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Too cool to drift: how thermal engineering is redefining system stability

Too cool to drift: how thermal engineering is redefining system stability

Too cool to drift: how thermal engineering is redefining system stability

20 July 2026

Why solenoid valve connector design is becoming a reliability decision

Why solenoid valve connector design is becoming a reliability decision

Why solenoid valve connector design is becoming a reliability decision

17 July 2026

Automated multiphysics for successful 3D IC design

Automated multiphysics for successful 3D IC design

Automated multiphysics for successful 3D IC design

16 July 2026

GovCloud vs. standard Cloud for PCB design

GovCloud vs. standard Cloud for PCB design

GovCloud vs. standard Cloud for PCB design

14 July 2026

Extending Ethernet to the Edge of Software-Defined Vehicles

Extending Ethernet to the Edge of Software-Defined Vehicles

Extending Ethernet to the Edge of software-defined vehicles

13 July 2026

Will Burnham's “circuit-breaker” short-circuit UK tech?

Will Burnham's “circuit-breaker” short-circuit UK tech?

Will Burnham’s “circuit-breaker” short-circuit UK tech?

Analysis

20 July 2026

The component squeeze behind AI glasses: power, size, and heat

The component squeeze behind AI glasses: power, size, and heat

The component squeeze behind AI glasses: power, size, and heat

20 July 2026

MIKROE celebrates 2000th Click board with NXP RTC

MIKROE celebrates 2000th Click board with NXP RTC

MIKROE celebrates 2000th Click board with NXP RTC

20 July 2026

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Trending Now

Too cool to drift: how thermal engineering is redefining system stability

Too cool to drift: how thermal engineering is redefining system stability

Too cool to drift: how thermal engineering is redefining system stability

20 July 2026

Why solenoid valve connector design is becoming a reliability decision

Why solenoid valve connector design is becoming a reliability decision

Why solenoid valve connector design is becoming a reliability decision

17 July 2026

Automated multiphysics for successful 3D IC design

Automated multiphysics for successful 3D IC design

Automated multiphysics for successful 3D IC design

16 July 2026

GovCloud vs. standard Cloud for PCB design

GovCloud vs. standard Cloud for PCB design

GovCloud vs. standard Cloud for PCB design

14 July 2026

Extending Ethernet to the Edge of Software-Defined Vehicles

Extending Ethernet to the Edge of Software-Defined Vehicles

Extending Ethernet to the Edge of software-defined vehicles

13 July 2026

Will Burnham's “circuit-breaker” short-circuit UK tech?

Will Burnham's “circuit-breaker” short-circuit UK tech?

Will Burnham’s “circuit-breaker” short-circuit UK tech?

Analysis

20 July 2026

The component squeeze behind AI glasses: power, size, and heat

The component squeeze behind AI glasses: power, size, and heat

The component squeeze behind AI glasses: power, size, and heat

20 July 2026

MIKROE celebrates 2000th Click board with NXP RTC

MIKROE celebrates 2000th Click board with NXP RTC

MIKROE celebrates 2000th Click board with NXP RTC

20 July 2026

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Desktop-CPU performance for space-constrained industrial applications

Desktop-CPU performance for space-constrained industrial applications

Desktop-CPU performance for space-constrained industrial applications

15 December 2025

Advanced SRAM memory macros added to N2 pathfinding PDK

Advanced SRAM memory macros added to N2 pathfinding PDK

Advanced SRAM memory macros added to N2 pathfinding PDK

15 December 2025

Cloud-powered tooling to accelerate mould & die machining

Cloud-powered tooling to accelerate mould & die machining

Cloud-powered tooling to accelerate mould & die machining

Latest

15 December 2025

Imec, the Leuven-based semiconductor research hub, has unveiled a new method for producing compact and comparatively low-cost short-wave infrared sensors, a development it says could widen the use of the technology across sectors from security to agriculture and automotive.

Imec, the Leuven-based semiconductor research hub, has unveiled a new method for producing compact and comparatively low-cost short-wave infrared sensors, a development it says could widen the use of the technology across sectors from security to agriculture and automotive.

Imec unveils scalable quantum dot SWIR sensor platform on 300 mm CMOS wafers

Latest

12 December 2025

Who is TIME Magazine’s 2025 Person of the Year?

11 December 2025

byPaige Hookway

ByteSnap Design, the Birmingham-based embedded systems specialist, has published a new guide distilling lessons from more than £500,000 of automotive development work, as demand grows for practical approaches to safety-critical software compliance.

ByteSnap Design, the Birmingham-based embedded systems specialist, has published a new guide distilling lessons from more than £500,000 of automotive development work, as demand grows for practical approaches to safety-critical software compliance.

