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IMEC Articles
Partnership aims to develop agile IoT architectures
GlobalFoundries and imec have announced joint research on future radio architectures and designs for integrated mobile devices and IoT applications. GlobalFoundries will collaborate with technical experts from imec to investigate low-power, compact, high-performance, agile radio solutions to enable a broad range of radio architecture design, aiming for improvements in area, performance and power consumption.
Light & sound interact in silicon nanowire core
Scientists from Ghent University and imec have announced a successful demonstration of interaction between light and sound in a nanoscale area. Their findings elucidate the physics of light-matter coupling at these scales, and pave the way for enhanced signal processing on mass-produced silicon photonic chips.
Wireless-industry scientific papers to be presented at conference
At this year’s International Solid State Circuits Conference, imec and Holst Centre will present eight scientific papers covering results on ultra-low power design for wireless broadband communication, wireless sensor networks and organic electronics. Executives and scientists from imec and Holst Centre are prominently present as technology experts throughout the conference’s forums, evening sessions and panels, and as session ch...
Hyperspectral image sensors feature mosaic filter structure
At SPIE Photonics West 2015, imec will present a set of snapshot hyperspectral CMOS image sensors featuring spectral filter structures in a mosaic layout, processed per-pixel on 4x4 and 5x5 ‘Bayer-like’ arrays.
Cardio vascular disease detection platform in development
Imec, Medtronic, Ghent University and their partners have announced the launch of a project in which they will develop and validate an early-stage Cardio Vascular Disease (CVD) detection platform using integrated silicon photonics.
Solar cell features a 22.02% conversion efficiency
imec has announced that it has improved its large area n-type Passivated Emitter, Rear Totally diffused (PERT) crystalline Si solar cell on 6” commercially available n-type Cz-Si wafers. The solar cell now has a conversion efficiency of 22.02%, which is the highest efficiency achieved for this type of two-side-contacted solar cell on an industrial large area wafer size.
RFID transponder chip enables IoT applications
imec demonstrated an ultra-low power RFID transponder chip at the IEDM 2014, which took place from 15th to 17th December in San Francisco, California. The chip operates at 1V voltage and is manufactured on plastic film using TFT. The company's chip is, therefore, suitable for item level RFID tagging, body area networks and environmental monitoring, which require remote autonomy, and thinness, flexibility and robustness.
High-quality optical modulation demonstrated using Graphene
At 2014's IEEE International Electron Devices Meeting, imec demonstrated the industry’s first integrated graphene optical Electro-Absorption Modulator (EAM) capable of 10Gb/s modulation speed. Combining low insertion loss, low drive voltage, high thermal stability, broadband operation and compact footprint, the device marks an important milestone in the realisation of next-gen, high-density low-power integrated optical interconnects.
8-bit MPU enabled by thin-film electronics
A general-purpose 8-bit MPU, manufactured using complementary TFTs processed at temperatures compatible with plastic foil substrates (250°C), has been realised by Holst Centre, imec and their partner, Evonik. The CMOS MPU circuit, which operates at a clock frequency 2.1kHz, integrates metal-oxide for n-type TFTs and organic molecules for p-type TFTs. The results were published online in 'Scientific Reports', an open access journal from the pu...
Dry electrodes remove discomfort from EEG & ECG procedures
Holst Centre, imec and Datwyler Sealing Solutions are set to jointly present a novel polymer dry electrode. Soft, flexible, and optimised for skin-impedance noise, polymer dry electrodes are a promising alternative to conventionally used gel electrodes in biopotential signal recording, as well as for uncomfortable and painful dry electrodes with rigid metal pins.
Dev Kit targets wearables & personal healthcare applications
A Dev Kit based on an open hardware platform using a highly integrated multi-sensor data acquisition chip will be exhibited by imec and Holst Centre at the mHealth Summit 2014. At the event, which takes place from 7th to 11th December in Washington, D.C, the companies will situated at booth 610.
R&D hub supports accelerates process design
Nanoelectronics research center imec announces that SCREEN Semiconductor has joined imec’s suppliers hub for joint R&D in cleaning, wet etch and advanced lithography coat/develop processing. In a consolidating semiconductor landscape, equipment and material suppliers are playing a key role in collectively tackling the scaling challenges posed by today’s fast-evolving, equipment-intensive industry.
Partnership aims for ultra-low power IoT connectivity
Nanoelectronics research center imec/Holst Centre and MegaChips have jointly announced a strategic partnership for joint R&D on Ultra-Low Power (ULP) short radio technology for smart homes and buildings.
Ultra-thin NFC tags set to revolutionise card gaming
Holst Centre, set up by imec, TNO and Cartamundi, have announced a collaboration to develop ultra-thin flexible NFC tags using metal-oxide (IGZO) Thin-Film Transistor (TFT) technology on plastic film. The flexible chips will be integrated into game cards as a part of Cartamundi’s larger strategy of developing game cards for the connected generation.
EEG home monitoring breakthrough unveiled in Washington
The nanoelectronics research center imec and Holst Centre are presenting their next-generation wirelesselectroencephalography (EEG) headset to achieve increased EEG data quality at Neuroscience 2014 in Washington, D.C. (Nov 15-19). The headset combines dry electrodes with integrated skin-to-electrode impedance monitoring to provide information about the contact quality throughout the entire EEG recording. Unique signal processing is integrated to...
Image sensor features anti-reflective coating for UV light
A Backside-Illuminated (BSI) CMOS image sensor chip featuring an Anti-Reflective Coating (ARC) for UV light will be presented by imec at VISION 2014, which started today and will finish on 6th November. The chip, which was developed using the company’s customised 200mm CMOS fab, is suitable for imaging solutions in markets such as life sciences.
SEM image detectors enhance performance & reliability
Manufactured at nanoelectrics research centre imec and integrated in FEI Company’s SEMs (Scanning Electron Microscopes), the set of bespoke high-quality electron detector die products will help enhance the SEMs’ performance and reliability.
Communication module advances smart metering
imec, iMinds, and their partners in the iMinds ICON-project CoPlaSM will present the results of a two-year project to realise and validate proof of concept of a multi-standard communication module for smart meters at the European Utility Week, Amsterdam (Nov 4-6). The sharp increase in decentralised renewable electricity production, such as the case with solar panels, creates the need for a smart two-way electricity grid.
Imec, Coventor partner to drive advanced CMOS process
Imec, the Belgian nanoelectronics research centre has entered into a joint development project with Coventor, a supplier of semiconductor process development tools. The collaboration will enable faster and more optimised development of advanced manufacturing technology in the 3D device architecture era, extending down to imec’s 10- and 7-nanometer (nm) processes.
WDM interconnect 28Gb/s silicon platform demonstrated at IPR 2014
Improved performance of various key building blocks for WDM optical interconnects in silicon was successfully demonstrated by imec at IPR 2014. The demonstration involved, at wafer-scale, a ring-based WDM filter with an improved thermo-optic tuning efficiency of better than 1nm/mW per channel. The demonstration also included a thermally tunable 28Gb/s ring modulator with an efficiency of 260pm/mW, and a high-speed germanium photodetector achievin...