After the announcement of the award, Tetsuro Nishimura said, “The receipt of this NPI Award, after having received a Global Technology Award for this product last year, confirms that the superior characteristics of the SN100C(551CT) flux-cored wire are being widely acknowledged. This success encourages us to continue our development of products that deliver high performance while being environmentally friendly. This development program is part of our commitment to advanced customer service and support.”
SN100C (551CT), the newest addition to the SN100C lead-free solder series, combines the benefits of the SN100C high reliability alloy with a sustained activity cored flux. The 551CT core flux is formulated for use with soldering tip temperatures up to 380°C while still retaining sufficient activity to ensure good tip separation. Compared with previous formulations icicling is reduced by 90 percent and spattering by 95 percent. The silver-free SN100C alloy has a stable microstructure that can accommodate both the long-term cyclic strain and the impact loading to which solder joints can be subjected in service.
SN100C (551CT) is ideal for sequential soldering and rework. Now in the 13th year since its introduction, the SN100C lead-free alloy continues to displace SAC305 in many applications due to its high reliability, low copper erosion, and cost effectiveness.
Premiering in 2008, the NPI Awards program is an annual celebration of product excellence in electronics surface mount assembly. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts.