Design
APEC 2024 announces call for industry session proposals
APEC 2024, to be held in Long Beach, California, from 25―29 February 2024, announces the call for submission of Industry Session Proposals for the conference’s increasingly popular presentation series.
Production test: the key to supplying the highest quality ASICs
One of the most desirable trends in electronics system design is to push as much functionality as possible into a single device.
Dual-band evaluation board for Wi-Fi and Bluetooth
In stock at distributor Digi-Key is Silicon Labs’ RS9116 wireless dual-band evaluation board.
Low profile SMD common mode chokes
knitter-inductive implemented the new W-Series of low-profile SMD Common Mode chokes for noise suppression on the market.
AMD extends Spartan 6 product lifecycle
The Spartan 6 devices, with high IO-to-logic ratios in small form-factor packaging, continue to be well suited for customers in industrial, medical, vision, and automotive markets as well as other markets, like communications, where simple bridging is required.
Dolphin selects Imperas for processor design verification
Imperas has announced that ImperasDV has been adopted by Dolphin Design for RISC-V processor verification for the Panther DSP/AI Accelerator IP from Dolphin Design.
Sensor evaluation kit serves as benchtop tool
Distributor Mouser Electronics is now stocking the ASEK-20 sensor evaluation kit from Allegro MicroSystems.
Vector unit delivers 2048b of computation per cycle
Semidynamics has announced its new, entirely customisable Vector Unit to accompany its range of fully customisable 64-bit RISC-V cores.
Siemens, SPIL collaborate on 3D verification workflow
Siemens Digital Industries Software has collaborated with leading Outsourced Assembly and Test (OSAT) company Siliconware Precision Industries (SPIL) to develop and implement a new integrated circuit (IC) package assembly planning and 3D layout vs. schematic (LVS) assembly verification workflow for SPIL’s fan-out family of advanced IC packaging technologies.
Bostik and Polytec PT launch new TCA range
As a result of their collaboration, Bostik and Polytec PT are launching a new range of thermal conductive adhesives (TCA).