal coating, it is designed to restrain the impact of moisture, dust, chemicals, and temperature extremes on electronic circuitry and components. I ts high resilience bonds will not deteriorate even when exposed to adverse environmenta...

Comprised of an aramid fiber reinforced epoxy adhesive for high performance structural bonding, Master Bond's EP30R features outstanding dimensional stability and enhanced impact resistance. This two part epoxy is formulated to cure at room temperature or more rapidly at elevated temperatures.

Comprised of an aramid fiber reinforced epoxy adhesive for high performance structural bonding, Master Bond's EP30R features outstanding dimensional stability and enhanced impact resistance. This two part epoxy is formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond EP30R produces high strength bonds to metals, glass, ceramics, vulcanized rubbers and many plastics.