Memory solutions for harsh environments

19th July 2018
Posted By : Alex Lynn
Memory solutions for harsh environments

It has been announced that Swissbit will be exhibiting its latest memory innovations at the Flash Memory Summit 2018 in Santa Clara, California, 7th to 9th August 2018. At booth #419, Swissbit will launch its latest 3D-NAND-based memory solutions for industrial temperature grades including the PCIe M.2-Module N-10m2 and a new 2.5” SATA SSD. 

A further key theme will be memory cards with integrated security features. Tom McCormick, Chief Engineer and Technologist, will be presenting his paper on Flash and Filesystem Codesign and will be answering questions about embedded applications at the Expert Chat Session on the Tuesday evening of the show. Swissbit’s Engineering Director for embedded products, Grady Lambert, will be holding a talk on ‘Security risks in industrial environments’.

For industrial temperature ranges from -40 to 85°C, Swissbit is launching its X 70 SATA 6 Gb/s SSD at the show. The 2.5” SSD with 3D-NAND will be available by the end of the year in version varieties between 120 GB to 1TB. The latest NVMe PCIe M.2 Module N-10m2 will also be introduced at the show ahead of its imminent market availability. The industrial grade 3D-NAND-based memory offers optimised power consumption and is especially suited for fanless systems.

Highly secure storage media

With its SD and microSD Memory Cards and USB sticks with integrated secure element, Swissbit offers solutions for embedded systems that require data or communication to be secured through hardware based authentication and encryption functions. By combining standard memory media with security features, IIoT applications can be kept secure and up to date cryptographically throughout their entire lifecycle.

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