Master Bond Inc
Master Bond Inc Articles
Two-part structural epoxy meets ISO 10993-5 for non-cytotoxicity
Master Bond Supreme 11AOHTMed is a two-component epoxy featuring thermal conductivity and electrical insulation.
Flexible, thixotropic, one component dual cure epoxy
Master Bond UV23FLDC-80TK epoxy is a moderate viscosity, cationic type system that offers both UV light and heat curing mechanisms.
One part RTV silicone passes non-cytotoxicity standards
Designed for medical device manufacturing, MasterSil 711Med passes ISO 10993-5 testing.
Thermally conductive, electrically insulative medical epoxy
Master Bond EP40TCMed is a two-part, room-temperature curing epoxy system that meets the requirements of ISO 10993-5 for non-cytotoxicity.
Dual curable adhesive offers rapid fixturing with LED light
Master Bond LED415DC90 is a one-component adhesive system that cures rapidly upon exposure to a 405nm wavelength LED light source without any oxygen inhibition.
Non-cytotoxic epoxy withstands multiple methods of medical sterilisation
Master Bond EP41S-5Med is a two-part epoxy system that meets the requirements of ISO 10993-5 for non-cytotoxicity and can be used for bonding, sealing, and coating in medical devices.
Electrically insulative, toughened epoxy meets NASA specifications
Master Bond Supreme 42HT-2ND Black is a two-part, non-drip epoxy system designed for bonding, sealing and coating applications.
Master Bond's new electrically isolating epoxy
Master Bond EP5TC-80 is a thermally conductive, electrically insulating, one part epoxy system for bonding, sealing and small encapsulating applications. It meets NASA low outgassing requirements.
Master bond addition cured silicones
Master Bond MasterSil 323AO-LO is a two-component silicone elastomer with a self-priming feature, designed for bonding, sealing and gap filling applications.
Low viscosity, biocompatible epoxy offers optical clarity
Master Bond EP4CL-80Med is a one-part, optically clear epoxy developed for use in medical device assembly applications. It withstands repeated sterilisation cycles and passes ISO 10993-5 testing for non-cytotoxicity.
Toughened One Part Epoxy Withstands Thermal Cycling
It has a moderately high glass transition temperature (Tg) of 150-155°C and a wide service temperature range from -150°F to +550°F. Designed to compensate for thermal mismatches, this compound resists impact, vibration, shock and rigorous thermal cycling.
Epoxy encapsulant resists arcing without igniting
Master Bond EP21AC is a two part epoxy with a non-halogenated filler that is formulated for applications where arc resistance and flame retardancy are required.
Toughened epoxy polysulfide hybrid offers chemical resistance
Master Bond EP21TP-2NV is a two part epoxy polysulfide hybrid formulated for use as an adhesive, sealant and potting system. It withstands prolonged exposure to many harsh chemicals including fuels, oils, hydrocarbons and hydraulic fluids. It is also fully RoHS compliant, meeting RoHS3 Directive (EU) 2015/863.
Non-premixed one part epoxy for chip coating
Featuring a combination of thermal conductivity and electrical insulation properties, Master Bond Supreme 3CCM-85 is a single component epoxy initially designed for glob top and chip coating applications. However, this system can also be utilised for encapsulation and bonding. Supreme 3CCM-85 cures within two to three hours at 80-85°C, which is advantageous for use on heat sensitive components and substrates.
Low viscosity epoxy system features high flexibility
Two component epoxy, Master Bond EP88FL, is a highly flexible, optically clear compound formulated for bonding, coating, sealing, potting and encapsulation. It is easy to use, with a mixing ratio of one to one by weight or volume.
One component epoxy features thermal cycling resistance
The Master Bond Supreme 17HT is a single component, no mix epoxy system for bonding and sealing applications featuring an unlimited working life at room temperature.
Dual curing epoxy meets biocompatibility requirements
A single component, nanosilica filled compound featuring a UV and heat curing mechanism has been released by Master Bond, with the UV22DC80-1Med. Not only does it pass USP Class VI Tests for biocompatibility, but it also meets ISO 10993-5 for cytotoxicity, making it ideal for many applications in the medical device industry.
Graphene filled epoxy offers thermal conductivity
The newly introduced EP30NG from Master Bond is a two part epoxy adhesive system developed for applications that require high thermal conductivity. It contains a specialty graphene filler which contributes not only to its high compressive strength, but also to its enhanced dimensional stability.
Biocompatible, nanosilica filled LED curable adhesive
The LED curing adhesive system from Master Bond, the LED405Med, meets ISO 10993-5 cytotoxicity requirements for use in medical device assembly. LED405Med is optically clear, with a refractive index of 1.50, and offers excellent light transmission properties. This electrically insulative system features a high volume resistivity of more than 1014 ohm-cm and a low dielectric constant of 4.2 at 60Hz.
Low viscosity thermally conductive underfill epoxy
Master Bond EP3UF-1 is a new single component epoxy that is not premixed and frozen. Due to its low viscosity of 5,000-15,000 cps, this heat curable thixotropic compound is suited for underfill and many bonding applications. EP3UF-1 delivers high bond strength and dimensional stability with a compressive strength of 18,000-20,000 psi and a tensile modulus of 450,000-500,000 psi.