Anna Wood, Editor at Electronic Specifier, picks her top 5 cables/connecting products released in April 2026.
Samtec cable assemblies test 224Gbps PAM4
Samtec announced the release of the BE71A Bulls Eye Phase & Amplitude Stable Test Assembly. Optimised for use out to 71GHz in support of 224Gbps PAM4 SerDes testing, this new product combines the popular Bulls Eye assembly’s space-saving compression-mount design with Samtec’s distinctive orange NitrowaveTM high-performance microwave cables.
As frequencies increase, phase matching between cable assemblies becomes more important. This is because precise signal timing is critical when assessing performance or detecting faults in a measurement. The BE71A test assembly offers industry-leading 0.5ps phase matching. This matters for signal integrity, reliability of transmission, and error reduction. The 71GHz Nitrowave cables in the BE71A assembly were specifically designed to maintain phase stability while test fixtures and cables are tweaked and adjusted.
IP-rated USB type C connectors include UV-glued O-ring models
Same Sky’s Interconnect Group announced the continued expansion of its USB Type C connectors line with a range of new IP rated models. The UJ family now offers waterproof USB receptacles with IPX5, IPX6, IPX7, IPX8, IP66, IP67, and IP68 ratings, making them ideal for applications where moisture and environmental contaminants are a concern. All models are reflow solder compatible, including the following parts that utilise UV-glued O-rings capable of withstanding reflow solder temperatures to further simplify the assembly process:
- UJC-H-G-SMT-1-P6-TR-65
- UJ32-C-H-G-SMT-4-P24-TR-68
- UJ20-C-V-G-SMT-P16-TR-66
- UJ20-C-H-G-MSMT-P16-TR-67
- UJ20-C-H-G-SMT-P16-TR-67
These IP rated USB Type C receptacles conform to a variety of USB standards from USB 2.0 up to USB 4.0 Gen 3×2 with data transfer speeds up to 40Gbps as well as power delivery up to 240W at 46V and 5A. This offering also includes power-only models that remove the data transfer pins to create a more cost-effective solution for designs where charging or power is the sole function.
Molex accelerates AI cluster deployment
Molex has expanded its Co-Packaged Optics (CPO) interconnect toolkit designed to eliminate the most critical bottlenecks in AI cluster scaling. Additionally, Molex has introduced the High-Radix Optical Circuit Switch (OCS) Platform to deliver a complete optical switching fabric to meet emerging data requirements. By providing flexible, high-density optical switching, AI infrastructure operators can dynamically reconfigure network topologies and maximise utilisation of valuable compute resources.
“The rapid growth of artificial intelligence, from large‑scale model training to real‑time inference, is placing unprecedented demands on data‑centre networks,” said Peter Lee, vice president and general manager, Optical Solutions Business Unit, Molex. “Our goal is to deliver comprehensive and differentiating optical solutions that support the next generation of AI infrastructure – enabling greater scalability, improved operational efficiency and significantly enhanced energy efficiency as data centre networking demands continue to accelerate.”
Wire-to-board connectors bring space-saving benefits
Anglia Components is directing engineers looking for connectors that combine space-saving design, robust performance, and long-term durability towards HIROSE’s KM32 Series Wire-to-Board connectors. They are engineered to meet the toughest demands of automotive and industrial applications.
Designed with precision and reliability at its core, the KM32 Series delivers durability and space-saving benefits, making it the ideal choice for automotive and industrial environments where every millimetre counts. Featuring a 2.0mm pitch and 0.5mm contact tab size, these connectors enable significant device downsizing without compromising strength or stability.
Next-gen MIL-HD2 connector series available through Powell Electronics
Now available through Powell Electronics is the MIL-HD2 connector series from Amphenol, a next-generation, SOSA-aligned solution engineered to meet the most demanding requirements of modern military embedded systems, e.g. embedded computing, radar, electronic warfare, and high-speed communications systems.
Designed in alignment with The Open Group Sensor Open Systems Architecture (SOSA) technical standard and supporting VITA 91 requirements, the MIL-HD2 series delivers industry-leading density and performance for 3U applications. Supporting data rates up to 56Gb/s PAM4, the connector family enables system architects to address increasing bandwidth demands while maintaining compatibility with commercial off-the-shelf (COTS) architectures and avoiding costly redesign cycles.
