Dr. Lee will chair a two-part advanced professional development course on Choosing Solders for the New Era. Part 1 will be on Feb. 12 from 9 a.m.-noon, and part 2 will the same day from 2-5 p.m. Dr Lee will also moderate a technical session on Solder Reliability on Feb. 14 from 1:30-3 p.m.
Eric Bastow, Assistant Technical Manager, will moderate a session on Miniaturization on Feb. 16 from 9-10 a.m.; and Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, will moderate a session on SIR Reliability on Feb. 14 from 3:30-5 p.m.
Technical presentations by Indium Corporation experts will include:
- Does Thermal Cycling Impact the Electrical Reliability of No-Clean Solder Paste Flux Residue? by Eric Bastow, Assistant Technical Manager
- Process Optimization for Fine-Feature Solder Paste Dispensing by Maria Durham, Technical Support Engineer for Semiconductor and Advanced Assembly Materials
- Voiding Performance with Modified SAC Alloys for Automotive Applications and Understanding the Effect of Different Heating Cycles by Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials