The SESD0201P1BN-0400-090 (0201 package) and SESD0402P1BN-0450-090 (0402 package) devices’ bi-directional operation facilitates placement on the printed circuit board (PCB) without orientation constraints and eliminates the need for polarity inspection. Unlike conventional ESD diode packaging using pads on the bottom of the device, the ChipSESD devices’ passive package also allows for easy solder inspection after the device has been mounted on the PCB.
The ChipSESD devices feature a surge rating of 2A under 8×20µs surge and an ESD rating of 10kV contact discharge. The devices’ low-leakage current (1.0µA max) reduces power consumption and a fast response time (<1ns) helps equipment to pass IEC61000-4-2, level 4 testing. Their input capacitance of 4.0pF (0201 package) and 4.5pF (0402 package) makes them suitable for helping to protect:
* Cellular phones and portable electronics
* Digital cameras and camcorders
* Computer I/O ports
* Keypads, low voltage DC lines, speakers, headphones and microphones
“The ongoing trend toward discrete component miniaturization often presents designers with difficult and time-consuming engineering prototyping and rework challenges as well as manufacturing process control issues,” stated Nicole Palma, Product Manager. “Tyco Electronics’ new ChipSESD devices help mitigate assembly and manufacturing challenges and speed time to market. They also demonstrate Tyco Electronics’ commitment to providing a broad portfolio of smaller scale, higher-performance SMT solutions for the consumer electronics industry.”