FPGAs

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Bringing AI in edge devices to the mass market

Bringing AI in edge devices to the mass market
A complete technology stack combining modular hardware kits, neural network IP cores, software tools, reference designs and custom design services has been introduced by Lattice Semiconductor to accelerate integration of machine learning inferencing into broad market IoT applications.
21st May 2018

SLVS-EC RX IP Core for Xilinx FPGA’s available at FRAMOS

SLVS-EC RX IP Core for Xilinx FPGA’s available at FRAMOS
FRAMOS has officially launched the first SLVS-EC RX IP Core for easy sensor interfacing with FPGAs from Xilinx. The proprietary FRAMOS FPGA module available with an Evaluation Kit, connects SONY’s latest high-speed SLVS-EC interface with Xilinx FPGAs and enables vision engineers to seamlessly upgrade to Sony’s interface technology of the future and to create high-performance vision solutions.
15th May 2018

Production-qualification milestone reached for PolarFire FPGA family

Production-qualification milestone reached for PolarFire FPGA family
Microsemi has announced its first cost-optimised, low power, mid-range PolarFire Field Programmable Gate Array (FPGA) device is now production-qualified. With 300K Logic Elements (LEs), the second largest device in the family targets a variety of applications in the communications, defence, industrial and aviation markets. The company also announced full Libero SoC Design Suite support for PolarFire devices, giving designers the ability to design in any member of the family.
2nd May 2018


Multiphase PMICs have high efficiency and small footprint

Multiphase PMICs have high efficiency and small footprint
Renesas Electronics has announced three programmable power management ICs (PMICs) that offer the highest power efficiency and smallest footprint for application processors in smartphones and tablets: the ISL91302B, ISL91301A, and ISL91301B PMICs. The PMICs also deliver power to artificial intelligence (AI) processors, FPGAs, and industrial microprocessors (MPUs), and they are suitable for powering the supply rails in solid-state drives (SSDs), optical transceivers, and a wide range of consumer, industrial and networking devices.
25th April 2018

Designation paves the way for QML class V qualification

Designation paves the way for QML class V qualification
Microsemi has announced its RTG4 high-speed signal processing radiation-tolerant FPGAs have achieved Qualified Manufacturers List (QML) Class Q qualification by the Defense Logistics Agency (DLA). The qualification, which validates the quality and reliability of RTG4 FPGAs as well as the company's qualification and manufacturing screening processes, enables easier design of Microsemi's flash technology into space applications due to the streamlined process of working with QML-qualified products.
11th April 2018

Data converter module designed for signal processing applications

Data converter module designed for signal processing applications
  Pentek has introduced the newest member of the Jade family of high performance data converter XMC modules based on the Xilinx Kintex Ultrascale FPGA. The Model 71800 is a co-processor module with an XMC PCI Express Gen 3 interface and general purpose I/O using parallel LVDS and gigabit serial ports.
27th March 2018

IP offerings for machine vision applications

IP offerings for machine vision applications
Microsemi has announced it has expanded the third-party IP offerings for its cost-optimised, low power, mid-range PolarFire FPGAs. With new support of artificial intelligence (AI)/machine learning IP and HDMI 2.0b interfaces, the company’s award-winning PolarFire device can now be used in industrial artificial intelligence applications which leverage the rich resources in the FPGA, particularly the large quantities of digital signal processor (DSP) math blocks and embedded RAMs.
16th March 2018

MTCA chassis provides eight extended-size AMC slots

MTCA chassis provides eight extended-size AMC slots
VadaTech has announced the VT882. The VT882 is a 2U MTCA chassis that provides eight extended-size/full-size and/or mid-size AMC slots that can accept any AMC.1, AMC.2, AMC.3 and/or AMC.4 modules. It provides TCLKA, TCLKB, TCLKC and TCLKD as well as FLCLKA to each slot in addition to the JTAG signals. It also contains capability for full redundancy by having a redundant MCH, power modules, as well as redundant cooling units for high availability. Option for redundant/non-redundant clock is per MTCA specification.
12th March 2018

Double module in AMC form factor card provides high speed I/O

The AMC584 has been announced by manufacturer of integrated systems, embedded boards, enabling software and application-ready platforms. 
6th February 2018

Image sensor interface features FPGA's from Xilinx

Image sensor interface features FPGA's from Xilinx
The first SLVS-EC RX IP Core for easy sensor interfacing with FPGAs from Xilinx will be delivered by FRAMOS. The proprietary FRAMOS FPGA module available with an EVB, connects SONY's latest high speed SLVS-EC interface with Xilinx FPGAs and enables vision engineers to seamlessly upgrade to Sony's interface technology of the future and to create high performance vision solutions.
26th January 2018


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Developing secure and scalable IoT solutions
21st June 2018
United Kingdom Cocoon Networks, London
SENSOR+TEST 2018
26th June 2018
Germany Nürnberg Exhibition Centre
European Microwave Week 2018
23rd September 2018
Spain Ifema Feria De Madrid
Engineering Design Show 2018
17th October 2018
United Kingdom Ricoh Arena, Coventry
electronica 2018
13th November 2018
Germany Messe Munchen