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TDK Multilayer Ceramic Chip Capacitors Enable High-density Mounting
No Need for Heat Sinks with Intersil’s 100W ISL8225M Power Module
Laird Technologies Expand Tflex Thermal Gap Filler Line

No Need for Heat Sinks with Intersil’s 100W ISL8225M Power Module

See the amazing thermal performance of Intersil’s new ISL8225M, the industry’s best thermally performing single 30A/dual 15A power module. This simple to design in module can deliver up to 100W of power from a tiny 17mm sq. QFN package.
6 December 2012
byNews Desk

https://www.youtube.com/watch?v=Az14qoXiT00

6 December 2012
byNews Desk

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TDK Multilayer Ceramic Chip Capacitors Enable High-density Mounting

6 December 2012
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Laird Technologies Expand Tflex Thermal Gap Filler Line

6 December 2012

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