Products
Renesas - Power Semiconductor Devices with High Current and Low Power Loss for Consumer Motor Drive Applications
Contribute to Longer Battery Life for Power Tools and Power-Assisted Bicycles
Binder - Shielded M12 connectors have 8 to 10mm cable outlet
Binder UK has added to its extensive M12 connector range, with the introduction of an eight-pole shieldable connector with a cable outlet of 8 to 10mm.
Toroidal surface mount power inductor aimed at compact consumer devices
Murata Power Solutions today announced the 8300 series of toroidal surface mount power inductors. These miniature low profile devices, measuring only 7.8 x 5.20 x 1.8mm, suit a broad range of handheld consumer electronics designs where the available PCB footprint and height are restricted.
MEDER’S MINIATURE REED SENSOR PERFORMS BEYOND ITS SIZE CLASS AND OFFERS UNIQUE OPTION TOO
Claiming performance ‘beyond all other reed sensors in its size class’, the MEDER MK24 really does punch well above its weight.
Opto Diode Introduces Absolute X-ray Photodiodes for Solar Spectrum Studies
Opto Diode now offers semiconductor radiation sensors for detecting photons and other particles. The new product line includes the IRD AXUV 100GX Absolute X-ray Photodiode. The X-ray detector possesses known active silicon thicknesses and 100 percent internal quantum efficiency, making possible absolute measurement of X-ray flux with energies 100 keV and beyond.
TE CONNECTIVITY INTRODUCES SMALLER FLEXIBLE PRINTED CIRCUIT CONNECTORS TO MEET MINIATURIZATION TREND
In view of the continuing trend of miniaturization in the consumer devices market, TE Connectivity, formerly Tyco Electronics, today announced 0.25mm pitch Flexible Printed Circuit connectors.
Developing OLED Displays with CRAIC Technologies Microscope Spectrophotometers
The 308 FPD™ spectrophotometer is used to measure color and relative intensity on the micron scale allowing for microscopic spatial resolution mapping. It is easily attached to inspection microscopes and probe stations.
Safe inline X-Ray Inspection of double-sided equipped BGA Components
GOEPEL electronic’s 3D x-ray inspection system OptiCon X-Line 3D enables a safe quality control of solder joints on opposed mounted BGA components, e.g. in double-sided equipped DDR-RAM modules. In the inline production process, single-sided and double-sided equipped PCBs can be inspected within one test run.
Super power near infrared array achieves extreme brightness
AP Technologies are pleased to announce the international release of the newest version of Opto Diode Corporation’s “Metal Reflector Array” (MRA) technology, now using the latest 1mm power chips.
Austin-Bergstrom further improves noise management with Brüel & Kjær
Upgraded Brüel & Kjær Monitoring System Equips Austin-Bergstrom International Airport to Further Improve Noise Management