The modular design allows the SEPW devices to be assembled into string arrays simply by connecting the modules in series and due to the high density of LEDs that can be achieved, they provide excellent colour balance throughout
Additionally, this minimises the distance which power and control lines would have to run between LEDs and from the LEDs to the control electronics.
Despite their high light emissions – 50 lm, output with all LEDs illuminated – the SEPW devices are not power hungry, using just 100lm/W (@ 20mA ) with all LEDs illuminated which is equivalent to fluorescent lamps (HCFL)
The white thermoplastic case has exceptional thermal management characteristics achieved through a heatsink which is moulded on to the bottom of the package. The heatsink can be fitted directly to an external radiator through the PCB for superior heat conduction allowing denser module population supported by their 5.23 mm × 13.7 mm case footprint, and low 2.5 mm overall package height
The white resin compound is especially formulated for high levels of reflection and transmission of the light generated. The leadframe is plated with silver, providing a highly-reflective surface for the bottom and sides of the emitting area. The terminals and heatsink are also silver-plated.
The SEPW devices can be mounted in tight arrays on a single PCB substrate for ease of manufacture and to provide a dense, uniform appearance when illuminated.