Passives

Displaying 11 - 20 of 2872

Thickness of three-terminal multilayer ceramic capacitors reduced

Thickness of three-terminal multilayer ceramic capacitors reduced
Taiyo Yuden has announced the launch of its 1005-size threeterminal multilayer ceramic capacitor A3K105BBJ106MR (1.0x0.5x0.5mm, with height as the maximum value, capacitance of 10μF, and rated voltage of 4.0V). Three-terminal multilayer ceramic capacitors, which have a lower ESL than the popular two-terminal multilayer ceramic capacitors, can reduce impedance in the high frequency range and contribute to the stable operation of ICs that are driven at high speed.
26th March 2019

IHLP saves space with 2020 case size

IHLP saves space with 2020 case size
The Automotive Grade IHLP low profile, high current inductors range at Vishay Intertechnology has been expanded with a new device in the 2020 case size. The Vishay Dale IHLP-2020BZ-5A combines a high operating temperature to +155°C with a low profile of 2 mm to save space in under the hood automotive applications.
21st March 2019

Wet tantalum capacitors deliver high CV performance

Wet tantalum capacitors deliver high CV performance
AVX Corporation has announced that several of its TWA Series axial-leaded, hermetically sealed wet electrolytic tantalum capacitors are now qualified to MIL-PRF-39006/33A. Designed to deliver high reliability, high CV performance in harsh-environment military, defence, avionics, and industrial applications, including satellites, DC/DC power supplies, power converters, bulk energy storage, and pule power circuits.
15th March 2019


Liquid cold plates supply cooling for high-powered electronics

Liquid cold plates supply cooling for high-powered electronics
With today’s high-powered semiconductors and IGBT modules, air cooling is often an inadequate method of preventing a costly thermal breakdown. For cooling high-powered electronics, IGBT modules, lasers, wind turbines, motor devices, automotive components or medical equipment, engineers are looking to liquid cooling solutions and cold plates are a preferred method for supplying localised cooling to high-powered electronics.
15th March 2019

Passive components enable smaller solution and PCB-less mounting

Passive components enable smaller solution and PCB-less mounting
  Melexis has introduced the MLX92223, a PCB-less 2-Wire Hall-Effect Latch with integrated passives (392Ω resistor and decoupling capacitor), making it compatible with industry-standard Electronic Control Units (ECUs) without the need for any additional external components.
5th March 2019

1.5W chip resistors increase design flexibility

1.5W chip resistors increase design flexibility
A series of high voltage thick film chip resistors that offer high power ratings up to 1.5 W and working voltages to 3000 V in five compact case sizes ranging from 1206 to 2512 has been introduced by Vishay Intertechnology. For increased design flexibility, the Vishay Techno CRHP series is available in a variety of styles, termination materials, configurations, and custom sizes.
4th March 2019

Miniature microfluidics heat sink for high-performance chip cooling

Miniature microfluidics heat sink for high-performance chip cooling
At the embedded world Conference 2019, imec presented a silicon-based compact microchannel heat sink that enables high heat flux dissipation. The imec heat sink assembled to a high performance chip for cooling the latter one achieves a low total thermal resistance of 0,34K/W to 0.28K/W at less than two watt pump power.
4th March 2019

Efficient lambda-bridge thermal conductors

Efficient lambda-bridge thermal conductors
Manufacturer of electronic components, AVX Corporation, has released the new λ-Bridge (Lambda-Bridge) Series thermal conductors. Constructed with high-quality aluminium nitride (AlN) or beryllium oxide (BeO) materials, Lambda-Bridge thermal conductors provide efficient, cost-effective thermal management solutions with reliable, repeatable performance in four small EIA form factors: 0302, 0402, 0603, and 0805.
27th February 2019

Choosing the right buzzer - a review of key buzzer selection criteria

Choosing the right buzzer - a review of key buzzer selection criteria
If you are designing products like a home appliance, security panel, a door-entry system or a computer peripheral, you might choose to feature a buzzer as the sole means of interacting with users or as part of a more sophisticated user interface. By Bruce Rose, Principal Applications Engineer, CUI Inc
25th February 2019

RAVF And RACF chip resistor arrays in stock

RAVF And RACF chip resistor arrays in stock
The popular RAVF series convex termination chip resistor arrays and RACF concave termination arrays from Stackpole are available as the company currently have many of the most popular sizes, styles, and resistance values in stock. The RAVF and RACF are AEC-Q200 compliant for popular sizes.
14th February 2019


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IoT Tech Expo 2019
25th April 2019
United Kingdom Olympia, London
Ceramics Expo 2019
29th April 2019
United States of America International Exposition Center (I-X Center)
PCIM 2019
7th May 2019
Germany Nürnberg Messe
Electronics & Applications 2019
14th May 2019
Netherlands Jaarbeurs Utrecht Hall 7 Jaarbeursplein
Agile for Automotive 2019
15th May 2019
United States of America Detroit, MI