Master Bond EP40TCMed is a two-part, room-temperature curing epoxy system that meets the requirements of ISO 10993-5 for non-cytotoxicity.

Master Bond LED415DC90 is a one-component adhesive system that cures rapidly upon exposure to a 405nm wavelength LED light source without any oxygen inhibition.

Master Bond EP41S-5Med is a two-part epoxy system that meets the requirements of ISO 10993-5 for non-cytotoxicity and can be used for bonding, sealing, and coating in medical devices.

Master Bond Supreme 42HT-2ND Black is a two-part, non-drip epoxy system designed for bonding, sealing and coating applications.

Master Bond EP5TC-80 is a thermally conductive, electrically insulating, one part epoxy system for bonding, sealing and small encapsulating applications. It meets NASA low outgassing requirements.

Master Bond MasterSil 323AO-LO is a two-component silicone elastomer with a self-priming feature, designed for bonding, sealing and gap filling applications.

Master Bond EP4CL-80Med is a one-part, optically clear epoxy developed for use in medical device assembly applications. It withstands repeated sterilisation cycles and passes ISO 10993-5 testing for non-cytotoxicity.

It has a moderately high glass transition temperature (Tg) of 150-155°C and a wide service temperature range from -150°F to +550°F. Designed to compensate for thermal mismatches, this compound resists impact, vibration, shock and rigorous thermal cycling.

Master Bond EP21AC is a two part epoxy with a non-halogenated filler that is formulated for applications where arc resistance and flame retardancy are required.

Master Bond EP21TP-2NV is a two part epoxy polysulfide hybrid formulated for use as an adhesive, sealant and potting system. It withstands prolonged exposure to many harsh chemicals including fuels, oils, hydrocarbons and hydraulic fluids. It is also fully RoHS compliant, meeting RoHS3 Directive (EU) 2015/863. 

Featuring a combination of thermal conductivity and electrical insulation properties, Master Bond Supreme 3CCM-85 is a single component epoxy initially designed for glob top and chip coating applications. However, this system can also be utilised for encapsulation and bonding. Supreme 3CCM-85 cures within two to three hours at 80-85°C, which is advantageous for use on heat sensitive components and substrates. 

Two component epoxy, Master Bond EP88FL, is a highly flexible, optically clear compound formulated for bonding, coating, sealing, potting and encapsulation. It is easy to use, with a mixing ratio of one to one by weight or volume. 

  The Master Bond Supreme 17HT is a single component, no mix epoxy system for bonding and sealing applications featuring an unlimited working life at room temperature.

A single component, nanosilica filled compound featuring a UV and heat curing mechanism has been released by Master Bond, with the UV22DC80-1Med. Not only does it pass USP Class VI Tests for biocompatibility, but it also meets ISO 10993-5 for cytotoxicity, making it ideal for many applications in the medical device industry. 

The newly introduced EP30NG from Master Bond is a two part epoxy adhesive system developed for applications that require high thermal conductivity. It contains a specialty graphene filler which contributes not only to its high compressive strength, but also to its enhanced dimensional stability. 

The LED curing adhesive system from Master Bond, the LED405Med, meets ISO 10993-5 cytotoxicity requirements for use in medical device assembly. LED405Med is optically clear, with a refractive index of 1.50, and offers excellent light transmission properties. This electrically insulative system features a high volume resistivity of more than 1014 ohm-cm and a low dielectric constant of 4.2 at 60Hz.

Master Bond EP3UF-1 is a new single component epoxy that is not premixed and frozen. Due to its low viscosity of 5,000-15,000 cps, this heat curable thixotropic compound is suited for underfill and many bonding applications. EP3UF-1 delivers high bond strength and dimensional stability with a compressive strength of 18,000-20,000 psi and a tensile modulus of 450,000-500,000 psi.

A new single component epoxy that is not premixed and frozen, has been introduced by Master Bond with the EP17HTND-CCM. It is more convenient to handle, apply and store than typical two component glob top systems. This black, heat curable compound has a flowable paste consistency suited for glob top, chip coating and bonding applications. 

Master Bond EP41S-6 is a new two component epoxy system that meets UL 1203, which is defined by Underwriters Laboratories as the “Standard for Explosion-Proof and Dust-Ignition-Proof Electrical Equipment for Use in Hazardous (Classified) Locations”. To meet the UL 1203 requirements, samples of EP41S-6 were exposed to saturated vapors in air for the following chemicals: acetic acid (glacial), acetone, ammonium hydroxide (20% by weight)...

Master Bond EP110F8-3 is a two part epoxy system ideal for sealing, encapsulating, potting, and casting applications. “This toughened system provides very good flexibility and possesses a relatively high elongation of 120-150%”, said Rohit Ramnath, Senior Product Engineer. “It offers a low tensile modulus of around 5,000-15,000 psi and a shore A hardness of 40-50 at room temperature."