Pending

Alpha Soldering Materials at SMT Show

20th May 2010
ES Admin
0
Alpha - Cookson Electronics Assembly Materials will show its extensive range of Solder and soldering related chemicals on stand 9.624 at SMT / Hybrid Packaging in Nurnberg. On show for the first time in Europe will be ALPHA® SACX Plus™ 0307, a low silver, lead-free alloy specially designed with proprietary additives to deliver soldering and reliability performance similar to higher silver SAC alloys (eg, SAC305 etc.) at up to 30% lower alloy cost.
This SACX 0300 variant is used to stabilize/reduce the copper content in the wave solder bath, depending on process conditions. As with all Alpha Metals' wave solder alloys, Alpha's proprietary Vaculoy® process is used in the manufacturing route to remove certain impurities, particularly oxides.



Of interest to those concerned about the potential human health and environmental dangers posed by halogens, will be the Alpha range of “Zero Halogen” solder pastes, fluxes and cored solder wires. The result of extensive research and development, these products truly represent “halogen-free” with no compromise in performance.



Also exhibited for the first time will be ALPHA® CVP-360, a halogen-free solder paste, available in ALPHA’s SACX ® alloys that offer reflow process yields comparable to higher silver SAC 305 and SAC 405 alloys. CVP-360 offers extremely high in-circuit pin test yields, which can reduce circuit board assembly process cycle time. With its excellent print volume repeatability, ALPHA® CVP-360 also provides value by reducing the defects associated with print process variability



A further new product introduction of interest to surface mount assemblers will be Alpha® Nickel-Cut™ stencils; hybrid stencils, combining the durability of electroformed nickel with the fast availability of laser cut stencils, for customers requiring a long life product with outstanding print performance… in a hurry! Alpha® Nickel-Cut™ stencils are available in a range of thicknesses, thickness in 0.5 mil increments, to optimize transfer efficiency.

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