ROHM detail PCIM 2014 offering

1st April 2014
Posted By : Staff Reporter
ROHM detail PCIM 2014 offering

At PCIM 2014, in Hall 9, Booth 211, ROHM Semiconductor will present its latest power management product designs. The products on show offer beneficial characteristics resulting from latest material research, packaging and manufacturing expertise and meet the ever increasing demand for energy efficiency, miniaturization, durability, reduced component count and costs while providing optimum performance at the same time.

Highlights of the products ROHM plan to present include:

  1. Highly efficient Automotive standard LDOs: ROHM offers a wide line-up of standard LDOs qualified for Automotive applications and featuring low power consumption, high current efficiency, high voltage resistance and a wide operating temperature range (-40° to +125°) for maximum design flexibility. With these features, they are ideally suited to power Automotive applications such as clusters, climate control, radio or navigation.
  2. Third Generation Fast Recovery Diodes: ROHM also demonstrates a broad line-up of highly reliable fast recovery diodes for multiple design options. Two new series have been added to the standard balance and soft recovery types, demonstrating the optimized performance for a range of applications: The low Vf RFNL series featuring ultra low Vf & soft recovery, suitable for power applications of 200W~300W like TV, PC and white goods. The new RFV series has been developed with a high speed switching & hard recovery behaviour, supporting high wattage applications such as UPS power, power conditioner and industrial modules.
  3. 3rd Gen SiC MOSFETs = Trench Gate structure SiC MOSFETs: ROHM is providing advanced SiC MOSFET to the market since 2010. As from this year, ROHM will start to launch new SiC MOSFET based on Trench Gate structure technology. About half of the on-resistance of the ROHM conventional planar MOSFET is achievable over the whole temperature range. Of course, the high stability related to Gate oxide film and Body Diode is the same as with ROHM’s 2nd Gen SiC MOSFET. The result is minimum conductivity and switching loss as well as increased current-carrying capacity while keeping a compact format. ROHM will now showcase new, 3rd generation products based on this state-of-the-art technology.

Visit ROHM Semiconductor on Booth 211, Hall 9 at PCIM 2014.

You must be logged in to comment

Write a comment

No comments

Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

Girls in Tech | Catalyst | 2019
4th September 2019
United Kingdom The Brewery, London
DSEI 2019
10th September 2019
United Kingdom EXCEL, London
EMO Hannover 2019
16th September 2019
Germany Hannover
Women in Tech Festival 2019
17th September 2019
United Kingdom The Brewery, London
European Microwave Week 2019
29th September 2019
France Porte De Versailles Paris