DELO Industrial Adhesives
DELO Industrial Adhesives Articles
New adhesive for power semiconductors from DELO
DELO has developed an adhesive for electronics that is both thermally conductive and electrically insulating. DELO MONOPOX TC2270 shows good strength, even after standardized humidity tests with subsequent reflow cycles are performed. This new adhesive ensures fast heat transfer and long-term reliable operation of semiconductors in power electronics.
DELO reports increased revenues despite COVID-19
DELO closed the financial year that ended on March 31st with a turnover of €163 million. This is an increase of almost five percent compared to the previous year (€156 million). Despite increasing coronavirus restrictions worldwide, even the last quarter of the fiscal year contributed to this result.
Collaboration to create a new additive balancing process
DELO has collaborated with PMB, a German-based mechanical engineering company, to create a new additive balancing process for rotating parts found in electric motors, fans, pumps and turbines. This high-precision process helps bring parts into balance without having to remove any material from the product.
Collaboration to create a new additive balancing compound
DELO has collaborated with Präzisionsmaschinenbau Bobertag (PMB), a German-based mechanical engineering company, to create a new additive balancing compound technology for rotating parts found in electric motors, fans, pumps and turbines. This high-precision process helps bring parts into balance without having to remove any material from the product.
High quality materials in liquid additive manufacturing
DELO has further developed its liquid materials, creating new possibilities for liquid additive manufacturing. The high-performance materials providing different functionalities, such as transparency or flexibility can be combined in one printing process, adhere reliably, and have isotropic strength in all printing directions.
Functional materials for liquid additive manufacturing
Having further developed its liquid materials, DELO has created new possibilities for liquid additive manufacturing. The high-performance materials providing different functionalities, such as transparency or flexibility can be combined in one printing process, adhere reliably, and have isotropic strength in all printing directions. They are particularly well suited for automotive and microelectronic applications.
Compact UV LED lamp for adhesive curing
DELO has developed a particularly space-saving UV lamp for adhesive curing. The powerful DELOLUX 503 is designed for industrial applications requiring small surfaces to be bonded within seconds in serial production lines, for example for bonding cameras used in autonomous cars.
Fast curing in any shape with liquid sealants
DELO has introduced a new, silicone-free liquid sealant for the automotive, electronics, and white goods industries. Curing by light, DELO PHOTOBOND SL4165 protects from dust, air, and water. The flow-resistant, highly viscous liquid sealant can be applied in the desired height and any geometric shape.
Glob Top dispensing to spray continuously and precisely
Microdispensing in the electronics industry can help to increase the service life of individual components. Glob Top Potting, for example, protects sensitive components, usually semiconductor chips, from mechanical stresses such as vibrations or temperature fluctuations. It also protects them from external environmental influences such as moisture or corrosion. A viscous resin matrix is applied, mostly an epoxy resin adhesive.
Light fixation for two-component epoxy resins
A light fixation for two-component epoxy resins has been introduced by DELO. Thanks to this hybrid chemistry, users benefit from faster, less complex production processes and simplified logistics. DELO-DUOPOX DB8989 provides high speed for a two-component epoxy resin, securing the components against slipping in just a couple of seconds.
Efficient RAIN RFID label manufacturing
A new development in the effort to achieve high-volume inlay manufacturing has been announced by DELO Industrial Adhesives, Mühlbauer and Impinj. The three RAIN RFID companies have successfully teamed to deliver DELO MONOPOX AC6545, supporting the high-speed assembly of copper-bonded RFID chips such as the Impinj Monza 6 family on Mühlbauer high speed assembly lines.
Structural adhesive supports Wisconsin Racing
Manufacturer of industrial adhesives for automotive, consumer and industrial electronics applications, is a sponsor of Wisconsin Racing at the University of Wisconsin. DELO has supplied Wisconsin Racing’s Formula Electric team with DELO MONOPOX HT2860 to bond together the magnet segments in the car’s electric motor. The adhesive is also used for final rotor assembly.
Temperature resistant encapsulant for electronic components
Manufacturer of industrial adhesives for automotive, consumer and industrial electronics applications, DELO, has developed an encapsulant with very high resistance to media and temperature. DELO MONOPOX GE6515 offers an optimised curing time, speeding up production processes.
Highly filled adhesives feature good dispensing properties
Fillers in adhesives, potting compounds and encapsulants can lead to mechanical abrasion in dispensing systems. Despite such potentially abrasive behaviour, the adhesives can be dispensed reliably and precisely over the long term. This is the result of experimental tests performed by ViscoTec and DELO Industrial Adhesives, covering more than 6 million dispensing cycles.
Webinars on adhesive bonding
A new webinar program has been published by DELO. After addressing basic topics, such as adhesive-friendly design, last year, the Webinars in 2019 will focus on areas such as structural bonding and e-mobility. Adhesive bonding is considered the joining technology of the 21st century and allows for light-weight construction, miniaturisation, and multi-material design.
Structural Adhesive Offers High Temperature Stability
DELO has developed a structural adhesive that offers increased stability at high temperatures. DELO MONOPOX HT2860 achieves up to three times the strength at a temperature of 150°C compared to previous product generations.
Improving sustainability in production with solvent-free activators
DELO has developed two new activators accelerating the adhesion build-up of metal adhesives such as DELO-ML. They allow speeding up production even without containing solvents, which simplifies work safety measures. Activators reduce the curing time of metal adhesives, which achieve their strength under exclusion of oxygen. However, in contrast to metal adhesives or other reaction adhesives, most activators contain solvents.
Light-curing acrylate shuts out water, humidity & dust
DELO Industrial Adhesives has developed a light-curing acrylate with excellent peel resistance for seal-bonding. DELO PHOTOBOND GB4033 has features that make it suitable for universal use, for example, in electronic applications. Designed for service temperatures ranging from -40 to +120°C, it is particularly suited for material joints that require adhesives not only to be strong but also flexible and tight.
Adhesive makes a quick fix
DELO has introduced an adhesive for optoelectronic applications. Called DUALBOND OB786, it is particularly suited for fixing components within seconds while ensuring precision and high strength. After an irradiation time of less than one second, the build-up of adhesion is already significant; after five seconds, the compression shear strength on glass even reaches 18 MPa
High-power curing lamps are touchscreen-controlled
DELO Industrial Adhesives introduces a new generation of the DELOLUX 20 and DELOLUX 202 LED area lamps with higher intensities. Both lamps can be operated and controlled via the touch screen of the newly developed DELOLUX pilot. The LED curing lamps ensure utmost reliability in adhesive curing. Their slim design makes it possible to combine any number of lamp modules of the same type, allowing homogeneous curing of large bonding areas.