TE Connectivity has added to the Elo TouchSystems family of devices built to help support the unique needs of healthcare environments: the 18.6-inch 1919LM and the 24-inch 2400LM touchmonitors.

In view of increasingly diversified customer needs in the consumer devices market, TE Connectivity (TE) has developed two new types of 0.3mm pitch Flexible Printed Circuit (FPC) connectors to enrich its FPC connector product family.

TE Connectivity offers its MAG-MATE poke-in terminal to power tool manufacturers that wish to speed up magnet wire termination as part of their production process. The highly successful MAG-MATE product range applies fast Insulation Displacement Connection (IDC) technology to the termination of magnet wire. In contrast to more time-consuming processes, such as soldering or welding, MAG-MATE wire termination results in a repeatedly accurate, gas-t...

TE Connectivity (TE) launches new 1.95mm SIM card connectors to offer customers a connector solution that fits into various consumer devices such as cell phones and tablets with limited space for SIM cards.

TE Connectivity (TE) announces a new surface-mount LGA socket for AMD's new high-performance Opteron 6000 series server processor. The LGA 1944 socket is validated to the processor’s high speed/ high performance specification. TE is one of the few suppliers able to provide this kind of technology and products.

TE Circuit Protection announces that Barry Brents, Field Applications Engineer for TE Connectivity’s Circuit Protection business unit, has been named the Subject Matter Expert (SME) in the field of circuit protection for Power Systems Design (PSD) Online. The goal of the newly established department titled “Expert Exchange ” is to provide the magazine’s online community with further depth and technical expertise in specific areas of power...

TE Connectivity is pleased to announce the launch of the Corcom HZ Series of power line filters. With current ratings ranging from 3A up to 30A and with low leakage current, the series complies with strict medical industry standards.

To meet the requirements of next-generation WiMax and Long Term Evolution (LTE) Fiber To The Antenna (FTTA) connectivity designs for rugged outdoor use, TE Connectivity (TE) has released the FullAXS connector system that provides the SFP connection between the remote radio and base station for telecommunications applications.

TE Connectivity (TE) is pleased to announce the launch of a new low fire hazard, heat-shrinkable continuous identification tubing for industrial, rail & mass transit, aerospace & defense, as well as marine applications. HXCT continuous tubing is a flattened, heat-shrinkable tubing, providing superb print quality for crisp clear wire and cable harness identification.

The structured cabling technology supplied by the Enterprise Networks business unit of TE Connectivity can now be implemented as part of IBM's Enterprise Modular Data Centre (EMDC) solution.

TE Connectivity (TE) launches the second generation of PARALIGHT QSFP+ active optical cable assemblies to offer customers significant power and cost savings through fully integrated optical engines that use less power, are lower in cost and offer higher performance compared to its previous generation. The new product is also competitively-priced compared to its previous generation.

The new standard range of antennas offer low-profile, high-performance stamped metal, flexible printed circuits (FPC) and printed circuit boards (PCB) embedded antenna solutions for single through penta band applications. These antennas are designed and manufactured to comply with stringent operating requirements and allow a wireless designer to select from a broad range of antennas with the frequencies that meet the needs of most wireless produ...

Adding ESD Protection to HDMI, even at 3.4GHz, Just Became Easier

Tyco Electronics Ltd. received shareholder approval at yesterday's Annual General Meeting to change the company name to TE Connectivity Ltd. The name change is subject to Swiss regulatory approval, which the company expects to receive by March 25, 2011. The NYSE ticker symbol (TEL) will remain the same.

Tyco Electronics launches new highly-compact 40-Gbps QSFP+ optical transceivers -- parallel fiber optical modules with four independent optical transmit and receive channels for increased board density. This extension to TE’s QSFP product portfolio for the broad Ethernet and InfiniBand standards marketplace combines the high-density and low-power benefits of parallel modules with some of the key advantages normally associated with SFP+ based mo...

Tyco launched the solderless LED socket, Type LS, designed specifically for use with the new Philips Lumileds LUXEON S LED. Debuting at Strategies In Light 2011 in Santa Clara, California, the new product offers a solderless termination that complements this newly-released lighting-class LED by Philips Lumileds.

Tyco Electronics (TE) announced that Matthew Williams, Global Applications Engineering Manager for Tyco Electronics Circuit Protection business unit, will present at the Motor, Drive & Automation Systems Conference 2011 being held March 1-2 in San Antonio, Texas. During his presentation, “Coordinated Circuit Protection Solutions for Power Supplies, Relays, Solenoids and Controllers,” he will discuss how a coordinated strategy can help to impr...

The rapidly developing tablet, notebook and netbook PC markets are creating demand for high-performance interconnects with sufficient throughput to drive the latest display technology. With these requirements in mind, Tyco Electronics (TE) has introduced the next generation LCD Coaxial Embedded Display Interface (LCEDI) family of connectors, with which TE is able to provide a total solution for panel / main board interconnection.

Tyco Electronics (TE) unveiled three embedded magnetic product offerings from its recently acquired PlanarMag product technology – an embedded magnetic innovation that fully automates traditional hand-wound coiling processes. This new advancement enables economic and manufacturing scalability to provide faster manufacturing cycle times during periods of high demand and allows for consistent product lead time and supply.

Tyco Electronics (TE) has announced the expansion of its silicon ESD (electrostatic discharge) protection product portfolio with the introduction of 0201- and 0402-size devices that are easier to install and rework than traditional semiconductor-packaged ESD devices. The ChipSESD package combines the advantages of an active silicon device with a traditional Surface-Mount Technology (SMT) passive packaging configuration.