From ceramics to plastics: Ohmite and Arcol at electronica 2018

1st November 2018
Posted By : Alex Lynn
From ceramics to plastics: Ohmite and Arcol at electronica 2018


Having launched a new product almost every month since the last electronica, there will be plenty to see on the Ohmite/Arcol stand (Hall B6-101). Development by both companies has resulted in products designed for engineers by engineers. 

The new TGHM for example, has relocated terminations to the side of the component which not only creates a lower profile part, but also provides a viable and economic alternative to an SOT-227 molded package. The side terminations use quick connect terminals for an easy connection and eliminate extra hardware and assembly time.

Arcol’s ARF low profile wirewound metal clad resistors offer a flexible design with high pulse capability. Ideally suited to braking and inverter/converter applications, the ARF series is available in six wattage sizes from 75 to 300W and enhanced power levels can be achieved when mounted to a heatsink.

Taking away the need for a dedicated MCU, the FSP Series are high-feature-set, cost-effective touch sensors enabling intuitive control and navigation with a wide range of applications including HMI (Human Machine Interface)/MMI (Multi Media Interfaces). The FSPs are a ‘single touch’ device that simultaneously reports both touch position and variable force.

The P series heatsink uses forged pin technology and in a radical design change, the forged pins increase the surface area of the heatsink for greater free air convection and provide the opportunity to force air in multiple directions through the pins.

Illuminated control knobs, two shot pull handles, stand-offs, cable glands and enclosures from sister company Davies Moldings will be shown. Available in different centre to centre dimensions, the colour coded pull handles are molded with a glass reinforced nylon substrate and an overmold thermoplastic elastomer rubber (TPE) to provide extra comfort and style.

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