Design
New family of 600V SJ MOSFET products with fast recovery body diodes
Magnachip has announced that the Company released a new family of 600V Super Junction Metal Oxide Semiconductor Field Effect Transistors (SJ MOSFETs) consisting of nine distinct products featuring proprietary design technology.
Nexperia introduces portfolio of I2C GPIO expanders
Nexperia has introduced a portfolio of 16-channel I2C general-purpose input-output (GPIO) expanders designed to increase flexibility and reuse in electronic systems.
Resource library provides hub for robotics designs
Mouser Electronics has opened an easy-to-navigate resource library to support engineers to develop industry-leading robotics designs.
Rapid Silicon launches Vega eFPGA IP
Rapid Silicon has announced the launch of its Vega eFPGA IP. This product is an embeddable standalone FPGA IP core, which is flexible, powerful and efficient to enable a programmable solution to your SoC.
Cadence and TSMC collaborate on N16 79GHz mmWave design reference flow
Cadence has announced that it has collaborated with TSMC for the Cadence Virtuoso platform for the 79GHz mmWave design reference flow on TSMC’s N16 process.
Alps Alpine selects Siemens Symphony platform
Siemens Digital Industries Software has announced that Alps Alpine is using Siemens Symphony platform for mixed-signal applications when developing and verifying its newest, functionally safe capacitance detection integrated circuit (IC). Alps Alpine’s new offering enables proximity, touch, and spatial gesture detection across a wide range of human-machine interface systems in demanding applications such as automotive and smart device space...
Melexis Innovation Lab puts the ‘R’ in Research & Development
A dedicated team at Melexis is working on the ‘pre-development’ of customer-driven innovations in a newly formed Innovation Lab.
SEGGER’s SystemView adds heap monitoring
SystemView, SEGGER’s real-time recording, visualisation, and analysis tool for embedded systems, can now monitor how applications use dynamic storage.
Electrically conductive adhesive: the solution for high-performance electronics
Electrically conductive adhesive (ECA) is a revolutionary material that is changing the game for electronic devices.
Synopsys, TSMC and Ansys strengthen ecosystem collaboration
Accelerating the integration of heterogeneous dies to enable the next level of system scalability and functionality, Synopsys has strengthened its collaboration with TSMC and Ansys for multi-die system design and manufacturing.