Master Bond Inc

Master Bond Inc Articles

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Component Management
22nd July 2019
Toughened epoxy polysulfide hybrid offers chemical resistance

Master Bond EP21TP-2NV is a two part epoxy polysulfide hybrid formulated for use as an adhesive, sealant and potting system. It withstands prolonged exposure to many harsh chemicals including fuels, oils, hydrocarbons and hydraulic fluids. It is also fully RoHS compliant, meeting RoHS3 Directive (EU) 2015/863. 

Component Management
2nd July 2019
Non-premixed one part epoxy for chip coating

Featuring a combination of thermal conductivity and electrical insulation properties, Master Bond Supreme 3CCM-85 is a single component epoxy initially designed for glob top and chip coating applications. However, this system can also be utilised for encapsulation and bonding. Supreme 3CCM-85 cures within two to three hours at 80-85°C, which is advantageous for use on heat sensitive components and substrates. 

Component Management
2nd July 2019
Low viscosity epoxy system features high flexibility

Two component epoxy, Master Bond EP88FL, is a highly flexible, optically clear compound formulated for bonding, coating, sealing, potting and encapsulation. It is easy to use, with a mixing ratio of one to one by weight or volume. 

Component Management
20th May 2019
One component epoxy features thermal cycling resistance

  The Master Bond Supreme 17HT is a single component, no mix epoxy system for bonding and sealing applications featuring an unlimited working life at room temperature.

Component Management
24th April 2019
Dual curing epoxy meets biocompatibility requirements

A single component, nanosilica filled compound featuring a UV and heat curing mechanism has been released by Master Bond, with the UV22DC80-1Med. Not only does it pass USP Class VI Tests for biocompatibility, but it also meets ISO 10993-5 for cytotoxicity, making it ideal for many applications in the medical device industry. 

Component Management
5th April 2019
Graphene filled epoxy offers thermal conductivity

The newly introduced EP30NG from Master Bond is a two part epoxy adhesive system developed for applications that require high thermal conductivity. It contains a specialty graphene filler which contributes not only to its high compressive strength, but also to its enhanced dimensional stability. 

Component Management
4th February 2019
Biocompatible, nanosilica filled LED curable adhesive

The LED curing adhesive system from Master Bond, the LED405Med, meets ISO 10993-5 cytotoxicity requirements for use in medical device assembly. LED405Med is optically clear, with a refractive index of 1.50, and offers excellent light transmission properties. This electrically insulative system features a high volume resistivity of more than 1014 ohm-cm and a low dielectric constant of 4.2 at 60Hz.

Component Management
17th January 2019
Low viscosity thermally conductive underfill epoxy

Master Bond EP3UF-1 is a new single component epoxy that is not premixed and frozen. Due to its low viscosity of 5,000-15,000 cps, this heat curable thixotropic compound is suited for underfill and many bonding applications. EP3UF-1 delivers high bond strength and dimensional stability with a compressive strength of 18,000-20,000 psi and a tensile modulus of 450,000-500,000 psi.

Component Management
28th November 2018
One component glob top epoxy meets NASA low outgassing specifications

A new single component epoxy that is not premixed and frozen, has been introduced by Master Bond with the EP17HTND-CCM. It is more convenient to handle, apply and store than typical two component glob top systems. This black, heat curable compound has a flowable paste consistency suited for glob top, chip coating and bonding applications. 

Component Management
24th October 2018
UL 1203 Certified Epoxy

Master Bond EP41S-6 is a new two component epoxy system that meets UL 1203, which is defined by Underwriters Laboratories as the “Standard for Explosion-Proof and Dust-Ignition-Proof Electrical Equipment for Use in Hazardous (Classified) Locations”. To meet the UL 1203 requirements, samples of EP41S-6 were exposed to saturated vapors in air for the following chemicals: acetic acid (glacial), acetone, ammonium hydroxide (20% by weight)...

