Hirose has launched a miniature FPC-to-board connector designed for power line connection in portable devices such as drones, IoT modules, laptops, medical devices, smart phones, tablets, wearables and more. With a space-saving design that includes a 0.35mm pitch, stacking height of only 0.6mm, and depth of 1.7mm, the low-profile BM28 Series hybrid FPC-to-board offers design flexibility and enables the miniaturisation of portables devices.
The hybrid BM28 Series connector is rated up to 5 Amps per pin for power contacts and 0.3 Amp per pin for signal contacts. In addition, the FPC-to-board connector system supports USB 3.1 gen.2 (10 Gbps) transmission.
Offering simple and easy mating operation, the BM28 Series utilises guide ribs that provide self-alignment up to 0.3mm in the X direction and 0.24mm in the Y direction. A highly reliable two-point contact design combined with a robust contact latching design provides a mating force that is resistant to intense vibration and drop impact.
This locking design ensures secure mating with a clear tactile click. The BM28 Series connector also utilises a metal guide that prevents housing damage due to incorrect mating. The metal guide design ensures that if the header and the receptacle should be mated incorrectly, the metal guide ribs prevent housing damage. The hybrid BM28 Series connector is currently available in a 24-position signal version that features two power positions.
"Designed for mobile and portable device connectivity, the compact BM28 Series hybrid connector eliminates the need for separate power and signal wire-to-board connectors. This simplifies design and assembly, while providing significant cost savings," said Bill Kysiak, Product Marketing Manager for Hirose Electric USA.
"The cost-efficient solution also reduces the occupied mounting area in comparison with comparable connectors on the market. This enables our customers to reduce the size of their end-products and meet consumer demands."
The BM28 Series connector has a rated voltage of 30 V AC/DC, power contact resistance of 30 milliohm maximum, signal contact resistance of 100 Megaohm maximum, insulation resistance of 100 Megaohm minimum, and an operating temperature of -40ºC to +85ºC.