Hamamatsu Back-Illuminated InGaAs Linear Image Sensors for Food Inspection

Hamamatsu Photonics introduce the new G11135 series of InGaAs linear image sensors, designed for foreign object inspection. These image sensors consist of an InGaAs photodiode array and CMOS chip containing a charge amplifier array, offset compensation circuit, shift register and a timing generator. The G11135 series are back-illuminated sensors and use indium bumps to connect the InGaAs array with the CMOS chip. This bonding method removes the need for gold wire bonds which significantly improves the reliability and performance of the image sensor.