Design

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Co-simulation solution meets electrical-thermal challenges

Co-simulation solution meets electrical-thermal challenges
The system analysis and design market has a new solution with the introduction of the Cadence CelsiusThermal Solver, a complete electrical-thermal co-simulation solution for the full hierarchy of electronic systems from ICs to physical enclosures. Following the launch of the Clarity 3D Solver earlier this year, the Celsius Thermal Solver is the second innovative product in Cadence’s new system analysis initiative.
16th September 2019

Embedded systems: The evolution of embedded system design

Embedded systems: The evolution of embedded system design
Embedded systems design is evolving as businesses are under pressure to innovate faster than ever before. Legacy systems that were once purpose-built must be modernised or give way to new fluid and connected systems. Of course, the need for this transition didn’t happen overnight. Let’s review the history of embedded systems and how things have changed to drive this evolution. Guest blog written by Michel Genard, Wind River. 
16th September 2019

Industrial IoT gateway provides versatile connectivity

Industrial IoT gateway provides versatile connectivity
A low-cost industrial gateway powered by Raspberry Pi is now available at Farnell. The Avnet SmartEdge Industrial IoT Gateway, coupled with seamless, secure connectivity, enabled by Avnet’s IoT Connect platform, delivers a powerful set of features to gather, analyse and provide actionable, real-time data visualisation.
16th September 2019


RISC-V development tools updated with custom extensions

RISC-V development tools updated with custom extensions
IAR System has announced that a new version of the toolchain IAR Embedded Workbench for RISC-V is now available. Version 1.11 adds support for custom extensions as well as further enhanced optimisations for code execution speed. One of the major benefits of using RISC-V is the flexibility the architecture provides.
13th September 2019

Module with mini processor offers higher performance

Module with mini processor offers higher performance
congatec has introduced a new SMARC 2.0 Computer-on-Module with NXP i.MX 8M Mini processor. The conga-SMX8-Mini offers higher performance at significantly fewer watts due to the new 14nm FinFET structure. The module also offers impressive visualisation capabilities, including 3D graphics with full-HD resolution, despite low thermal and system cost.
12th September 2019

Industry 4.0 business models based on embedded computers

Industry 4.0 business models based on embedded computers
There is no question that the digitisation of all areas of life and work creates new business models. In the DACH region, the connection of digital transformation of products and manufacturing has been dubbed “Industrie 4.0” – industry 4.0. Obviously, this is not just about setting up a PC at the manufacturing line and hooking it up to the internet. Rather, the goal is to gain a competitive advantage, be it through raising efficiency or generating new offers, from leveraging the data collected as well as networking operational technology (OT) and information technology (IT).
10th September 2019

EEvision platform for on-board electronic system exploration

EEvision platform for on-board electronic system exploration
Concept Engineering, which specialises in visualisation and debugging technologies for electronic circuits and systems, has introduced the latest version of its EEvision platform. This innovative software platform leverages Google-like search features and smart display functions to visualise and analyse entire electronic systems.
9th September 2019

Capacitors empower new Raspberry Pi microcomputer

Capacitors empower new Raspberry Pi microcomputer
The new Raspberry Pi 4 is a microcomputer that promotes teaching of basic computer science in schools and in developing countries. It features Panasonic Industry Europe’s Polymer SP capacitor replacing the previously used MLCC’s (multi layer ceramic capacitor).
5th September 2019

Insulation technique paves the way for more powerful chips

Insulation technique paves the way for more powerful chips
Researchers at KU Leuven and imec have successfully developed a new technique to insulate microchips. The technique uses metal-organic frameworks, a new type of materials consisting of structured nanopores. In the long term, this method can be used for the development of even smaller and more powerful chips that consume less energy. The team has received an ERC Proof of Concept grant to further their research.
5th September 2019

The steep career of Raspberry Pi: from maker PC to industrial computer

The steep career of Raspberry Pi: from maker PC to industrial computer
With an industrial-strength Raspberry Pi starter kit, Kontron is laying the cornerstone for industrial and commercial use of the Raspberry Pi platform in companies and organisations. Can the board, known as a hobbyist PC and widely used as an experimental platform, really score points with its cheap image compared to high-quality standard industrial PCs?
5th September 2019


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European Microwave Week 2019
29th September 2019
France Porte De Versailles Paris
HETT 2019
1st October 2019
United Kingdom EXCEL, London
World Summit AI 2019
9th October 2019
Netherlands Taets Park, Amsterdam
New Scientist Live 2019
10th October 2019
United Kingdom ExCeL, London
GIANT Health Event 2019
15th October 2019
United Kingdom Chelsea Football Club Stadium, London