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Altatech Adds Features to its High Throughput Wafer Macro Inspection System

7th October 2008
ES Admin
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Altatech Semiconductor has made major enhancements to AltaSight, its full field high throughput wafer macro inspection system. The novel concept of wafer positioning allows the system to simultaneously inspect the front side and the back side of the wafer (200/300 mm), while the throughput remains at a high 100 wph.

Jean-Luc Delcarri, President of Altatech, commented the enhancement: “This addition to our product range makes the AltaSight DSI the only inspection tool on the market capable of a high throughput wafer inspection (on both sides in parallel), and further strengthens our position as an innovative and dynamic equipment supplier to the global semiconductor industry”.
This new patented capability is field retrofitable on all existing AltaSight SL300 systems, and will be available for new system orders from October 2008

Following the addition of simultaneous front and back side macro inspection capability for bare wafer and engineered substrates, Altatech is pleased to announce the introduction of a further advanced function on its AltaSight, product line: the darkfield inspection.
The independent dark field station will upgrade the AltaSight to enable to detect defects and particles down to the1µm range. As the company focus remains on productivity, the darkfield inspection is performed during hidden time, thus maintaining the exceptional high throughput of 100 wph in production.

“This makes the AltaSight the only system offering nanometer sensitivity for slip lines detection at 100wph, with double side inspection and advanced macro inspection capability in parallel” commented Jean-Luc Delcarri. “In a fab production line, this allows the replacement of several tools using different technologies with only one system without compromising on throughput”.
This new patented dark field module will be available for shipments of AltaSight tools starting February 2009.

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