Molex introduces 1.27mm pitch Picoflex SMT latched header
Molex Incorporated has introduced the new Picoflex SMT Header with positive retention latches to provide a robust and reliable wire-to-board connection with increased retention force for rugged applications and high-vibration environments. Adding to Molex’s already extensive range of Picoflex connectors, which are suitable for many high-density applications where space is at a premium and power and signal are required, these more rugged versions are suited to a variety of demanding applications for the industrial, automotive, medical and multimedia industries.
“The innovative and patent-pending Picoflex latch design increases the retention force between the header and receptacle by at least 50% compared to our standard friction-lock header,” says Desmond Ryan, Product Manager of Molex. “This greater retention force ensures a robust and reliable connection in applications where the harness can be placed under a push/pull force or where assembly involves movement of the cable to prevent the header and receptacle from unmating.”
A typical example of where the Picoflex SMT latched header is being applied is where part of a harness protrudes from the assembly. Without the positive retention latches, tension on the harness, especially during the final assembly process, can cause the header and receptacle to partially or completely unmate. This partial unmating is a cause for concern during initial in-factory testing where the results verify electrical contact and functionality but the product then fails in the field – the latched Picoflex minimises such failures.
Featuring a standard interface design, the Molex Picoflex surface-mount latched header is backward compatible and mates with existing Picoflex 90327 receptacles. It features a high-profile polarising peg, which avoids mismating of the header and receptacle and also acts as a lead-in to aid assembly. In addition, the polyphthalamide (PPA) housing material enables the header to tolerate reflow temperatures of up to 260°C. The gold plating option, as opposed to the standard tin plating, allows for easier mating and higher mating cycles and is highly recommended for environments running at consistently high temperatures or in low current applications.