Master Bond Inc
Master Bond Inc Articles
Toughened epoxy polysulfide hybrid offers chemical resistance
Master Bond EP21TP-2NV is a two part epoxy polysulfide hybrid formulated for use as an adhesive, sealant and potting system. It withstands prolonged exposure to many harsh chemicals including fuels, oils, hydrocarbons and hydraulic fluids. It is also fully RoHS compliant, meeting RoHS3 Directive (EU) 2015/863.
Non-premixed one part epoxy for chip coating
Featuring a combination of thermal conductivity and electrical insulation properties, Master Bond Supreme 3CCM-85 is a single component epoxy initially designed for glob top and chip coating applications. However, this system can also be utilised for encapsulation and bonding. Supreme 3CCM-85 cures within two to three hours at 80-85°C, which is advantageous for use on heat sensitive components and substrates.
Low viscosity epoxy system features high flexibility
Two component epoxy, Master Bond EP88FL, is a highly flexible, optically clear compound formulated for bonding, coating, sealing, potting and encapsulation. It is easy to use, with a mixing ratio of one to one by weight or volume.
One component epoxy features thermal cycling resistance
The Master Bond Supreme 17HT is a single component, no mix epoxy system for bonding and sealing applications featuring an unlimited working life at room temperature.
Dual curing epoxy meets biocompatibility requirements
A single component, nanosilica filled compound featuring a UV and heat curing mechanism has been released by Master Bond, with the UV22DC80-1Med. Not only does it pass USP Class VI Tests for biocompatibility, but it also meets ISO 10993-5 for cytotoxicity, making it ideal for many applications in the medical device industry.
Graphene filled epoxy offers thermal conductivity
The newly introduced EP30NG from Master Bond is a two part epoxy adhesive system developed for applications that require high thermal conductivity. It contains a specialty graphene filler which contributes not only to its high compressive strength, but also to its enhanced dimensional stability.
Biocompatible, nanosilica filled LED curable adhesive
The LED curing adhesive system from Master Bond, the LED405Med, meets ISO 10993-5 cytotoxicity requirements for use in medical device assembly. LED405Med is optically clear, with a refractive index of 1.50, and offers excellent light transmission properties. This electrically insulative system features a high volume resistivity of more than 1014 ohm-cm and a low dielectric constant of 4.2 at 60Hz.
Low viscosity thermally conductive underfill epoxy
Master Bond EP3UF-1 is a new single component epoxy that is not premixed and frozen. Due to its low viscosity of 5,000-15,000 cps, this heat curable thixotropic compound is suited for underfill and many bonding applications. EP3UF-1 delivers high bond strength and dimensional stability with a compressive strength of 18,000-20,000 psi and a tensile modulus of 450,000-500,000 psi.
One component glob top epoxy meets NASA low outgassing specifications
A new single component epoxy that is not premixed and frozen, has been introduced by Master Bond with the EP17HTND-CCM. It is more convenient to handle, apply and store than typical two component glob top systems. This black, heat curable compound has a flowable paste consistency suited for glob top, chip coating and bonding applications.
UL 1203 Certified Epoxy
Master Bond EP41S-6 is a new two component epoxy system that meets UL 1203, which is defined by Underwriters Laboratories as the “Standard for Explosion-Proof and Dust-Ignition-Proof Electrical Equipment for Use in Hazardous (Classified) Locations”. To meet the UL 1203 requirements, samples of EP41S-6 were exposed to saturated vapors in air for the following chemicals: acetic acid (glacial), acetone, ammonium hydroxide (20% by weight)...
Two component epoxy with thermal shock resistance
Master Bond EP110F8-3 is a two part epoxy system ideal for sealing, encapsulating, potting, and casting applications. “This toughened system provides very good flexibility and possesses a relatively high elongation of 120-150%”, said Rohit Ramnath, Senior Product Engineer. “It offers a low tensile modulus of around 5,000-15,000 psi and a shore A hardness of 40-50 at room temperature."
High tensile epoxy adhesive utilises renewable biomaterial
Master Bond EP70CN is a two part, thermally stable epoxy adhesive formulated using a natural, renewable and sustainable ingredient. This epoxy system forms high physical strength bonds and can be utilised for bonding, sealing, coating and potting.
Epoxy adhesive for structural bonding features long pot life
Master Bond EP21ND-LP was created for structural bonding applications involving large surface areas. It has a long working life of 2-4 hours at 75°F for a 100g mass. Its smooth paste consistency makes it convenient to apply and use. Shore D hardness is 70-80 when mixed in a one to one mix ratio by weight or volume. Moreover, certain properties of the epoxy can be altered by adjusting the mix ratio.
Adhesive featuring low coefficient of thermal expansion
It has been announced that Master Bond EP30LTE-2 has been developed for joining dissimilar substrates exposed to thermally or mechanically induced stresses. It can be used for sealing, coating and encapsulating, especially for small to medium sized castings where a very low coefficient of thermal expansion (CTE) is required.
Biocompatible epoxy for medical electronic applications
Formulated for medical electronic applications, Master Bond EP62-1LPSPMed is a biocompatible two part epoxy that has a mixed viscosity of 150-300 cps. Its ultra low viscosity makes it suitable for use in underfill, impregnation and porosity sealing applications. This product exhibits wetting properties and can readily flow by capillary action in tight clearances or beneath devices. It adheres well to metals, plastics, composites, polyimides, glas...
Epoxy based dual curing adhesive
Master Bond UV22DC80-10F is a single component, nanosilica filled compound featuring a UV and heat curing mechanism. This thixotropic, moderately low viscosity compound has a viscosity of 8,000-12,000 cps at 75°F (~ 23°C). It is said to provide outstanding dimensional stability and superior physical strength properties. Additionally, UV22DC80-10F is optically clear and offers the ability to be cured in shadowed out areas.
Silicone compound offers low thermal resistance
Master Bond MasterSil 151TC was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. This 100% solids silicone compound features excellent thermal conductivity and superior electrical insulation properties. Volume resistivity is >1014 ohm-cm.
Electrically conductive die attach adhesive
Master Bond EP3HTSDA-1 is a single part, no mix epoxy adhesive designed primarily for die attach applications. It exhibits a die shear strength of 20-22 kg-f and has a high thermal conductivity. “This 100% solids formulation has an ideal viscosity and flow for die attach, will not ‘tail’ and can be easily dispensed automatically” says Rohit Ramnath, senior product engineer. “Additionally it has an unlimited working l...
Epoxy features enhanced dimensional stability
Developed by Master Bond for potting, sealing, encapsulation and casting applications, EP110F8-5 is dimensionally stable and has low shrinkage upon cure. This system is said to feature superior electrical insulation properties including a volume resistivity exceeding 1015 ohm-cm, a dielectric constant of 2.91 at 1 KHz and a dissipation factor of 0.009 at 1KHz.
One component, high temperature resistant epoxy
With a low coefficient of thermal expansion of 15-20 x 10-6 in/in/°C, Master Bond EP13LTE is a one part epoxy for structural bonding applications. According to Master Bond, EP13LTE cures readily in 1-2 hours at 300-350°F and has limited flow while curing. It is said to bond well to many substrates such as metals, glass, composites, ceramics and plastics.