Design

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Design tools certified for 3D chip stacking technology

Design tools certified for 3D chip stacking technology
TSMC has certified Cadence Design System’s design solutions for the new TSMC System-on-Integrated-Chips (TSMC-SoIC) 3D advanced chip stacking technology, which integrates heterogenous chips—including logic ICs and memory—that are fabricated on different process nodes onto a single chip stack for a subsequent packaging process.
24th April 2019

IoT development board ensures secure designs

IoT development board ensures secure designs
Availability of a development board that makes it easy for engineers to create secure cloud-connected designs has been announced by RS Components. The PIC-IoT WG development board (AC164164) from Microchip offers a simple way to develop PIC microcontroller-based applications and connect them to the Google Cloud IoT Core platform.
24th April 2019

Ruggedised appliances secure operational technology

Ruggedised appliances secure operational technology
Industrial Control System (ICS) security has become more challenging than ever as information technology (IT)/operational technology (OT) convergence has emerged as the new standard for industrial cyber security, adding new levels of challenges.
24th April 2019


Card printers recognised with 2019 iF DESIGN AWARD

Card printers recognised with 2019 iF DESIGN AWARD
Innovator at the edge of the enterprise with solutions and partners that enable businesses to gain a performance edge, Zebra Technologies, has announced the ZC100 and ZC300 series card printers have received the prestigious iF DESIGN AWARD in the discipline of product design.
24th April 2019

Software platform integrates with chip design kit

The PathWave Advanced Design System (ADS) and PathWave RFIC Design from Keysight Technologies are now integrated with the latest interoperable process design kit (iPDK) from Samsung for the 28FDS (28nm fully-depleted silicon-on-insulator) process technology. 
24th April 2019

Memory IP subsystem wins ISO 26262 ASIL C certification

Good news for Cadence Design Systems is that its LPDDR4/4X memory IP subsystem, utilising TSMC’s 16nm FinFET Compact (16FFC) technology, has achieved ISO 26262 ASIL C certification from SGS-TÜV Saar. The certification confirms that the Cadence IP is complete and ready for use by customers creating advanced systems-on-chip (SoCs) for advanced driver assistance systems (ADAS) and L3/L4 autonomous driving applications.
23rd April 2019

Power efficiency for SoCs in data-intensive applications

Power efficiency for SoCs in data-intensive applications
The newest portfolio solution of 112G Long Reach (LR) SerDes PHY on a leading-edge 7nm process node for next-generation terabit switches, routers, optical transport networks (OTNs), and high-performance networking equipment, has been announced by Rambus.
17th April 2019

Evaluation boards for current-compensated high-current chokes

Evaluation boards for current-compensated high-current chokes
Proven test circuit boards are being offered by SCHURTER for the DKIH-1 and DKIH-3 high-current chokes. With these, an EMI filter circuit for one or three phase systems can be set up and tested easily and quickly in an iterative process without having to make any adjustments to the layout of your own PCB. 
17th April 2019

Intel architecture added to INTEGRITY RTOS

Intel architecture added to INTEGRITY RTOS
Green Hills Software has announced it has added Intel architecture to the certifications of conformance for its INTEGRITY-178 Time-Variant Unified Multi Processing (tuMP) RTOS to the Future Airborne Capability Environment (FACE) Technical Standard edition 3.0. INTEGRITY-178 tuMP was previously certified for Power Architecture. The certification covers both the Safety Base and Security profiles, and includes verification for C, C++ and Ada support for both profiles.
17th April 2019

Thin mini ITX embedded industrial motherboard

Thin mini ITX embedded industrial motherboard
Industrial PC solution provider and an associate member of the Intel Internet of Things Solutions Alliance, Avalue Technology, has announced that it is unveiling EMX-KBLU2P, based on Intel Core and Celeron Processors. EMX-KBLU2P, the Thin Mini ITX Motherboard, supports Intel 6/7th Generation Core i7/i5/i3 and Celeron BGA Processors.
17th April 2019


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IoT Tech Expo 2019
25th April 2019
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Ceramics Expo 2019
29th April 2019
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