Highlights of the products ROHM plan to present include:
- Highly efficient Automotive standard LDOs: ROHM offers a wide line-up of standard LDOs qualified for Automotive applications and featuring low power consumption, high current efficiency, high voltage resistance and a wide operating temperature range (-40° to +125°) for maximum design flexibility. With these features, they are ideally suited to power Automotive applications such as clusters, climate control, radio or navigation.
- Third Generation Fast Recovery Diodes: ROHM also demonstrates a broad line-up of highly reliable fast recovery diodes for multiple design options. Two new series have been added to the standard balance and soft recovery types, demonstrating the optimized performance for a range of applications: The low Vf RFNL series featuring ultra low Vf & soft recovery, suitable for power applications of 200W~300W like TV, PC and white goods. The new RFV series has been developed with a high speed switching & hard recovery behaviour, supporting high wattage applications such as UPS power, power conditioner and industrial modules.
- 3rd Gen SiC MOSFETs = Trench Gate structure SiC MOSFETs: ROHM is providing advanced SiC MOSFET to the market since 2010. As from this year, ROHM will start to launch new SiC MOSFET based on Trench Gate structure technology. About half of the on-resistance of the ROHM conventional planar MOSFET is achievable over the whole temperature range. Of course, the high stability related to Gate oxide film and Body Diode is the same as with ROHM’s 2nd Gen SiC MOSFET. The result is minimum conductivity and switching loss as well as increased current-carrying capacity while keeping a compact format. ROHM will now showcase new, 3rd generation products based on this state-of-the-art technology.
Visit ROHM Semiconductor on Booth 211, Hall 9 at PCIM 2014.