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Designing tomorrow: Texas Instruments at embedded world 2018

18th January 2018
Lanna Cooper

 

At this year's embedded world in Nuremberg, Germany, Texas Instruments (TI) will showcase new innovations helping companies that are 'Designing Tomorrow'. TI’s booth (Hall 3A, Booth 129) will be focused on four different application benches, demonstrating a range of technologies for the smart car, smart building, smart factory and smart city.

Demonstrations:

  • Tomorrow’s car: Demonstrations will include TI’s mmWave sensors for people counting - radar imaging (an advanced driver assistance system) as well as angle of arrival technology and a conceptual wireless charging solution for electric vehicles.
  • Tomorrow’s building: Demonstrations will include a robust and reliable water/liquid tolerant keypad showing Ingress Protection levels IPX5, a touch through metal keypad and slider and real time code portability with TI’s wired and wireless MCUs to create a sensor-to-cloud system.
  • Tomorrow’s factory: Demonstrations will include Industry 4.0 enabling technologies such as TI’s mmWave level sensing solution that shows how liquids in an industrial tank can be measured with mm accuracy, as well as gesture recognition technology and next-gen industrial networking.
  • Tomorrow’s city: Demonstrations will include TI’s recently launched MSP430FR6047 microcontrollers with integrated ultrasonic sensing for smart water meters.

Click here for more information.

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