MICROTRONIC Reports Good Response to New Solderability Tester

Microtronic experienced an extraordinary amount of visitors at their booth for the entire duration of SMT Nuremberg which was held over a 3 day period. Microtronic’s representatives were available throughout the exhibition to offer demonstrations of the LBT210 system and were consistently on hand to answer all of their visitors’ queries.
According to Ernst Eggelhaar, Managing Director of Microtronic GmbH, “Our new system is precisely what customers have been waiting for. The positive feedback we have received further proves that we have chosen the optimal time to design and manufacture this system. The LBT-210 automatic and PC-controlled solderability tester is a revolutionary system that meets today’s current challenges. “
The most common method is a test using a solder pot filled with the same alloy that is used in the production line. Solder pots are interchangeable when more than one solder alloy is in use. The device to be tested lowers with a defined speed into the molten solder. The exact position of the surface of the solder bath is determined by non-contact laser sensor. A scraper removes all oxidation from the surface of the molten solder prior to each test.

A revolutionary new method is available that tests using solder paste and a temperature profile. A component is placed on printed solder paste and heated through the same temperature profile that is used in production. All force parameters and values during the heating cycle are monitored and saved. This is the only known existing method of simulating and qualifying the solder profile of an in-line production solder furnace in conjunction with different solder pastes and components.

All information and test data are saved in a local SQL database. This ensures all data is available through progressive search filters. For example, the performance of component “A” over the last three years can be determined within seconds, and solderability can be compared in the case of having the same component from different suppliers. Results can be summarized in curves or the mean value can be calculated. All standards have been considered and the good/bad criteria can be displayed in the measurement curves. If required, videos can be taken during the measurements with the built-in Webcam. To make the software even easier to use, a language feature has been included. Users can adapt all text fields in the software in any language. Additionally, new languages that are not included can be added.

The system features a vibration-absorbing construction, vibration-free motors, component position better than 3µm. CE certified, the system offers solder-level measurements for solder pots using laser technology. Software exports measurement data in CVS and text files, as well as measurement curves and picture files.

The tester supports all industry-approved test standards, including IEC 60068-2-54 and 60068-2-69; IPC/EIA J-STD-003A; IPC/EIC7 JEDEC J-STD-002B; EIA/JET-7401; and MIL-883-2022. Other standards can be implemented easily. As an additional benefit, LBT-210 measures the solderability of PCBs and galvanized products, wettability forces, and both flux and solder paste characteristics.