Dialog’s WiFi networking SoC earns top results for power efficiency
Dialog Semiconductor has announced that its DA16200 SoC has scored 815 on the EEMBC IoTMark-WiFi benchmark. The DA16200’s achievement solidifies Dialog’s position as a leader in the ultra-low-power WiFi networking SoC market.
Lossless zero-cross detection in LinkSwitch-TNZ ICs
Power Integrations has announced LinkSwitch-TNZ, a new switching power supply IC that combines offline power conversion, lossless zero-cross detection and, optionally, X-capacitor discharge functions in a compact SO-8C package. The highly efficient LinkSwitch-TNZ IC can be used for non-isolated buck and buck-boost power supplies up to 575mA output current and provides up to 12W output for universal-input isolated flyback designs.
Single-channel interface ICs for USB power delivery
In order to strengthen its portfolio of devices supporting USB power delivery, FTDI Chip has unveiled the FT23xHP series. These compact, streamlined interface ICs are supplied in QFN packages. They support operation across just one channel, thereby enabling systems that are subject to space or budgetary constraints to still benefit from elevated levels of power delivery via their USB ports.
Solid state high power MPM for EW and radar
TMD Technologies has announced the addition of a new solid state power amplifier (SSPA) to its range of innovative products for defence EW and radar applications. Compact and lightweight, the new broadband PTS10147 operates over the two to six gigahertz frequency range with a high power of 100W (pulsed or CW) and a linear gain of around 60 dB.
OptiMOS TOLG for improved TCoB robustness
With the innovative TO-Leadless (TOLL) package, Infineon now offers two new OptiMOS power MOSFET packages in the TOLx family: TOLG (TO-Leaded with Gullwing leads) and TOLT (TO-Leaded Top-side cooling). Together, the TOLx family offers very low R DS(on) and a high-current rating over 300A to increase system efficiency in high-power density designs.
Power MOSFET provides On-resistance of 1.5mΩ at 4.5V
New Yorker Electronics has released the new Vishay Siliconix 30V N-Channel TrenchFET Gen V power MOSFET that delivers increased power density and efficiency for both isolated and non-isolated topologies.
Amplifier module works in CW or pulsed mode
A high power amplifier module from Elite RF is now in stock at RFMW with full design and sales support.
Power management ICs cover ASIL B and ASIL D safety
The VR5510 multi-output, automotive-qualified power management ICs (PMICs) from NXP Semiconductors is in stock at distributor Mouser Electronics, Inc.
EBV, Infineon partner for CoolSiC initiative
EBV Elektronik, an Avnet company, has agreed to be the first distributor to run a programme dedicated to Infineon’s silicon carbide (SiC) based CoolSiC technology.
Integrated SiC power module on ceramic heat sink launched
At the beginning of May, CeramTec launched a new ceramic power semiconductor module for drive inverters in e-mobility. The globally operating high-performance ceramics specialist is now presenting the test results, which demonstrate the importance of ceramic materials for innovative drive concepts.