Test & Measurement

Mirtec highlights AOI at productronica

25th October 2015
Peter Smith
0

MIRTEC will launch its advanced MV-6 OMNI 3D Series in Hall A2, Stand 139 at productronica. The new high-speed, high-performance 3D AOI machine boasts 15 mega pixel CoaXPress camera technology, as well as advanced eight phase color lighting system. 

The machine includes a ten micron/pixel prevision telecentric compound lens design, integrated ten mega pixel side-viewer camera system, and a precision closed loop AC servo drive motor system. Also on display will be Mirtec’s flagship MV-9 AOI system, which is said to achieve the highest productivity and ultimate inspection performance.

For the 3D measurement the MV-9 system is working with the "Shadow Free" Moiré Phase Shift image processing. Additionally it is equipped with the 6 Phase colour lighting system for an optimized recognition of lifted leads. At the show, the MV-9 will be linked to a YXLON Cheetah with SmartLoop. The MV-9 utilizes a high resolution digital 15 MP camera technology with telecentric lens. The four 10 MP side cameras (Side-Viewer®) offer a spacial test and provide valuable information for a secure and reliable detection of side defects. Also, the inspection of complex components is greatly enhanced.

The MV-9 is now also available with a 25 MP camera and 7.7 µm lens for components down to 03015. Also on display will be the MS-15 In-Line SPI System. It also uses the shadow free Moiré Phase Shift Imaging technology to inspect solder paste depositions on PCBs post screen print for insufficient or excessive solder, shape deformity, shift of deposition and bridging. The MS-15 uses the same high precision platform as MIRTEC’s MV-9 Series.

Both systems, the MV-9 and the MS-15, can additionally be equipped with the new CoaXPress which leads to an increase of inspection speed of around 25% compared to the standard camera technology. CoaXPress combines the simplicity of coaxial cable with state of the art high speed serial data technology. The combination of these two features provides a revolutionary leap forward in high speed image and data transmission.

 

 

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