Tundra Semiconductor Presents at Freescale Technology Forum

Tundra Semiconductor will exhibit and demonstrate its comprehensive line of leading System Interconnect products at the Freescale Technology Forum in Orlando, June 25-28, at the JW Marriott and Ritz-Carlton Conference Centre. Tundra’s Chief Technology Officer, Benny Chang, will participate in a panel discussion entitled Trends in High Speed Interconnects on Wednesday June 27 at 1:45pm.

Tundra will also present the following sessions: Tuesday June 26 at 11:30am; Developing WiMAX Infrastructure Using Freescale DSPs and Tundra RapidIO Switches; a session that will discuss how deploying a MicroTCA architecture using MSC8144 DSPs and Serial RapidIO switches will provide OEMs low cost OFDM-based WiMAX infrastructure solutions; Thursday June 28 at 9:30am; Software Design in Dual Processor Embedded Systems: presenting software and hardware aspects of designing dual processor systems. This will be demonstrated using a dual Freescale MPC7448 and Tundra Tsi109 solution. Tundra will highlight the industry’s latest Serial RapidIO and PCI Express products with the following demonstrations at their booth (#1710):

Serial RapidIO: RapidIO enabled silicon from Freescale and Tundra Semiconductor will be demonstrated working on the STx Serial RapidIO Development Platform. Stop by the Tundra booth to witness RapidIO traffic using commercially available software, hardware and silicon. View RapidIO DSPs, Microprocessors, and Switches from Freescale Semiconductor (MSC8144 and MPC8548) and Tundra Semiconductor (Tsi578TM).
PCI Express®: Tundra’s new low latency high throughput PCI Express bridge will be demonstrated in a storage application consisting of a multi-channel SCSI controller connected via the Tsi384TM PCI Express to PCI-X bridge, to a host system.

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