Companies

Master Bond Inc

Master Bond Inc Articles

Displaying 1 - 20 of 131
Analysis
10th September 2024
Master Bond epoxy compatible with STERIS VHP sterilisation

Master Bond and STERIS collaborated in research to determine the compatibility of Master Bond’s specialty epoxies with Vaporised Hydrogen Peroxide (VHPTM) using V-PRO s2 Low Temperature Sterilisation System.

Design
15th August 2024
Non-drip epoxy features acid resistance

Master Bond EP21ARHTND-2 is a two-part epoxy adhesive, designed to withstand prolonged exposure to a wide range of chemicals.

Aerospace & Defence
15th July 2024
Epoxy meets NASA low outgassing specifications

Master Bond Supreme 11AOHTLP is a two component epoxy featuring thermal conductivity and electrical insulation.

Medical
18th June 2024
One component, dual cure epoxy for medical applications

Master Bond UV15DC80-1Med presents a unique dual-cure mechanism, combining UV light for initial setting with heat for full polymerisation.

Design
10th April 2024
Underfill Epoxy offers high glass transition temperature and low viscosity

Master Bond EP114 is a two component, low viscosity, NASA low outgassing rated, heat cured epoxy that can be effectively utilised for underfill, coating, impregnating, and porosity sealing applications.

Design
13th March 2024
One part epoxy changes from red to clear under UV light

Master Bond UV15RCL is a low viscosity, cationic type UV curing system with a special colour changing feature.

Design
9th February 2024
Two-part structural epoxy meets ISO 10993-5 for non-cytotoxicity

Master Bond Supreme 11AOHTMed is a two-component epoxy featuring thermal conductivity and electrical insulation.

Design
29th November 2023
Flexible, thixotropic, one component dual cure epoxy

Master Bond UV23FLDC-80TK epoxy is a moderate viscosity, cationic type system that offers both UV light and heat curing mechanisms.

Design
2nd November 2023
One part RTV silicone passes non-cytotoxicity standards

Designed for medical device manufacturing, MasterSil 711Med passes ISO 10993-5 testing.

Design
31st July 2023
Thermally conductive, electrically insulative medical epoxy

Master Bond EP40TCMed is a two-part, room-temperature curing epoxy system that meets the requirements of ISO 10993-5 for non-cytotoxicity.

Design
15th March 2023
Dual curable adhesive offers rapid fixturing with LED light

Master Bond LED415DC90 is a one-component adhesive system that cures rapidly upon exposure to a 405nm wavelength LED light source without any oxygen inhibition.

Design
8th February 2023
Non-cytotoxic epoxy withstands multiple methods of medical sterilisation

Master Bond EP41S-5Med is a two-part epoxy system that meets the requirements of ISO 10993-5 for non-cytotoxicity and can be used for bonding, sealing, and coating in medical devices.

Latest
6th January 2023
Electrically insulative, toughened epoxy meets NASA specifications

Master Bond Supreme 42HT-2ND Black is a two-part, non-drip epoxy system designed for bonding, sealing and coating applications.

Design
17th November 2022
Master Bond's new electrically isolating epoxy

Master Bond EP5TC-80 is a thermally conductive, electrically insulating, one part epoxy system for bonding, sealing and small encapsulating applications. It meets NASA low outgassing requirements.

Design
14th October 2022
Master bond addition cured silicones

Master Bond MasterSil 323AO-LO is a two-component silicone elastomer with a self-priming feature, designed for bonding, sealing and gap filling applications.

Latest
8th September 2022
Low viscosity, biocompatible epoxy offers optical clarity

Master Bond EP4CL-80Med is a one-part, optically clear epoxy developed for use in medical device assembly applications. It withstands repeated sterilisation cycles and passes ISO 10993-5 testing for non-cytotoxicity.

Design
8th July 2022
Toughened One Part Epoxy Withstands Thermal Cycling

It has a moderately high glass transition temperature (Tg) of 150-155°C and a wide service temperature range from -150°F to +550°F. Designed to compensate for thermal mismatches, this compound resists impact, vibration, shock and rigorous thermal cycling.

Passives
31st January 2022
Epoxy encapsulant resists arcing without igniting

Master Bond EP21AC is a two part epoxy with a non-halogenated filler that is formulated for applications where arc resistance and flame retardancy are required.

Component Management
22nd July 2019
Toughened epoxy polysulfide hybrid offers chemical resistance

Master Bond EP21TP-2NV is a two part epoxy polysulfide hybrid formulated for use as an adhesive, sealant and potting system. It withstands prolonged exposure to many harsh chemicals including fuels, oils, hydrocarbons and hydraulic fluids. It is also fully RoHS compliant, meeting RoHS3 Directive (EU) 2015/863. 

Component Management
2nd July 2019
Non-premixed one part epoxy for chip coating

Featuring a combination of thermal conductivity and electrical insulation properties, Master Bond Supreme 3CCM-85 is a single component epoxy initially designed for glob top and chip coating applications. However, this system can also be utilised for encapsulation and bonding. Supreme 3CCM-85 cures within two to three hours at 80-85°C, which is advantageous for use on heat sensitive components and substrates. 

First Previous Page 1 of 7 Next Last

Featured products

Product Spotlight

Upcoming Events

No events found.
Newsletter
Latest global electronics news
© Copyright 2024 Electronic Specifier