Components for smart systems at embedded world

30th January 2019
Posted By : Alex Lynn
Components for smart systems at embedded world

At embedded world 2019, Würth Elektronik eiSos will presents a wide variety of new electronic and electromechanical components at Hall 3, Booth 3-247. A focus in the manufacturer’s extensive trade show program will be sensors and wireless modules for embedded systems. In various forums and presentations at the trade show, technicians and developers will inform visitors about technological trends and new products.

At embedded world, Würth Elektronik eiSos will show the first insights and outlooks on its new product family of sensors, including temperature sensors, absolute and differential pressure sensors as well as three-axis acceleration sensors. Moreover the proprietary module Thebe II, the WiFi module Calypso and the Bluetooth modul Proteus II represent the next represent the next step towards digital communication.

The wide bandwidth and high performance of the MagI³C power modules from Würth Elektronik eiSos are represented by MagI³C-VDRM (Variable Step Down Regulator Module). The compact step-down converter scores with integrated inductor and capacitors. Capacitors themselves are represented with no fewer than four different product series of H-Chip aluminium-polymer capacitors.

Miniaturisation is an important topic for Würth Elektronik eiSos. With WE-CBF HF, the SMT ferrite for high frequency applications, tiny components make a huge impact on suppression. Further product highlights from the EMC specialists’ portfolio: WE-MAPI, one of the world’s smallest metal alloy power inductors, and WE-MCRI, an innovative, molded double choke. USB-3.1 type-C connectors with SuperSpeed technology are presented from the field of electromechanical components.

Wireless power transmission
The Wireless Power Congress has been integrated into embedded world and Würth Elektronik eiSos is also represented in the new form of the congress. Experts from Würth Elektronik eiSos will provide information with the following specialist presentations: 

  • ‘Market and Future of the Global Wireless Power Transfer Industry’, Jörg Hantschel, Thursday, February 28th, 2019, 9.30-10.00am.
  • ‘15W Inductive Wireless Power Transfer with Integrated Data Communication’, Cem Som, Thursday, February 28th, 2019, 11.30-12.00am.
  • ‘Wireless Power Transfer in Rotating Assemblies’, Jelena Mijuskovic, Thursday, February 28th, 2019, 2.30-3.00pm.

Further presentations
Würth Elektronik eiSos employees also contribute to the regular trade show program with the following presentations:

  • ‘SPICE Simulation of 100Base-TX LAN-Transformer in an Ethernet Transmission Path’, Simon Mark, Tuesday, February 26th, 2019, 5.00-5.30pm.
  • ‘PoE: The Power Oriented Era’, Jairo Bustos Heredia, Wednesday, February 27th, 2019, 2.30-3.00pm.
  • ‘Ferrite for EMC – What Do I Need to Know?’, George Slama, Wednesday, February 27th, 2019, 5.00-5.30pm.
  • ‘Protect the Ports!’, George Slama, Wednesday, February 27th, 2019, 10.30-11.00am.

Sporting application example
To set the scene for the trade show focus on sensors and wireless modules, Würth Elektronik eiSos throws out a challenge to its booth visitors. ‘Step into the ring and measure your power’, a punching bag and boxing gloves are equipped with the manufacturer’s new acceleration sensors and wireless modules. Those who accept the sporting challenge see on a display how strong their punch is. From the acceleration of the punching bag and its mass, the force the boxer transfers to the punching bag is calculated in real time.


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