Since 2018, DELO has saved 3,200 tons of carbon dioxide with a new solution for shipping adhesives. This was achieved with shipping containers that work according to the thermos flask principle. Adhesives enable lightweight design and resource-saving miniaturisation. For technical reasons, many high-tech adhesives have to be transported refrigerated or frozen.

DELO has launched two new devices for controlling and powering LED spot lamps. The DELOLUX pilot S4i and S4T models allow the use of more powerful lamp heads in an extremely compact design.

Infotech has introduced a novel, fully automated 3D printing system designed specifically for printing liquid materials and multi-material structures. Thanks to the parallel operation of several dispensing heads, different materials can be processed in one printing step. Complemented by DELO's high-performance epoxy resins, this enables the production of components with different physical property ranges.

DELO has developed two liquid pressure-sensitive adhesives that have similar properties to (double-sided) adhesive tapes, but are applied in liquid form. DELO PHOTOBOND PS4130 and DELO KATIOBOND PS6372 can be dispensed easily and join components accurately with pressure.

DELO has developed adhesives that have similar properties to (double-sided) adhesive tapes but are applied in liquid form. This helps users save time and costs in the production process. The liquid pressure-sensitive adhesives can be dispensed accurately and once the components have been joined, they can be further processed immediately in a fully automated process.

DELO has introduced a new LED lamp for speeding up adhesive curing UV. The spotlight source DELOLUX 504 features the latest generation of UV LEDs, achieving three times the intensity of the previous model. It was developed for high-speed production in the electronics and automotive industries that require small areas to be irradiated and equipment to be easily integrated into existing systems

SUSS MicroTec has announced a collaboration with DELO. The central focus of the cooperation is the development and qualification of enhanced process solutions for micro-imprint lithography applications, especially the interaction of equipment and materials.

DELO has launched a new die attach adhesive to replace the previous DELO MONOPOX MK096. DELO MONOPOX EG2596 features high strength even after aging and can be dispensed even more precisely than its predecessor.

A light- and humidity-curing sealant for connectors that are often found in vehicle control units or sensors has been introduced by DELO.

DELO has developed an adhesive for electronics that is both thermally conductive and electrically insulating. DELO MONOPOX TC2270 shows good strength, even after standardized humidity tests with subsequent reflow cycles are performed. This new adhesive ensures fast heat transfer and long-term reliable operation of semiconductors in power electronics.

DELO closed the financial year that ended on March 31st with a turnover of €163 million. This is an increase of almost five percent compared to the previous year (€156 million). Despite increasing coronavirus restrictions worldwide, even the last quarter of the fiscal year contributed to this result.

DELO has collaborated with PMB, a German-based mechanical engineering company, to create a new additive balancing process for rotating parts found in electric motors, fans, pumps and turbines. This high-precision process helps bring parts into balance without having to remove any material from the product.

DELO has collaborated with Präzisionsmaschinenbau Bobertag (PMB), a German-based mechanical engineering company, to create a new additive balancing compound technology for rotating parts found in electric motors, fans, pumps and turbines. This high-precision process helps bring parts into balance without having to remove any material from the product.

DELO has further developed its liquid materials, creating new possibilities for liquid additive manufacturing. The high-performance materials providing different functionalities, such as transparency or flexibility can be combined in one printing process, adhere reliably, and have isotropic strength in all printing directions.

Having further developed its liquid materials, DELO has created new possibilities for liquid additive manufacturing. The high-performance materials providing different functionalities, such as transparency or flexibility can be combined in one printing process, adhere reliably, and have isotropic strength in all printing directions. They are particularly well suited for automotive and microelectronic applications.

DELO has developed a particularly space-saving UV lamp for adhesive curing. The powerful DELOLUX 503 is designed for industrial applications requiring small surfaces to be bonded within seconds in serial production lines, for example for bonding cameras used in autonomous cars.

DELO has introduced a new, silicone-free liquid sealant for the automotive, electronics, and white goods industries. Curing by light, DELO PHOTOBOND SL4165 protects from dust, air, and water. The flow-resistant, highly viscous liquid sealant can be applied in the desired height and any geometric shape. 

Microdispensing in the electronics industry can help to increase the service life of individual components. Glob Top Potting, for example, protects sensitive components, usually semiconductor chips, from mechanical stresses such as vibrations or temperature fluctuations. It also protects them from external environmental influences such as moisture or corrosion. A viscous resin matrix is applied, mostly an epoxy resin adhesive.

A light fixation for two-component epoxy resins has been introduced by DELO. Thanks to this hybrid chemistry, users benefit from faster, less complex production processes and simplified logistics. DELO-DUOPOX DB8989 provides high speed for a two-component epoxy resin, securing the components against slipping in just a couple of seconds.

A new development in the effort to achieve high-volume inlay manufacturing has been announced by DELO Industrial Adhesives, Mühlbauer and Impinj. The three RAIN RFID companies have successfully teamed to deliver DELO MONOPOX AC6545, supporting the high-speed assembly of copper-bonded RFID chips such as the Impinj Monza 6 family on Mühlbauer high speed assembly lines.