Hyperspectral image sensors feature mosaic filter structure

imec’s hyperspectral filter structures are processed at wafer-level on commercially available CMOS image sensor wafers, enabling extremely compact, low-cost and mass-producible hyperspectral imaging solutions. This paves the way to multiple applications ranging from machine vision, medical imaging and precision agriculture to higher volume industries such as security, automotive and consumer electronic devices.

The newly developed mosaic sensors feature one spectral filter per pixel, arranged in mosaics of 4x4 (16 spectral bands) or 5x5 (25 spectral bands) deposited onto a full array of 2 million pixels 5.5µm size CMOSIS CMV2000 sensor.

“imec’s latest achievements in hyperspectral imaging emphasise how our promising technology has become an industrially viable solution for a number of applications,” said Andy Lambrechts, Programme Manager, imec. “The mosaic architecture, and extended spectral range, brings unique advantages compared to our previously announced hyperspectral linescan sensors for applications in which scanning would not be practical. It enables spectral imaging in a small form-factor, which can even be scaled to handheld devices. From the technology standpoint, we have now successfully demonstrated linescan and tiled sensors, in which spectral filters cover many pixels, to mosaic sensors, in which filters vary from pixel to pixel. At the same time, the spectral range is extended and now covers down to 470nm.”

“imec’s hyperspectral imaging sensors are off-the-shelf, commercially available engineering sample sensors that we developed to address the fragmented machine vision market and to trigger interest for this unique technology from potential end-users in other industries,” commented Jerome Baron, Business Development Manager, imec. “We also offer customised spectral filtering solutions for companies that are already familiar with the technology and interested in developing proprietary solutions with a specific performance in terms of speed, compactness, spatial versus spectral resolution, bands selection or cost.”

At the event, the company will be located at booth 4635.