FPGAs

Displaying 1 - 10 of 297

Specifications to look for when designing power supplies for SoCs

In this video, the power specifications of SoC and FPGA are discussed and suitable devices characteristics identified.
17th August 2018

AMC FPGA carrier with ginle FMC+ interfaces

AMC FPGA carrier with ginle FMC+ interfaces
Manufacturer of integrated systems, embedded boards, enabling software and application-ready platforms, VadaTech, has announced the AMC585, an AMC FPGA Carrier with single FMC+ (VITA-57.4) interfaces. The AMC is compliant to AMC.1, AMC.2 and AMC.4 specifications. 
17th August 2018

FPGAs achieve 5X/16X performance-per-watt over GPUs

FPGAs achieve 5X/16X performance-per-watt over GPUs
Xilinx and SK Telecom (SKT) have jointly announced that SKT has deployed Xilinx FPGAs as their artificial intelligence (AI) accelerators in its data centre. The Xilinx Kintex UltraScale FPGAs are now running SKT’s automatic speech-recognition (ASR) application to accelerate NUGU, its voice-activated assistant. SKT achieved up to five times higher performance in ASR applications when compared to GPUs, and more importantly, 16 times better performance-per-watt.
16th August 2018


FPGA carrier boards with quad-core ARM application processor

FPGA carrier boards with quad-core ARM application processor
It has been announced that VadaTech, a manufacturer of integrated systems, embedded boards, enabling software and application-ready platforms, is releasing two new products based on the Xilinx Zynq UltraScale+ MPSoC (MultiProcessor System on Chip).
30th July 2018

FPGAs enabling smallest, lowest power DisplayPort implementations

FPGAs enabling smallest, lowest power DisplayPort implementations
It has been announced by Microsemi, that Bitec’s DisplayPort intellectual property (IP) core optimised for PolarFire field programmable gate arrays (FPGAs) is available. Compared to alternative solutions, the core gives designers the ability to take advantage of the PolarFire family’s smaller size and 50% lower power to enable stunning image quality in small form factor embedded displays and monitors. 
25th July 2018

Partnership formed for FPGA boards with high density RF connectors

Partnership formed for FPGA boards with high density RF connectors
TE Connectivity (TE), has announced it has partnered with Annapolis Micro Systems, a leading FPGA board and systems supplier, on the release of three of their new high-performance FPGA boards that feature TE’s NanoRF module. The half-size NanoRF is designed to fit into the VITA 67.3 form factor and supports 70GHz bandwidth, with more than double the RF contact density of existing VITA 67 solutions.
16th July 2018

Design challenges when powering high-end FPGAs and processors

In this video, Guneet Chadha from Analog Devices discusses the three design challenges that their power management solutions solve as core voltages keep scaling down.
4th July 2018

Bringing AI in edge devices to the mass market

Bringing AI in edge devices to the mass market
A complete technology stack combining modular hardware kits, neural network IP cores, software tools, reference designs and custom design services has been introduced by Lattice Semiconductor to accelerate integration of machine learning inferencing into broad market IoT applications.
21st May 2018

SLVS-EC RX IP Core for Xilinx FPGA’s available at FRAMOS

SLVS-EC RX IP Core for Xilinx FPGA’s available at FRAMOS
FRAMOS has officially launched the first SLVS-EC RX IP Core for easy sensor interfacing with FPGAs from Xilinx. The proprietary FRAMOS FPGA module available with an Evaluation Kit, connects SONY’s latest high-speed SLVS-EC interface with Xilinx FPGAs and enables vision engineers to seamlessly upgrade to Sony’s interface technology of the future and to create high-performance vision solutions.
15th May 2018

Production-qualification milestone reached for PolarFire FPGA family

Production-qualification milestone reached for PolarFire FPGA family
Microsemi has announced its first cost-optimised, low power, mid-range PolarFire Field Programmable Gate Array (FPGA) device is now production-qualified. With 300K Logic Elements (LEs), the second largest device in the family targets a variety of applications in the communications, defence, industrial and aviation markets. The company also announced full Libero SoC Design Suite support for PolarFire devices, giving designers the ability to design in any member of the family.
2nd May 2018


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SINDEX 2018
28th August 2018
Switzerland BERNEXPO-Site, Bern
European Microwave Week 2018
23rd September 2018
Spain Ifema Feria De Madrid
Connected World Summit 2018
25th September 2018
United Kingdom Printworks, London
IoT Solutions World Congress 2018
16th October 2018
Spain Barcelona
Engineering Design Show 2018
17th October 2018
United Kingdom Ricoh Arena, Coventry