ByteSnap distils £500k of automotive software lessons into new MISRA C guide

11 December 2025

Google DeepMind to open Gemini-integrated research lab in UK

Google DeepMind to open Gemini-integrated research lab in UK

Google DeepMind to open Gemini-integrated research lab in UK

11 December 2025

byPaige Hookway

nVent SCHROFF solutions sharpen focus for 2026

Latest

11 December 2025

byPaige Hookway

AMD EPYC Embedded 2005 Series processors

AMD EPYC Embedded 2005 Series processors

AMD EPYC Embedded 2005 Series processors

Latest

10 December 2025

Scaling-quantum-computers-with-near-absolute-zero-temperatures

Scaling-quantum-computers-with-near-absolute-zero-temperatures

Scaling quantum computers with near absolute zero temperatures

10 December 2025

Imec, the Belgian research and innovation hub, has achieved a milestone in molecular sensing by demonstrating the first wafer-scale fabrication of solid-state nanopores using extreme ultraviolet (EUV) lithography. The advance, unveiled at this week’s IEEE International Electron Devices Meeting (IEDM 2025), could transform nanopore technology from a laboratory curiosity into a scalable platform for life sciences and healthcare applications.

Imec, the Belgian research and innovation hub, has achieved a milestone in molecular sensing by demonstrating the first wafer-scale fabrication of solid-state nanopores using extreme ultraviolet (EUV) lithography. The advance, unveiled at this week’s IEEE International Electron Devices Meeting (IEDM 2025), could transform nanopore technology from a laboratory curiosity into a scalable platform for life sciences and healthcare applications.

Imec pioneers wafer-scale solid-state nanopores with EUV lithography

Latest

9 December 2025

Navitas Semiconductor Corporation have announced a strategic long-term partnership intended to advance the adoption of GaN technology in India

Navitas Semiconductor Corporation have announced a strategic long-term partnership intended to advance the adoption of GaN technology in India

Navitas, Cyient Semiconductors accelerate GaN adoption in Indian markets

8 December 2025

MicroCare fluids to replace discontinued 3M Novec specialty fluids

MicroCare fluids to replace discontinued 3M Novec specialty fluids

MicroCare fluids to replace discontinued 3M Novec specialty fluids

Latest

8 December 2025

Digital twin tech could help slash ‘phantom load’ waste

Digital twin tech could help slash ‘phantom load’ waste

Digital twin tech could help slash ‘phantom load’ waste

Latest

8 December 2025

The European Investment Bank Group and the European Commission have agreed to deepen cooperation on the development of a new generation of artificial intelligence gigafactories, in a move aimed at strengthening the EU’s technological autonomy and closing the gap with the United States and China.

The European Investment Bank Group and the European Commission have agreed to deepen cooperation on the development of a new generation of artificial intelligence gigafactories, in a move aimed at strengthening the EU’s technological autonomy and closing the gap with the United States and China.

Brussels and EIB Group push €20bn plan for new wave of European AI gigafactories

5 December 2025

DigiKey launches 2025 DigiWish holiday giveaway for global engineering community

DigiKey launches 2025 DigiWish holiday giveaway for global engineering community

DigiKey launches 2025 DigiWish holiday giveaway for global engineering community

Latest

4 December 2025

onsemi and Innoscience announced the signing of a memorandum of understanding (MoU) to evaluate opportunities to accelerate deployment of GaN power devices

onsemi and Innoscience announced the signing of a memorandum of understanding (MoU) to evaluate opportunities to accelerate deployment of GaN power devices

onsemi and Innoscience announce plans to collaborate to speed global rollout of GaN power portfolio

4 December 2025

ASMPT has secured orders for 19 Chip-to-Substrate thermo-compression bonding tools from a major outsourced semiconductor assembly and test provider affiliated with one of the world’s leading foundries in the fast-expanding AI chip market.

ASMPT has secured orders for 19 Chip-to-Substrate thermo-compression bonding tools from a major outsourced semiconductor assembly and test provider affiliated with one of the world’s leading foundries in the fast-expanding AI chip market.

ASMPT wins orders for 19 bonding tools as AI chip demand surges

Latest

3 December 2025

The UK Space Agency has announced £17 million in funding for seventeen domestic space projects under its National Space Innovation Programme, unveiled on Wednesday at the Space Comm Expo in Glasgow. The package is intended to accelerate the development and commercialisation of advanced space technologies, while bolstering the UK’s position in the global space industry.

The UK Space Agency has announced £17 million in funding for seventeen domestic space projects under its National Space Innovation Programme, unveiled on Wednesday at the Space Comm Expo in Glasgow. The package is intended to accelerate the development and commercialisation of advanced space technologies, while bolstering the UK’s position in the global space industry.

UK Space Agency unveils £17 million package for new generation of satellite and space-tech projects

3 December 2025

Key features of AWS’ new AI chip, Trainium3

Key features of AWS’ new AI chip, Trainium3

Key features of AWS’ new AI chip, Trainium3

3 December 2025

byPaige Hookway