Design

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Taking advantage of TCR for simple, accurate heating

Taking advantage of TCR for simple, accurate heating
Taking advantage of the temperature coefficient of resistance in metals can result in elegant, cost-effective and innovative responses to engineering challenges that involve heating or precision temperature sensing.  By Phil Ebbert, VP of Engineering, Riedon
12th November 2019

Box PC in the eNUC standard for high-performance applications

Box PC in the eNUC standard for high-performance applications
With the AMD Ryzen V1000 based NUCV, E.E.P.D. is launching a new box PC in the eNUC standard for high-performance automotive, industrial, medical and robotics applications. Available also in customer-specific versions, it is developed and manufactured in Germany. This creates confidence in quality and service, while providing protection against industrial espionage.
11th November 2019

Design-for-test platform cuts IC implemenation costs

Design-for-test platform cuts IC implemenation costs
There were two slides in Geir Eide’s PowerPoint presentation about Mentor Graphics newly introduced Tessent Connect design for test (DfT) platform that resembled a before and after advertisement. In the first slide IC design teams are using conventional design for test methodology which induces headaches as they try to retrofit flows to use hierarchical components and technologies.
10th November 2019


Backup solution for mission critical legacy computer systems

Backup solution for mission critical legacy computer systems
Solid State Disks Ltd (SSD) has launched HotBackup, a solid state ‘live host’ backup solution ideally suited for use in process and mission critical legacy computer systems in a broad range of applications in the telecommunications, semiconductor manufacturing, industrial process control, engineering and manufacturing, oil and gas, mil/aero and media post-production industries.
8th November 2019

Intel select solution for NFVI forwarding platform

Intel select solution for NFVI forwarding platform
Lanner Electronics will collaborate with Intel to deliver its next-generation network appliance NCA-6210, verified by Intel Select Solution for NFVI FP. NCA-6210 is integrated with pre-configured hardware and software optimal for NFVI deployments, and will help service providers to accelerate the process of researching and deploying the virtualisation-optimised network solutions required for future service applications.
8th November 2019

3D design and engineering portfolio features new enhancements

3D design and engineering portfolio features new enhancements
Dassault Systèmes has introduced SOLIDWORKS 2020, the latest release of its portfolio of 3D design and engineering applications. SOLIDWORKS 2020 features enhancements, new capabilities and workflows that enable more than six million SOLIDWORKS users to accelerate and improve product development, from conceptual design to manufactured products, and create value for their organisations. 
7th November 2019

Integrated power integrity solution enables signoff at 7nm

A comprehensive static timing/signal integrity analysis and power integrity analysis tool, which enables engineers to create reliable designs at 7nm and below has been released by Cadence Design Systems. The Tempus Power Integrity Solution is the result of an integration between the Cadence Tempus Timing Signoff Solution and the Voltus IC Power Integrity Solution.
6th November 2019

Enhanced NFC experiences of new iOS 13 platform

Enhanced NFC experiences of new iOS 13 platform
STMicroelectronics is enhancing software support for smartphone app developers to unleash the full potential from the new Core NFC Framework of the newly released iOS 13 operating system. The Core NFC Framework in iOS 13 enables reading and writing interactions with diverse types of NFC tags, including ISO/IEC 15693type-5 tags. 
6th November 2019

Development kit aids F-RAM memory evaluation

Development kit aids F-RAM memory evaluation
An easy-to-use and inexpensive development kit that will enable engineers to evaluate the high-performance Excelon Ultra QSPI F-RAM memory technology from Cypress Semiconductor is available at RS Components. There are demanding requirements for robust memory performance in terms of cycling endurance and data retention for industrial systems operating in harsh environments.
5th November 2019

Lower power computing with Arm

Lower power computing with Arm
The modules featuring NXP i.MX 8 multi-core 32- and 64-bit ARM processors, which congatec offers in the SMARC 2.0 and Qseven standards, are robust and some are designed for the extended temperature range from -40°C to +85°C. They are predestined for a wide range of applications and even allow full solar operation with an energy consumption of less than 3-5W during normal operation. Here congatec discusses the potential industrial applications.
4th November 2019


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productronica 2019
12th November 2019
Germany Messe München
SPS IPC Drives 2019
26th November 2019
Germany Nuremberg Messe
Vietnam International Defense & Security Exhibition 2020
4th March 2020
Vietnam National Convention Center, Hanoi