News & Analysis
VIA Introduces New VIA Nano 3000 Series Processors
VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today introduced its new VIA Nano 3000 Series processors, bringing enhanced digital media performance and lower power consumption to Windows 7 thin and light notebook and all-in-one desktop PC markets.
DEK Solar thinks beyond equipment to deliver PV process, support and service solutions
Following the widespread success of the award-winning PVP1200 platform and the recent European launch of the highly anticipated PV3000 metallization line, DEK Solar is consolidating its position as a major force on the solar stage. Talking recently about the company’s success in the sector, Alternative Energy Business Manager, Darren Brown, attributed the trend to DEK’s ability to “think beyond equipment.”
Barix Appoints Fabrizio Campanale as Engineering Manager
Barix AG, a pioneer in IP-based audio, intercom, control, and monitoring, has hired Fabrizio Campanale as Engineering Manager. Campanale will work out of the company’s headquarters in Zurich, leading and managing the development team and its operations to ensure proper and efficient planning and execution of all engineering projects.
Saft launches a €120 million capital increase through a rights issue
As announced in principle on 2 November 2009, Saft announces today the launch of a capital increase via an offering of preferential subscription rights to existing shareholders for an amount of approximately €120 million. The proceeds from the capital increase will primarily be used to finance the Group’s two industrial projects for lithium-ion battery production in the United States.
Minicom Rejuvenates AAA7 Agency With Consolidated KVM and Power Management
Minicom Advanced Systems - a leading developer of IT & KVM remote access and management solutions, announced that Ohio's Area Agency on Aging District 7 (AAA7) has implemented Minicom's KVM IP and management solution, with immediate, gratifying results.
PLX Technology Completes First Design on Advanced 40nm Process Technology
PLX Technology today strengthened its industry leadership position by finishing a new design on 40nm process technology at Taiwan Semiconductor Manufacturing Corporation (TSMC). This major achievement creates new opportunities for designers looking to reap the benefits of differentiation using PLX's well-known leading performance, low power and custom software tools. PLX is taking advantage of the 40nm geometry to develop a variety of new solutio...
Exar Selects Cadence as Mixed-Signal EDA Provider
Cadence Design Systems announced today that Exar Corporation has signed an expanded business agreement to establish Cadence® as its leading chip planning and mixed-signal design solutions provider. As a result of the new multi-year agreement, the Cadence Virtuoso® and Encounter® platforms, as well as the Cadence Chip Planning Solution, will make up Exar's key mixed-signal design environment for designs at 65 nanometers and below.
Cadence Marks Annual Innovation Day with Honors for its Top Technology Leaders
Cadence Design Systems today is celebrating Innovation Day, honoring the contributions Cadence employees have made to the company and the electronics industry as a whole. Having garnered more than 800 U.S. patents and an additional 150 international patents, Cadence has a long legacy of technology innovation that has enabled EDA customers to successfully create some of the world’s most recognized consumer and business products for over 20 years...
Essemtec Improves Its Semiautomatic Printers
Essemtec’s new stencil printers SP004 and SP150 print more accurately and are simpler to set up than their predecessors. The tabletop printer SP004 is a further development of the SP003, and the semiautomatic printer SP150 features a new option: the automatic electronic squeegee pressure regulation. Both printers will be on display at the upcoming Productronica 2009 exhibition in Munich this coming November.
Essemtec to premier new curing oven for small batches at Productronica 2009
Essemtec will introduce a new RO300FC-S full convection oven for drying and curing processes at the upcoming Productronica exhibition in Munich, Germany. The oven features a compact design, excellent process control and very small delta-T values that make the machine the first choice for small batch manufacturing or process development.