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DELO Industrial Adhesives

  • DELO-Allee 1
    86949 Windach
    Germany
  • +49 8193 9900-212 / -391
  • www.DELO.de

DELO Industrial Adhesives Articles

Displaying 1 - 20 of 40
Latest
9th September 2020
SUSS MicroTec and DELO collaborate on imprint lithography

SUSS MicroTec has announced a collaboration with DELO. The central focus of the cooperation is the development and qualification of enhanced process solutions for micro-imprint lithography applications, especially the interaction of equipment and materials.

Industries
18th August 2020
Die attach adhesive for semiconductor applications

DELO has launched a new die attach adhesive to replace the previous DELO MONOPOX MK096. DELO MONOPOX EG2596 features high strength even after aging and can be dispensed even more precisely than its predecessor.

Production
22nd July 2020
Sealant helps extend automotive connector life

A light- and humidity-curing sealant for connectors that are often found in vehicle control units or sensors has been introduced by DELO.

Component Management
29th May 2020
New adhesive for power semiconductors from DELO

DELO has developed an adhesive for electronics that is both thermally conductive and electrically insulating. DELO MONOPOX TC2270 shows good strength, even after standardized humidity tests with subsequent reflow cycles are performed. This new adhesive ensures fast heat transfer and long-term reliable operation of semiconductors in power electronics.

Latest
27th May 2020
DELO reports increased revenues despite COVID-19

DELO closed the financial year that ended on March 31st with a turnover of €163 million. This is an increase of almost five percent compared to the previous year (€156 million). Despite increasing coronavirus restrictions worldwide, even the last quarter of the fiscal year contributed to this result.

Production
15th April 2020
Collaboration to create a new additive balancing process

DELO has collaborated with PMB, a German-based mechanical engineering company, to create a new additive balancing process for rotating parts found in electric motors, fans, pumps and turbines. This high-precision process helps bring parts into balance without having to remove any material from the product.

Component Management
9th April 2020
Collaboration to create a new additive balancing compound

DELO has collaborated with Präzisionsmaschinenbau Bobertag (PMB), a German-based mechanical engineering company, to create a new additive balancing compound technology for rotating parts found in electric motors, fans, pumps and turbines. This high-precision process helps bring parts into balance without having to remove any material from the product.

Component Management
26th March 2020
High quality materials in liquid additive manufacturing

DELO has further developed its liquid materials, creating new possibilities for liquid additive manufacturing. The high-performance materials providing different functionalities, such as transparency or flexibility can be combined in one printing process, adhere reliably, and have isotropic strength in all printing directions.

Component Management
5th March 2020
Functional materials for liquid additive manufacturing

Having further developed its liquid materials, DELO has created new possibilities for liquid additive manufacturing. The high-performance materials providing different functionalities, such as transparency or flexibility can be combined in one printing process, adhere reliably, and have isotropic strength in all printing directions. They are particularly well suited for automotive and microelectronic applications.

Component Management
15th November 2019
Compact UV LED lamp for adhesive curing

DELO has developed a particularly space-saving UV lamp for adhesive curing. The powerful DELOLUX 503 is designed for industrial applications requiring small surfaces to be bonded within seconds in serial production lines, for example for bonding cameras used in autonomous cars.

Component Management
29th August 2019
Fast curing in any shape with liquid sealants

DELO has introduced a new, silicone-free liquid sealant for the automotive, electronics, and white goods industries. Curing by light, DELO PHOTOBOND SL4165 protects from dust, air, and water. The flow-resistant, highly viscous liquid sealant can be applied in the desired height and any geometric shape. 

Component Management
20th June 2019
Glob Top dispensing to spray continuously and precisely

Microdispensing in the electronics industry can help to increase the service life of individual components. Glob Top Potting, for example, protects sensitive components, usually semiconductor chips, from mechanical stresses such as vibrations or temperature fluctuations. It also protects them from external environmental influences such as moisture or corrosion. A viscous resin matrix is applied, mostly an epoxy resin adhesive.

Component Management
16th May 2019
Light fixation for two-component epoxy resins

A light fixation for two-component epoxy resins has been introduced by DELO. Thanks to this hybrid chemistry, users benefit from faster, less complex production processes and simplified logistics. DELO-DUOPOX DB8989 provides high speed for a two-component epoxy resin, securing the components against slipping in just a couple of seconds.

Component Management
14th May 2019
Efficient RAIN RFID label manufacturing

A new development in the effort to achieve high-volume inlay manufacturing has been announced by DELO Industrial Adhesives, Mühlbauer and Impinj. The three RAIN RFID companies have successfully teamed to deliver DELO MONOPOX AC6545, supporting the high-speed assembly of copper-bonded RFID chips such as the Impinj Monza 6 family on Mühlbauer high speed assembly lines.

Component Management
11th April 2019
Structural adhesive supports Wisconsin Racing

Manufacturer of industrial adhesives for automotive, consumer and industrial electronics applications, is a sponsor of Wisconsin Racing at the University of Wisconsin. DELO has supplied Wisconsin Racing’s Formula Electric team with DELO MONOPOX HT2860 to bond together the magnet segments in the car’s electric motor. The adhesive is also used for final rotor assembly.

Component Management
6th March 2019
Temperature resistant encapsulant for electronic components

Manufacturer of industrial adhesives for automotive, consumer and industrial electronics applications, DELO, has developed an encapsulant with very high resistance to media and temperature. DELO MONOPOX GE6515 offers an optimised curing time, speeding up production processes. 

Component Management
24th January 2019
Highly filled adhesives feature good dispensing properties

Fillers in adhesives, potting compounds and encapsulants can lead to mechanical abrasion in dispensing systems. Despite such potentially abrasive behaviour, the adhesives can be dispensed reliably and precisely over the long term. This is the result of experimental tests performed by ViscoTec and DELO Industrial Adhesives, covering more than 6 million dispensing cycles.

Component Management
15th January 2019
Webinars on adhesive bonding

A new webinar program has been published by DELO. After addressing basic topics, such as adhesive-friendly design, last year, the Webinars in 2019 will focus on areas such as structural bonding and e-mobility. Adhesive bonding is considered the joining technology of the 21st century and allows for light-weight construction, miniaturisation, and multi-material design.

Component Management
24th October 2018
Structural Adhesive Offers High Temperature Stability

DELO has developed a structural adhesive that offers increased stability at high temperatures. DELO MONOPOX HT2860 achieves up to three times the strength at a temperature of 150°C compared to previous product generations.

Component Management
16th August 2018
Improving sustainability in production with solvent-free activators

DELO has developed two new activators accelerating the adhesion build-up of metal adhesives such as DELO-ML. They allow speeding up production even without containing solvents, which simplifies work safety measures. Activators reduce the curing time of metal adhesives, which achieve their strength under exclusion of oxygen. However, in contrast to metal adhesives or other reaction adhesives, most activators contain solvents.

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