News & Analysis
Toshiba's Japanese Digital Products Facilities to be Restructured
Toshiba have revealed today that it will implement a series of functional reorganizations of its Digital Products business facilities in Japan that will enhance operating efficiency and the performance of its Digital Products businesses, including the LCD TV business.
Big Data & IT Infirmity: Infographics from ViaWest
ViaWest is pleased to announce the release of two new infographics which outline strategic resources for solving data storage issues along with the top IT challenges faced by CIOs today. The new Big Data infographic shows the latest statistics on data storage including implications of how big data will affect businesses in the future.
IEMN and Digital Surf's Technical cooperation agreement
IEMN and Digital Surf confirm that they have entered into a technical cooperation agreement. IEMN has joined Digital Surf's Mount Shasta technical cooperation programme with internationally reputed laboratories engaged in scientific research. One of the core areas of research at IEMN is the physics of nanostructures and quantum devices.
Imec and TEL Accelerate Development of DSA
Imec and Tokyo Electron announce that they will accelerate their Directed Self-Assembly activities at imec’s recent 300 mm fab-compatible DSA process line. Over the past two years, both companies have been actively engaged in DSA development.
UCL receives donation of £1.5 million worth of wireless test equipment from Aeroflex
Aeroflex and University College London announced today the official opening of the UCL-Aeroflex Wireless Communications Laboratory in the Department of Electronic and Electrical Engineering at the University. The new laboratory is equipped with £1.5 million worth of test equipment donated by Aeroflex.
Huawei Cloud Storage Passed the Performance Tests of CERN
Huawei declared today that its cloud storage system has passed the performance test of the European Organization for Nuclear Research (CERN). The CERN data centre, also known as the Worldwide LHC Computing Grid Tier-0, is at the core of a global computing resource which enables the storage and analysis of more than 20 PB of Large Hadron Collider data per year.
Tough CO2 targets for auto industry in difficult economic times
Following the adoption today of the European Commission's proposals to reduce CO2 emissions from cars and vans, the European Automobile Manufacturers' Association (ACEA) will now work with its members to conduct a full analysis of how the proposed targets should be reached as well as their feasibility, and what this means in practice for the industry as a whole.
Continental Automotive Romania Purchases a Nordson DAGE Diamond Flat Panel X-ray Inspection System from Etek Europe
Etek Europe Ltd announces the sale of a Nordson DAGE XD7600NT Diamond FPX-ray inspection system with the new X-Plane option to Continental Automotive Romania, Timisoara.
FOWLP Patent Analysis from Yole Développement
Yole Développement's FOWLP Patent Analysis is now available. Fan-Out Wafer Level Packaging is the most innovative advanced packaging technology today, adopted for mobile phone and consumer electronics applications. After several years of specific analysis for customers, Yole Développement has decided to publish its first analysis of the technical contents of patents.
Delphi Delivers Common Rail Repair Solutions Within Three Years Of Euro 5 Emissions Legislation
Delphi Product & Service Solutions has launched its most comprehensive Common Rail repair programme for DFP 3 and 6 Common Rail pumps, and DFI 1.5 Common Rail injectors to support Euro 5 emissions standards in the aftermarket. There are more than three million vehicles on the road today fitted with Delphi’s Euro 5 fuel injection system, and this number is expected to increase significantly over the next five years.