Component Management
10th September 2018
Two component epoxy with thermal shock resistance

Master Bond EP110F8-3 is a two part epoxy system ideal for sealing, encapsulating, potting, and casting applications. “This toughened system provides very good flexibility and possesses a relatively high elongation of 120-150%”, said Rohit Ramnath, Senior Product Engineer. “It offers a low tensile modulus of around 5,000-15,000 psi and a shore A hardness of 40-50 at room temperature."

Component Management
7th August 2018
High tensile epoxy adhesive utilises renewable biomaterial

Master Bond EP70CN is a two part, thermally stable epoxy adhesive formulated using a natural, renewable and sustainable ingredient. This epoxy system forms high physical strength bonds and can be utilised for bonding, sealing, coating and potting. 

Component Management
23rd July 2018
Epoxy adhesive for structural bonding features long pot life

Master Bond EP21ND-LP was created for structural bonding applications involving large surface areas. It has a long working life of 2-4 hours at 75°F for a 100g mass. Its smooth paste consistency makes it convenient to apply and use. Shore D hardness is 70-80 when mixed in a one to one mix ratio by weight or volume. Moreover, certain properties of the epoxy can be altered by adjusting the mix ratio.

Component Management
11th July 2018
Adhesive featuring low coefficient of thermal expansion

It has been announced that Master Bond EP30LTE-2 has been developed for joining dissimilar substrates exposed to thermally or mechanically induced stresses. It can be used for sealing, coating and encapsulating, especially for small to medium sized castings where a very low coefficient of thermal expansion (CTE) is required. 

4th April 2018
Biocompatible epoxy for medical electronic applications

Formulated for medical electronic applications, Master Bond EP62-1LPSPMed is a biocompatible two part epoxy that has a mixed viscosity of 150-300 cps. Its ultra low viscosity makes it suitable for use in underfill, impregnation and porosity sealing applications. This product exhibits wetting properties and can readily flow by capillary action in tight clearances or beneath devices. It adheres well to metals, plastics, composites, polyimides, glas...

Component Management
16th January 2018
Epoxy based dual curing adhesive

Master Bond UV22DC80-10F is a single component, nanosilica filled compound featuring a UV and heat curing mechanism. This thixotropic, moderately low viscosity compound has a viscosity of 8,000-12,000 cps at 75°F (~ 23°C). It is said to provide outstanding dimensional stability and superior physical strength properties. Additionally, UV22DC80-10F is optically clear and offers the ability to be cured in shadowed out areas.

Component Management
27th November 2017
Silicone compound offers low thermal resistance

Master Bond MasterSil 151TC was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. This 100% solids silicone compound features excellent thermal conductivity and superior electrical insulation properties. Volume resistivity is >1014 ohm-cm.

Component Management
4th November 2017
Electrically conductive die attach adhesive

Master Bond EP3HTSDA-1 is a single part, no mix epoxy adhesive designed primarily for die attach applications. It exhibits a die shear strength of 20-22 kg-f and has a high thermal conductivity. “This 100% solids formulation has an ideal viscosity and flow for die attach, will not ‘tail’ and can be easily dispensed automatically” says Rohit Ramnath, senior product engineer. “Additionally it has an unlimited working l...

Component Management
9th October 2017
Epoxy features enhanced dimensional stability

Developed by Master Bond for potting, sealing, encapsulation and casting applications, EP110F8-5 is dimensionally stable and has low shrinkage upon cure. This system is said to feature superior electrical insulation properties including a volume resistivity exceeding 1015 ohm-cm, a dielectric constant of 2.91 at 1 KHz and a dissipation factor of 0.009 at 1KHz.

Component Management
20th September 2017
One component, high temperature resistant epoxy

With a low coefficient of thermal expansion of 15-20 x 10-6 in/in/°C, Master Bond EP13LTE is a one part epoxy for structural bonding applications. According to Master Bond, EP13LTE cures readily in 1-2 hours at 300-350°F and has limited flow while curing. It is said to bond well to many substrates such as metals, glass, composites, ceramics and plastics. 

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