High Temperature Resistant, Toughened Structural Adhesive Cures at Room Temperature

Supreme 33 has a mix ratio of 100 to 70 by weight or 1 to 1 by volume. It cures conveniently at room temperature in 48 to 72 hours. For optimal performance, the suggested schedule is curing overnight at room temperature followed by 2 to 3 hours at 150 to 200°F. This 100% reactive epoxy does not contain any solvents or diluents, has exceptional dimensional stability and features very low shrinkage upon cure.

It produces high performance bonds boasting a shear strength over 2,500 psi, a tensile shear strength greater than 7,500 psi and a T-peel strength exceeding 15 pli. With a volume resistivity of 1014 ohm-cm, a dielectric strength over 400 volts/mil, and a dielectric constant of 3.8 at 75°F, Supreme 33 is an outstanding electrical insulator that is widely used in the electronic, electrical, aerospace and OEM industries. Supreme 33 is also available in a non-drip version called Supreme 33ND.