Expanding its cost-effective Intel H81 product line, DFI has introduced a new microATX industrial motherboard. Powered by the 4th generation Intel Core processor family (which delivers a 5-15% CPU performance increase over previous generations), the HD330-H81 is suitable for applications including gaming machine, industrial control automation, medical equipment, telecom, POS, kiosk, and transportation.

Based on the latest 4th generation Intel Core processor family (the mobile-based Intel QM87 Express chipset which offers a 5-15% CPU performance increase over previous generations), the HM920-QM87 is a COM Express basic module from DFI. It is built on 22nm process technology to give higher processing performance, superior graphics display support, and improvements in system memory and I/O interfaces.

The new HD630-H81 ATX embedded motherboard uses the LGA 1150 socket to support 4th Generation Intel Core processors built on 22-nanometer process technology, delivering up to 5~15% CPU performance increase over the previous generations. Signalling an addition to DFI's current Intel H81-based motherboard product line, the inclusion of the 4th generation Intel Core processors provides smooth flash playback and rich 2D/3D graphic...

DFI has added to its Intel H81 product line with the introduction of the HD100-H81, a new Mini-ITX embedded motherboard. Providing low-power consumption and higher performance, the HD100-H81 is powered by the 4th generation Intel CoreTM processor family. The 4th generation Intel CoreTM processors with LGA 1150 socket enables smooth flash playback and rich 2D/3D graphics with high quality playback, providing a compelling visual experience fo...

DFI have introduced their first COM Express Mini form factor to pair an Intel NM10 Express chipset with a range of Intel Atom processors - from the power-efficient Intel Atom N2600 processor to the enhanced Intel Atom D2550 processor. The CD9A3 Series Type 10 COM Express Mini module is ideal for industrial applications which require a stable revision-controlled platform, such as industrial control automation, digital signage, medical equipment, a...

DFI has today expanded its Intel Atom processor-based product line with the introduction of the BT700 Qseven module. Designed for today’s growing performance/wattage requirements of intelligent systems, the BT700 is based on the next-generation Intel Atom processor E3800 product family. Contained on a sub-10-watt SoC, the BT700 delivers excellent computing, media, and graphical capabilities whilst also featuring a built-in security engine.

DFI has introduced five new mini-ITX industrial motherboards and one embedded SBC. The BT100, BT101, BT103, BT160, BT161, and BT551 come with the Intel Atom processor E3800 product family, providing low power consumption and substantially better performance than previous generation Intel Atom processors.

DFI provides a complete line of products based on the next generation Intel Atom processor E3800 SoC product family. DFI’s nine new boards based on the low-power and cost-efficient Intel Atom processor E3800 product family are designed for today’s growing performance/wattage requirements of intelligent systems.

DFI launches a new Type 2 COM Express Basic module, the HM920-HM86, providing low-power consumption and higher performance. This COM Express Basic module is powered by BGA 1364 packaging technology supporting the latest 4th generation Intel Core processor family which is the next generation of 64-bit, multi-core processor built on 22-nanometer process technology and delivers up to 5~15% CPU performance increase compared with its previous generati...

DFI brings the latest Intel Core processors to the HD101-H81 Mini-ITX embedded motherboard, a new addition to its Intel H81 product line providing low-power consumption and higher performance. This new Mini-ITX form factor with LGA 1150 socket is powered by the 4th generation Intel Core processor family built on 22-nanometer process technology with the Intel H81 chipset that delivers up to 5~15% CPU performance increase over the previous generati...

DFI has today announced the introduction of a new EATX form factor, the RL830-C602-J/C604, with the Intel C602-J/C604 chipset and support for dual Intel Xeon E5-2600 v2 processors based on 22nm process technology providing higher intelligent performance with more cost-effective and energy-efficient power consumption than previous generations.

DFI today launches 6 new riser cards. The 6 riser cards are equipped with PCIe/PCI expansions to fit several unique requirements.

DFI introduce the first ATX embedded motherboard in its Intel Q87 chipset-based product line, the HD631-Q87. Supporting the 4th generation Intel Core processors, the new HD631-Q87 motherboard provides smooth flash playback and rich 2D/3D graphics with high quality playback. Built on 22-nanometer process technology, these 4th generation Intel Core processors enable a compelling visual experience for intelligent systems that display videos, graphic...

DFI has today announced two new IP65 rated 7" panel PCs, the KS211 and KS212. Powered by the Freescale i.MX535 ARM Cortex-A8 processor with speed up to 1GHzm, the ARM-based system is fanless with low power consumption. The KS211 and KS212 panel PCs use the 4-wire Resistive type 7” LCD touch screen panel that has 400 nits brightness and can support WVGA resolution of 800x480.

DFI has introduced the new CM100-C embedded Mini-ITX motherboard powered by the Quad-core and Dual-core AMD R-Series Accelerated Processing Units including R-464L, R-460H, R-272F and R-268D. Featuring 32-nanometer process technology with the cost-efficient AMD A70M Fusion Controller Hub, these processors offer higher performance in visual computing and security. The AMD Radeon Dual Graphics technology integrated into this Mini-ITX platform d...

DFI have today announced the introduction of the HM960-HM86 Type 6 COM Express Basic module. Based on the Intel HM86 Express chipset, the new HM960-HM86 COM Express Basic module is offered in BGA 1364 packaging. Powered by the 4th generation Intel Core processor family built on 22-nanometer process technology, this module provides higher processing performance, superior graphics display support, and evolutionary improvements in system memory and ...

DFI has announced the new HR908-B Type 6 COM Express Compact form factor. Based on the Intel Core QM67 Express chipset, the HR908-B is DFI’s new model supporing the low-power and cost-efficient 3rd/2nd generation Intel Core and Intel Celeron processors with BGA 1023 packaging technology. Offering higher performance at lower power consumption than the 2nd generation processors, the supported processors are built on Intel’s 22/32-nanome...

DFI launches the HR902-BL, a Type 2 COM Express basic module, which in its product line based on the Mobile Intel HM65 Express chipset. This new module is powered by the BGA 1023 packaging technology for the low-power and cost-efficient 3rd/2nd generation Intel CoreTM processors with 22/32-nanometer process technology. It is a new COM Express form factor that supports the 3rd generation premium performance i7-3615/3612QE, i7-3555LE, i7-3517UE and...

DFI reveal a new Type 2 COM Express basic module, the HR902-B, which comes with BGA 1023 packaging technology for the low-power 3rd/2nd generation Intel Core processors based on 22/32-nanometer process technology. It is a new COM Express form factor that supports the 3rd generation premium performance i7-3615/3612QE, i7-3555LE, i7-3517UE and i5-3610ME, as well as the mainstream performance i3-3217UE and i3-3120ME.

DFI brings the Intel Xeon processor E3-1200 v3 series to the DL631-C226 ATX embedded motherboard. It is DFI’s first ATX board that supports the new Intel C226 Express Chipset. This ATX motherboard comes with LGA 1150 socket for the Intel Xeon processor E3-1200 v3 series built on 22-nanometer process technology that delivers up to 5~15% CPU performance increase over the previous generations.