Automated X-Ray PCB inspection to be demonstrated by YESTech-Europe in Nuremberg SMT/Hybrid/Packaging exhibition’s live production line

The X3 performs complete inspection of hidden solder joints and other critical features found in electronic assemblies, PCBs and packaged semiconductors including BGA, POP and embedded components. The X3 automatically checks for opens and shorts, insufficient or excess solder, lifted leads and tombstoned parts, voids, and component presence and position.

The X3’s results are achieved using 2D and 3D inspection with unsurpassed image quality. Nordson YESTECH’s patented Digital Tomosynthesis Technology acquires multiple images in different slice heights in one inspection cycle. The images can discriminate between components on the top and bottom slices of double sided boards for unimpeded automated inspection. The X3’s complete inspection coverage and extremely low false failure rate are the results of newly available image processing technology which integrates several techniques and inspection algorithms.

The X3’s fast throughput is complemented by its short setup time; programming is fast and intuitive. The utilisation of standard package libraries simplifies training and ensures program portability across multiple manufacturing lines. The X3 can be integrated with Nordson YESTECH automated optical inspection (AOI) for fault detection that covers nearly all process defects. With optional remote programming and SPC software, the X3 provides a comprehensive yield enhancement solution.

Visitors can see the live automated X-Ray inspection demonstration at any time during the exhibition by visiting Booth 430 in Hall 6. This booth is operated by the Fraunhofer Institut, hosts of the complete demonstration production line. Technical staff from YESTech-Europe will be on hand to discuss how the X3 can contribute to electronics manufacturers’ inspection needs, as well as answering any other questions about Nordson YESTECH’s yield enhancement technology.